TechNexion TEP1560 Series Manuale utente

TEP-1560-BSW MODULAR HMI PRODUCT MANUAL

(TEP-1560-BSW)

VER. 1.00

March 25, 2019

TEP-1560-BSW HARDWARE MANUAL –VER 1.00 MAR 25 2019

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REVISION HISTORY

Revision

Date

Originator

Notes

1.00

March 25, 2019

TechNexion

First public release

TEP-1560-BSW HARDWARE MANUAL –VER 1.00 MAR 25 2019 
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TABLE OF CONTENTS 
 
Introduction ...............................................................................................................................................5 
1. General Care and Maintenance .........................................................................................................5 
TEP-1560-BSW Product Overview...........................................................................................................6 
1. Functional Block Diagram ..................................................................................................................6 
2. Dimensions.........................................................................................................................................7 
3. Device Cut-out Dimensions For Mounting Though a Panel...............................................................8 
4. External Connectors...........................................................................................................................9 
5. Internal Board Connectors ...............................................................................................................10 
5.1. Galvanic Isolated (TEP1560-xxxxx-Rxx-Lxxx-XG21- xxxx-xxx-xxxx-xxxx)...............................10 
5.2. Non-Galvanic Isolated (TEP1010-xxxxx-Rxx-Lxxx-XS21-xxxx-xxx-xxxx-xxxx) ........................11 
External Connectors................................................................................................................................12 
1. LED Light Indicator...........................................................................................................................12 
2. Micro-SIM Connector........................................................................................................................12 
3. MicroSD Connector..........................................................................................................................12 
4. USB OTG (Type-C) Connector ........................................................................................................13 
5. Gigabit Ethernet Interface (LAN1/LAN2)..........................................................................................13 
6. USB 2.0 Host Connectors ................................................................................................................13 
7. USB 3.0 Host Connectors ................................................................................................................14 
8. miniDP (Mini DisplayPort) Connector...............................................................................................14 
9. HDMI (High Definition Multi-Media Interface) Connector.................................................................14 
10. Audio Connectors...........................................................................................................................14 
11. RST Button.....................................................................................................................................14 
12. PWR Button....................................................................................................................................14 
13. Power Input Connector...................................................................................................................15 
14. Antenna Holes................................................................................................................................15 
15. Galvanic Isolated Connectors (TEP1560-xxxxx-Rxx-Lxxx-XG21-xxxx-xxx-xxxx-xxxx) (optional).15 
15.1. Galvanic Isolated Digital I/O Connectors (GPIO1/GPIO2) (optional) ......................................16 
15.2. Galvanic Isolated Serial Port (RS-XXX) (optional) ..................................................................17 
16. Non-Galvanic Isolated Connectors (TEP1560-xxxxx-Rxx-Lxxx-XS21- xxxx-xxx-xxxx-xxxx) 
(optional)..................................................................................................................................................18 
16.1. Non-Galvanic Isolated Digital I/O Connectors (GPIO1/GPIO2) (optional) ..............................19 
16.2. Non-Galvanic Isolated Serial Port (RS-XXX) (optional)...........................................................20 
Internal Connectors and Expansion Options ..........................................................................................21 
1. M.2 KEY-B Slots...............................................................................................................................21 
2. SATA 3.0 and SATA Power Connectors..........................................................................................21 
3. RTC Battery Connector....................................................................................................................22 

TEP-1560-BSW HARDWARE MANUAL –VER 1.00 MAR 25 2019 
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4. M.2 KEY-E Slot.................................................................................................................................22 
5. CMOS Jumper..................................................................................................................................22 
6. SO-DIMM DDR3L Slot......................................................................................................................22 
7. Internal Stereo Speaker Connectors................................................................................................23 
BIOS Setup .............................................................................................................................................24 
1. Entering and Exiting BIOS................................................................................................................24 
2. BIOS Setup Screens Overview ........................................................................................................24 
2.1. Main ...........................................................................................................................................25 
2.2. Chipset.......................................................................................................................................26 
2.3. Advanced...................................................................................................................................27 
2.4. Boot............................................................................................................................................30 
2.5. Security......................................................................................................................................31 
2.6. Save & Exit ................................................................................................................................32 
Mounting..................................................................................................................................................33 
1. VESA Mounting................................................................................................................................33 
2. Rear Mounting and Mounting Clips Installation................................................................................34 
3. Surface Mounting .............................................................................................................................35 
Ordering Information...............................................................................................................................36 
1. Custom Part Number Rule ...............................................................................................................36 
2. Standard Package Contents ............................................................................................................37 
Important Notice......................................................................................................................................38 
Disclaimer ...............................................................................................................................................39 
 

TEP-1560-BSW HARDWARE MANUAL –VER 1.00 MAR 25 2019

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1. Introduction

1.1. General Care and Maintenance

Your device is a product of superior design and craftsmanship and should be treated with care.

