Sony XR-C5200 Manuale utente

MICROFILM

SERVICE MANUAL

FM/MW/SW CASSETTE CAR STEREO

E Model

Model Name Using Similar Mechanism XR-C5100

Tape Transport Mechanism Type MG-25F-136

SPECIFICATIONS

XR-C5200

– 2 –

TABLE OF CONTENTS

1. GENERAL

Location of Controls ....................................................... 3

Resetting the Unit ........................................................... 4

Detaching the Front Panel............................................... 4

Setting the Clock ............................................................. 4

Installation....................................................................... 5

Connections ..................................................................... 6

2. DISASSEMBLY ......................................................... 9

3. ASSEMBLY OF MECHANISM DECK........... 10

4. MECHANICAL ADJUSTMENTS....................... 13

5. ELECTRICAL ADJUSTMENTS

Test Mode ........................................................................ 13

Tape Deck Section .......................................................... 13

Tuner Section .................................................................. 14

6. DIAGRAMS

6-1. Note for Printed Wiring Boards and

Schematic Diagrams ....................................................... 17

6-2. Printed Wiring Board – MAIN Board – ......................... 19

6-3. Schematic Diagram – MAIN Board (1/2) – ................... 21

6-4. Schematic Diagram – MAIN Board (2/2) – ................... 23

6-5. Printed Wiring Board – KEY Board –........................... 25

6-6. Schematic Diagram – KEY Board – .............................. 27

6-7. IC Pin Function Description ........................................... 31

7. EXPLODED VIEWS................................................ 34

8. ELECTRICAL PARTS LIST ............................... 37

Flexible Circuit Board Repairing

• Keep the temperature of the soldering iron around 270 ˚C dur-

ing repairing.

• Do not touch the soldering iron on the same conductor of the

circuit board (within 3 times).

• Be careful not to apply force on the conductor when soldering

or unsoldering.

Notes on chip component replacement

• Never reuse a disconnected chip component.

• Notice that the minus side of a tantalum capacitor may be dam-

aged by heat.

– 3 –

SECTION 1

GENERAL This section is extracted from

instruction manual.

– 4 –

– 5 –

– 6 –

– 7 –

– 8 –

– 9 –

SUB PANEL, MECHANISM DECK (MG-25F-136)

MAIN BOARD, HEAT SINK

Note: Follow the disassembly procedure in the numerical order given.

SECTION 2

DISASSEMBLY

three screws

(PTT2.6

sub panel

connector

(CN351)

screw

(PTT2.6

mechanism dec

(MG-25F-136)

flexible flat cable

(CN301)

three screws

(PTT2.6

two ground point

screws

three screws

(PTT2.6

two screws

(PTT2.6

10)

screw

(PTT2.6

two screws

(PTT2.6

heat sink

rubber cap (25)

two screws

(PTT2.6

main board

– 10 –

SECTION 3

ASSEMBLY OF MECHANISM DECK

HOUSING

ARM (SUCTION)

Note: Follow the assembly procedure in the numerical order given.

part

Hold the hanger by

bending the claw.

Fit projection on

part.

Fit claw on

part.

Put the housing

under

part.

Fit projection on

part.

Install the catch to the hanger.

Install the hanger onto

two claws of the housing.

Holder the hanger by bending the claw.

hanger

housing

Move the arm (suction) in the arro

direction and fit on projection.

Fit the arm (suction) on the shaft.

projection

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