Tandy PC-6 Manuale utente

Page 1 of 27

Toshiba America Information Systems, Inc. and Apple Inc. Exhibit 1012

Page 2 of 27

CONTENTS

SPECIFICATIONS

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How

Open

Upper

Case

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THEORY

OPERATION

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Block

Diagram

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Interrupt

Circuit

Keyboard

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Power

Supply

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LSI

(Pin

Functions)

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DISPLAY

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TROUBLESHOOTING

GUIDE

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Test

Programs

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Operation

Check

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PCB

ASSEMBLY

VIEWS

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PARTS

LIST

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Electrical

Parts

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Mechanical

Parts

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EXPLODED

VIEW/DISASSEMBLY

INSTRUCTIONS

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SCHEMATIC

DIAGRAM

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Main

I3lock

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Page 3 of 27

Display

Method

Display

Calculation

Range

Program

System

Program

Language

Number

Variables

RAM

Capacity

Program

Areas

Number

Stacks

Subroutine

FOR

LOOP

Operators

Power

Supply

Power

Consumption

Battery

Life

Memory

protection

battery

Auto

Power-off

Ambient

Temperature

Dimensions

Weight

SPECIFICATIONS

5 x 7

dot-matrix

crystal

24digit,

dot-matrix

liquid-crystal

display

i10'99

:t9.999999999

10”

Stored

System

BASIC

fixed

variables,

exclusive

character

variable

and

array

variables

7520

bytes

(system

area:

672

bytes)

Maximum

(P0

through

P9)

levels

lithium

batteries

(CR-2032)

for

main

frame

lithium

battery

(CR-1220)

for

memory

backup

Maximum

0.07W

Continuous

program

execution:

approximately

hours

Continuous

display

5555555555

68°F

(20°C):

approximately

200

hours

5.5

months

when

unit

used

hour

per

day

NOTE:

hour

includes

minutes

condition

and

minutes

con-

dition

Approximately

years

(with

main

batteries

installed)

Approximately

minutes

32°

104°

(0°C

40°

3/4"H

5-5/8"W

2-3/4"D

(18

142

mm)

5.8

(165

g),

including

batteries

How

Open

Upper

Case

Tweezers

Insert

the

tweezers

into

the

back

the

upper

case.

Move

tweezers

gently

the

direction

indicated

the

arrow

the

figure

below.

Page 4 of 27

THEORY

OPERATION

Block

Diagram

DOT—MATR|X

DISPLAY

5 x

dots,

digits

a7’\za12,

d7’\zd12

a1r\,a5,

d1r\,d5

b7'\zb12,

e7’\ze12

b1r\,b6,

314,55

c7~c12,

RONR14

c1’\zc6,

R0'\zR14

RAM

IC3

Ks2’\uKs10

'<mW'<m12

KEYBOARD KEYBOARD

HM6264ALFP

ADO-AD12

CS3-CS6

I00-I07

26-3671

26-3651

26-3652 26-3652

NOTE:

Only

one

options

can

connected

time.

Page 5 of 27

LSI

Main

CPU

HD61747B20

BASIC

control,

Key

signal

input/output

(lower

keyboard),

1st

6th

digits

and

13th

18th

digits

display

control.

Sub

CPU

HD61747B25

Calculation,

I/O

control,

key

signal

input/output

(upper

keyboard),

7th

12th

digits

and

19th

24th

digits

display

control.

Gate

Array

MB64H193

Interface

between

CPU

and

RAM,

buzzer

control.

RAM

HM6264ALFP-50‘

Stores

data

and

program.

RAM

has

bytes

(64K

bits)

capacity

and

contains

self-control

circuit.

LSI

ROM

CPU

(Main)

D61747

B20

CPU

(Sub)

D61

747

B25

RAM

HM6264ALFP-50

113024

bits

1896

bits

113024

bits

1896

hits

65536

bits

226056

bits

69328

bits

Input

Buffer

Code

Buffer

—

Users

Area

P3T

P7T

Communication

Buffer

GOSUB

STACK

DISP

Buffer

—

¥.:'i:;

FOR

Page 6 of 27

Buzzer

Control

Circuit

There

are

ways

operate

the

buzzer:

Key

input,

BEEP

and

BEEP

Mode

BEEP

BEEP1

Key

Input

Frequency

0.9

kHz

4.55

kHz

4.55

kHz

Time

110

msec.

110

msec.

MBMH193

Interrupt

Circuit

interrupt

circuit

for

the

clock

pulse

when

VDD2

drops.

When

the

power

on,

VDD2

"L"

level.

PG2

through

the

and

26th

the

CPU

receive

PG2.

When

VDD2

drops,

the

output

the

becomes

“GND”

level

and

the

CPU

does

not

receive

PG2.

PG1

HD61747B25

Interrupt

circuit

for

the

voltage

the

Gate

Array

and

options

when

VDD2

and

drop.

When

the

power

on,

VDD2

and

"L”

level.

VDD2

for

Gate

Array

and

VDD4

also

"L"

level.

When

VDD2

drops,

VDD2

for

Gate

Array

and

VDD4

becomes

”GND"

level

and

stops

the

op-

ration

the

RAM

and

options.

VDD2(from

—

VDD4

VDD2(from

HD61747B25

controls

the

upper

keyboard.

K52

‘

HD61747B2

K53“’K‘°’8

K59,

K510

HD61747B20

controls

the

lower

keyboard.

