Sony SWF-BR100 Manuale utente
SERVICE MANUAL
Sony Corporation
Published by Sony Techno Create Corporation
SWF-BR100
WIRELESS SUBWOOFER
9-893-941-02
2014D33-1
© 2014.04
US Model
Canadian Model
AEP Model
UK Model
Australian Model
Chinese Model
Mexican Model
Chilean Model
New Zealand Model
Hong Kong Model
Taiwan Model
Ver. 1.1 2014.04
• All of the units included in the SWF-BR100 (wire-
less transceiver: UWT-BR100, Audio cable), and
the TV corresponding to SWF-BR100 are required
to confirming operation of SWF-BR100.
Check in advance that you have all of the units.
Refer to the operating instructions of the SWF-
BR100 or operating instructions of the TV corre-
sponding to SWF-BR100 for the operation method.
SPECIFICATIONS
Wireless Subwoofer
(SWF-BR100)
Amplier section
For U.S.A model:
(FTC)
With 4 ohms load, subwoofer
channel driven, from 30 - 150 Hz;
rated 45 W per channel minimum
RMS power, with no more than 1%
total harmonic distortion from 250
milliwatts to rated output.
POWER OUTPUT (reference)
100 W (per channel at 4 ohms,
100 Hz)
For except US model:
POWER OUTPUT (rated)
70 W (4 ohms, 100 Hz, 1% THD)
(Except Chinese model)
70 W (4 ohms, 100 Hz)
(Chinese model)
POWER OUTPUT (reference)
100 W (4 ohms, 100 Hz)
(Except Chinese model)
Speaker System
Subwoofer, sealed enclosure
Speaker Unit
200 mm cone type
Rated impedance
4 ohms
Power requirements
120 V AC, 60 Hz
(US, Canadian and Mexican models)
220V - 240V AC, 50/60 Hz
(UK and Hong Kong models)
240V AC, 50/60 Hz
(Australian and New Zealand models)
220V AC, 50/60 Hz (Chinese model)
110V AC, 50/60 Hz (Taiwan model)
120V - 240V AC, 50/60 Hz (other models)
Power consumption
On: 30W
Standby mode: 0.5W or less
Dimensions (approx.) (w/h/d)
272 mm x 306 mm x 395 mm
10 3/4 in x 12 1/8 in x 15 5/8 in
Mass (approx.)
12.2kg
26 lb 14 3/10 oz
Wireless Transceiver
(UWT-BR100)
Communication system
Wireless Sound Specication
version 3.0
Frequency band
5GHz band
(5.180/5.200/5.210/5.240GHz,
5.736/5.762/5.814GHz)
The frequency bands to use are
dierent by country.
Modulation method
DSSS
Power requirement
5V DC
Power consumption
500 mA
Dimensions (approx.)
19 mm x 27 mm x 91 mm
3/4 in x 1 1/8 in x 3 5/8 in
(w/h/d)
Mass (approx.)
25g
7/8oz
Supplied accessories
Audio cable (1)
Design and specications are
subject to change without notice.
SWF-BR100
2
NOTES ON CHIP COMPONENT REPLACEMENT
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
SAFETY CHECK-OUT
After correcting the original service problem, perform the follow-
ing safety check before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs,
screws, and all other exposed metal parts for AC leakage.
Check leakage as described below.
LEAKAGE TEST
The AC leakage from any exposed metal part to earth ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microamperes.).
Leakage current can be measured by any one of three methods.
1. A commercial leakage tester, such as the Simpson 229 or RCA
WT-540A. Follow the manufacturers’ instructions to use these
instruments.
2. A battery-operated AC milliammeter. The Data Precision 245
digital multimeter is suitable for this job.
3. Measuring the voltage drop across a resistor by means of a
VOM or battery-operated AC voltmeter. The “limit” indication
is 0.75 V, so analog meters must have an accurate low-voltage
scale. The Simpson 250 and Sanwa SH-63Trd are examples
of a passive VOM that is suitable. Nearly all battery operated
digital multimeters that have a 2 V AC range are suitable. (See
Fig. A)
1.5 kΩ0.15 μF
AC
voltmeter
(0.75 V)
To Exposed Metal
Parts on Set
Earth Ground
Fig. A. Using an AC voltmeter to check AC leakage.
SAFETY-RELATED COMPONENT WARNING!
COMPONENTS IDENTIFIED BY MARK 0OR DOTTED LINE
WITH MARK 0ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 0SUR
LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES
PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONC-
TIONNEMENT. NE REMPLACER CES COMPOSANTS QUE
PAR DES PIÈCES SONY DONT LES NUMÉROS SONT DON-
NÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS
PUBLIÉS PAR SONY.
