Confidential Version1.0
Released Date: 2008.03.31
4
太欣半導體股份有限公司
SYNTEK Semiconductor Co., Ltd.
STA-UI-A0035
User’s Manual
1. Introduction
The SYNTEK STA-UI-A0035 product provides the highest level of integration
and most aggressive BOM cost by integrating IEEE 802.11b/g and Bluetooth v2.0 +
EDR into a single MAC/Baseband chip utilizing a single 2.4GHz transceiver.
Integrated on-chip power amplifier and LNA reduce external component count,
while still able to deliver ample transmit power for most applications.
Different from any other wireless LAN and Bluetooth chip set vendor, SYNTEK and
3DSP uses its patented Software Radio technology to implement both wireless LAN
and Bluetooth in software. The highly optimized software radio DSP technology
enables STA-UI-A0035 to integrate class 1 Bluetooth v2.0 + EDR function
without any added cost to the total solution. No extra antenna, PA, RF transceiver,
resistor, capacitor, crystal or any components are needed. The software solution
even guarantees the Bluetooth RF performance if the wireless LAN performance is
tested to be good. It eliminates the need for system manufacturers to separately
test the module’s Bluetooth RF performance, therefore reduce the testing time and
cost.
The STA-UI-A0035 utilizes 3DSP’s patent pending technologies to fundamentally
solve the interference and performance issues existed during 802.11b/g and
Bluetooth coexistence, thus improving both 802.11b/g and Bluetooth performance
and link stability in real environment. As a result, it enhances user experience in a
totally wireless environment, where all devices are connected wirelessly through
either Bluetooth link or 802.11b/g link.
The single installation package allows for easy setup and configuration of both
802.11b/g and Bluetooth devices. Combined user interface is intuitive to use. Once
configured, both wireless links operate transparently in the background.