Keyboard

HD61747B2

K"‘5“’K””°

Km11,

Km12

Page 7 of 27

Power

Supply

VSS1

Power

supply

voltage

for

TC4071

BF.

VRAM

Memory

used

keep

the

voltage

for

the

RAM.

V1~V5

LCD

drive

voltages.

Voltage

generated

connecting

the

external

resistor

VDD2.

VDD1

Power

supply

for

the

CPU,

RAM

and

options.

VDD2

Stays

VDD1

power—on.

Goes

GND

power-off

APO

(auto

power—off).

Page 8 of 27

LSI

(Pin

Functions)

IC1,

HD61747B2O

lC2,

HD61747B25

o°ol3r°3'R$§§"§§KE$°m‘3‘cB%$

E’

-[Q

_ 53

20 _

l\)|\)

4300

0.0

0101

-54>

IC4,

MB64H193

1N4

Signal

Name

D1,

INT

KM’\zK1

V5’\;V1

PG2,

PG1

R15’\IFl7

GND

CE2

CE1

VDD1

VDD2

Signal

Name

Function

Data

in/out

(D1,

D2, D3,

D4)

Interrupt

signal

from

RAM

Key

signal

for

keyboard

Switch

signal.

GND

switch

"OFF”

and

VDD1

switch

MON!!-

Display

voltage.

Divided

vol-

tage

from

VDD1.

CPU

internal

clock

Display

signal

GND

Chip

designating

signal.

Select

RAM

other

devices

Select

RAM

other

devices

Power

source

VDD1

output

from

the

LSI.

VDD1

switch

"ON”

and

GND

switch

”OFF".

Clock

pulse

Operation

signal

Function

I00,

I06

ADO

I07

AD1

VSS

AD2,

10,

AD4’vAD12

VDD

CS6’\ICS3

CS2’\uCSO

B1,

VSS

Data

in/out

Address

signal

Data

in/out

Address

signal

Power

source

Address

signal

Output

enable

Address

signal

G ND

Read/write

signal

Chip

enable

signal

Buzzer

signal

VSS

N D

Data

in/out

Operation

signal

Clock

pulse

Power

source

Chip

enable

N D

Data

in/out

Page 9 of 27

lC3,

HM6264ALFB-50

Signal

Name

Function

NC NC

A12'\:AO

Address

signal

I/O1’\z|/O3

Data

signal

GND

VSS

terminal

I/O4’\zl/08

Data

signal

CE1

Chip

enable

A10

Address

signal

Output

enable

A11,

Address

signal

CE2

GND

R/W

‘

Read/write

signal

vpp

GND

DISPLAY

Numbers

and

characters

are

displayed

dots.

Following

explanation

dot—matrix

LCD.

“_’.

000-3

E—0000000

“_’.

DDD-3

Lower

electrode

Lower

electrode

‘°1J

la:

0000000-

;—0000000

0000000——

-—0000000

0000000

0000000-

0000

0000000—2

0000000-

;—0000000

0000000—2

_—0000000

0000000

0000

0000000——

g—0000000

0000000-

0000000

g—0000000

DT?

0000000-

tone

Upper

electrode

Upper

electrode

13.1.’

1131113

glsl

UCIUUDDD

CIDUDUUD

DCICIDUDU

DUCIUCIDCI

DDCICIDUU

DDDEICIUU

DDDDDUD

U‘-'UCl0ClClDD

UDUUCIDCI

CIDUCIDUU

CIUDUDUU DDCIDDUU

CIDUUUDD

CIUDCJCIUD

DDDDCIDCI

UDUDDUD

iii”

Left-half

digits

Right-half

digits

the

upper

electrode

the

LCD,

common

signals

RON

and

R8~

R14

are

applied

horizontally

while

other

signals

a1'\»e1

a12'\:e12

are

applied

I II

Egg?!-1+3?

vertically

the

lower

electrodes

shown

above

figures.

I&I¢I*I

the

left

figure,

the

upper—right

corner

the

dot

displayed

when

vol-

tage

difference

exists

between

signals

and

a1.

The

CPU

outputs

the

dis-

play

signals

the

LCD

display.

CPU

HD61747B20

controls

the

1st

6th

and

13th

18th

digits

dis-

play,

while

HD61747B25

controls

the

7th

12th

and

19th

24th

digits.

Page 10 of 27

TROUBLESHOOTING

GUIDE

Symptom

Cause

Solution

display

all.

Weak

batteris

Replace

the

batteries.

Poor

battery

contact

Clean

the

battery

and

contact

spring.

Lift

the

battery

spring.

Peeled

heat

seal

Replace

the

heat

seal.

Broken

heat

seal

Replace

the

heat

seal.

LCD

(CA51-TS)

Replace

the

LCD.

LSI

(HD61747B)

Replace

the

LSI.

certain

segment(s)

Peeled

heat

seal

Replace

the

heat

seal.

cannot

displayed.

Broken

heat

seal

Replace

the

heat

seal.

LCD

(CA51-TS)

Replace

the

LCD.

LSI

(HD61747B)

Replace

the

LSI.

Calculation

impossible.

LSI

(HD61747B)

Replace

the

LSI.

certain

button

does

not

Poor

key

contact

Celan

the

contact

pad

the

PCB

and

the

function.

key

contact

rubber.

Broken

line

Connect

the

line.

Peeled

heat

seal

Replace

the

heat

seal.

LSI

(HD61747B)

Replace

the

LSI.

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