1. SERVICING NOTES ............................................. 3
2. DISASSEMBLY
2-1. Disassembly Flow........................................................... 5
2-2. Panel (Cover) .................................................................. 5
2-3. Bottom Plate Block......................................................... 6
2-4. Loudspeaker (20 cm) (SP100) ........................................ 7
2-5. AMP Block ..................................................................... 8
2-6. How to Install the AMP Block........................................ 9
2-7. LED Board...................................................................... 10
2-8. Fuse (H.B.C.) (F900) ...................................................... 11
2-9. RF Modulator (RF100) ................................................... 12
2-10. MAIN Board ................................................................... 13
2-11. Power Cord (AC1) .......................................................... 13
2-12. POWER Board................................................................ 13
3. DIAGRAMS
3-1. Block Diagram................................................................ 14
3-2. Printed Wiring Board - LED Board -.............................. 15
3-3. Schematic Diagram - LED Board -................................. 15
3-4. Printed Wiring Board - MAIN Board (Side A) - ............ 16
3-5. Printed Wiring Board - MAIN Board (Side B) - ............ 17
3-6. Schematic Diagram - MAIN Board (1/2) -..................... 18
3-7. Schematic Diagram - MAIN Board (2/2) -..................... 19
3-8. Printed Wiring Board - POWER Board -........................ 20
3-9. Schematic Diagram - POWER Board - .......................... 21
4. EXPLODED VIEWS
4-1. Bottom Section ............................................................... 28
4-2. Panel Section................................................................... 29
4-3. Module Section ............................................................... 30
4-4. Board Section.................................................................. 31
5. ELECTRICAL PARTS LIST .............................. 32
Accessories are given in the last of the electrical parts list.
TABLE OF CONTENTS
SWF-BR100
3
SECTION 1
SERVICING NOTES
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
ADVANCE PREPARATION WHEN CONFIRMING OP-
ERATION
All of the units included in the SWF-BR100 (wireless transceiver:
UWT-BR100, Audio cable), and the TV corresponding to SWF-
BR100 are required to confirming operation of SWF-BR100.
Check in advance that you have all of the units.
Refer to the operating instructions of the SWF-BR100 or operat-
ing instructions of the TV corresponding to SWF-BR100 for the
operation method.
NOTE OF PERFORMING THE OPERATION CHECK IN
THE STATE THAT HEAT SINK WAS REMOVED
When performing the operation check in the state that this unit was
disassembled, it is possible to perform the operation check in the
state that heat sink was removed. But don’t perform the operation
check in the long time, and perform the operation check in the
volume state as low as possible.
NOTE OF REPLACING THE IC104 ON THE MAIN
BOARD AND THE COMPLETE MAIN BOARD
When IC104 on the MAIN board and the complete MAIN board
are replaced, it is necessary to spread the compound (G747) be-
tween the MAIN board and the heat sink.
Spread the compound (G747) referring to the figure below.
– MAIN Board (Side A) –
IC104
compound (G747)
CAPACITOR ELECTRICAL DISCHARGE PROCESSING
When checking the board, for the electric shock prevention, con-
nect the resistors to both ends of respective capacitor (C936) to
discharge the capacitor (C936).
C936
– POWER Board (Conductor Side) –
800 :/2 W
SWF-BR100
4
MODEL IDENTIFICATION
Distinguish by model number label stuck on the rear side of a main unit.
Note: The printed contents of following figure model number label may be different from the model number label of a main unit.
Part No. Destination
4-530-052-0[] UC2 US, Canadian models (White only)
4-530-053-0[] UCM US, Canadian and Mexican models (for White)
4-530-054-0[] GE3 AEP and Chilean models (White only)
4-530-056-0[] AZ1 Australian and New Zealand models
4-530-057-0[] GE2 UK and Hong Kong models
4-530-059-0[] CN8 Chinese model
4-530-060-0[] TW6 Taiwan model
4-535-821-0[] UCM US, Canadian and Mexican models (for Black)
4-542-391-0[] GE3 AEP, Russian and Chilean models (for White)
4-542-392-0[] GE3 AEP, Russian and Chilean models (for Black)
– Rear view –
MODEL NUMBER LABEL
Part No.
Ver. 1.1
SWF-BR100
5
SECTION 2
DISASSEMBLY
• This set can be disassembled in the order shown below.
2-1. DISASSEMBLY FLOW
Note: Follow the disassembly procedure in the numerical order given.
2-2. PANEL (COVER)
SET
2-2. PANEL (COVER)
(Page 5)
2-5. AMP BLOCK
(Page 8)
2-6. HOW TO INSTALL THE AMP BLOCK
(Page 9)
2-3. BOTTOM PLATE BLOCK
(Page 6)
2-4. LOUDSPEAKER (20 cm) (SP100)
(Page 7)
2-7. LED BOARD
(Page 10)
2-8. FUSE (H.B.C.) (F900)
(Page 11)
2-9. RF MODULATOR (RF100)
(Page 12)
2-11. POWER CORD (AC1)
(Page 13)
2-10. MAIN BOARD
(Page 13)
2-12. POWER BOARD
(Page 13)
• JIG
When disassembling the unit, use the following jig (for speaker
removal).
Part No. Description
J-2501-238-A JIG FOR SPEAKER REMOVAL
1three screws
(BVTP3 u8) 1three screws
(BVTP3 u8)
hole
hole
boss
boss
– bottom view –
Note 2: Please spread a sheet under a unit
not to injure top panel.
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slotpower cord (AC1)
2panel (cover)
Note 1: When installing the panel (cover),
align two bosses and two holes.
SWF-BR100
6
2-3. BOTTOM PLATE BLOCK
2two screws
(BVTP4 u20)
2two screws
(BVTP4 u20)
2two screws
(BVTP4 u20)
3two bosses
3boss
1two cushions (foot)
1two cushions (foot)
3boss
hole
hole
two holes
– bottom view – Note 2: Please spread a sheet under a unit
not to injure top panel.
6bottom plate block
Note 1: When installing the bottom plate block,
align four bosses and four holes.
4Draw out the power cord from
hole of bottom plate block.
5bushing (XL)
Note 3: Before beginning assembly,
if the bushings (XL) have been
removed from the bottom plate,
be sure to reattach the bushings
(XL) to the bottom plate.
5bushing (XL)
Note 3: Before beginning assembly,
if the bushings (XL) have been
removed from the bottom plate,
be sure to reattach the bushings
(XL) to the bottom plate.
SWF-BR100
7
2-4. LOUDSPEAKER (20 cm) (SP100)
1eight screws
(BVTP4 u20)
4loudspeaker (20 cm)
(SP100)
3terminal
(narrow side)
3terminal
(wide side)
2Remove the loudspeaker (20 cm) (SP100)
in the direction of the arrow.
– bottom view –
Note: Please spread a sheet under a unit
not to injure top panel.
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loudspeaker (20 cm)
(SP100)
terminal position
SWF-BR100
8
2-5. AMP BLOCK
:LUHVHWWLQJ
Fold the cushion.
1cushion
2connector
(CN106)
3Remove the AMP block in
the direction of the arrow.
4connector
(CN105)
–ERWWRPYLHZ–
Note 2: Please spread a sheet under a unit
not to injure top panel.
5AMP block
Note 1: When installing the AMP block, refer to
“ 2-6. HOW TO INSTALL THE AMP BLOCK ”
on page 9.
SWF-BR100
9
2-6. HOW TO INSTALL THE AMP BLOCK
Note 4: Follow the assembly procedure in the numerical order given.
4
1connector (CN105)
AMP block
AMP block
AMP block
speaker
cabinet
bushing (XL)
bushing (XL)
– bottom view –
Note 1: Please spread a sheet under a unit
not to injure top panel.
2Pull the wire from the LED
board out the rear side.
– sectional view –
3Pull the speaker cable
toward the speaker.
speaker
cable
Note 2: While using your finger to hold the speaker cable
so that it does not get pushed under the amp block,
insert the amp block.
Note 3: When installing the amp block, be careful not crush
the bushings (XL) in the speaker cabinet with
the shafts.
shaft
shaft
CN106
5Insert the wire from the LED board into CN106.
SWF-BR100
10
2-7. LED BOARD
1Insert the jig into the space and slowly
remove the panel (back) block.
Note 1: When using a jig, please work
so as not to injure panel (back)
block and speaker cabinet.
2 All bosses are removed while moving
jig in the direction of the arrow, and
panel (back) block is removed.
2 All bosses are removed while moving
jig in the direction of the arrow, and
panel (back) block is removed.
4 two screws
(BVTP 2.6)
6 connector (CN801)
7 LED board
5 panel (back) block
– bottom view –
total six bosses
1Insert the jig into the space and slowly
remove the panel (back) block.
Note 1: When using a jig, please work
so as not to injure panel (back)
block and speaker cabinet.
Note 2: Please spread a sheet under a unit
not to injure top panel.
3Draw out the wire from
hole of speaker cabinet.
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3
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