The following suggestions will help you.

•Keep the device dry. Precipitation, humidity, and all types of liquids or moisture can contain

minerals that will corrode electronic circuits. If your device does get wet, allow it to dry completely.

•Do not use or store the device in dusty or dirty areas. Its parts and electronic components can be

damaged.

•Do not store the device in hot areas. High temperatures can shorten the life of electronic devices,

damage batteries, and warp or melt certain plastics.

•Do not store the device in cold areas. When the device returns to its normal temperature,

moisture can form inside the device and damage electronic circuit boards.

•Do not open the device while power is on. Otherwise electrical shock may result.

•Do not drop, knock, or shake the device. Rough handling can break internal circuit boards and

fine mechanics.

•Do not use harsh chemicals, cleaning solvents, or strong detergents to clean the device.

•Do not paint the device. Paint can clog the parts and prevent proper operation.

•Unauthorized modifications or attachments could damage the device and may violate regulations

governing radio devices.

These suggestions apply equally to your device, battery, charger, or any enhancement. If any device is

not working properly, take it to the nearest authorized service facility for service.

Regulatory information

Disposal of Waste Equipment by Users in Private Household in the European Union

This symbol on the product or on its packaging indicates that this product must not be

disposed of with your other household waste. Instead, it is your responsibility to dispose

of your waste equipment by handing it over to a designated collection point for the

recycling of waste electrical and electronic equipment. The separate collection and

recycling of your waste equipment at the time of disposal will help to conserve natural

resources and ensure that it is recycled in a manner that protects human health and the

environment. For more information about where you can drop off your waste equipment

for recycling, please contact your local city office, your household waste disposal service or the shop

where you purchased the product.

We hereby declare that the product is in compliance with the essential requirements and

other relevant provisions of European Directive 2014/53/EU (Directive on the

harmonisation of the laws of the Member States relating to the making available on the

market of radio equipment and repealing Directive 1999/5/EC).

TEP-1560-BSW HARDWARE MANUAL –VER 1.00 MAR 25 2019

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2. TEP-1560-BSW Product Overview

2.1. Functional Block Diagram

TEP-1560-BSW HARDWARE MANUAL –VER 1.00 MAR 25 2019

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2.2. Dimensions

The following figure shows the TEP-1560-BSW dimensions (unit: mm):

TEP-1560-BSW HARDWARE MANUAL –VER 1.00 MAR 25 2019

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2.3. Device Cut-out Dimensions For Mounting Though a Panel

The TEP-1560-BSW can be mounted on the front or the back of the panel. In order to mount it from the

front, a nominal rectangular cutout must be made in the panel. The following drawing shows the

dimensions of the cut-out area (unit: mm):

TEP-1560-BSW HARDWARE MANUAL –VER 1.00 MAR 25 2019

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2.4. External Connectors

The TEP-1560-BSW has a number of external connectors.

Bottom view:

1 245 6 8 10 11 12 14 15 16

3 7 9 13

17 18 19 20 21

External Connectors:

No.

Description

No.

Description

LED Light indicator

3.5mm jack Line out

Micro-SIM cardslot

3.5mm jack Line in

MicroSD cardslot

3.5mm jack Mic in

USB OTG (Type-C) connector

Reset button

LAN2 RJ45 connector

Power button

USB 2.0 Host connector

Power Input connector

USB 2.0 Host connector

LAN1 RJ45 connector (PoE)

USB 3.0 Host connector

GPIO1 connector (optional)

USB 3.0 Host connector

GPIO2 connector (optional)

miniDP connector

RS-XXX (Serial Port) connector (optional)

HDMI connector

TEP-1560-BSW HARDWARE MANUAL –VER 1.00 MAR 25 2019

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2.5. Internal Board Connectors

The TEP-1560-BSW has several connectors, switches and internal expansion options.

2.5.1. Galvanic Isolated (TEP1560-xxxxx-Rxx-Lxxx-XG21- xxxx-xxx-xxxx-xxxx)

Rear view (opened device) with the galvanic isolated I/0 Expansion module:

Power I/O Expansion

Module A H Module

C D

E F G

Internal Connectors and Switches:

No.

Description

No.

Description

M.2 KEY-B slot (SATA + USB 2.0)

RTC Battery connector

M.2 KEY-B slot (USB 2.0)

M.2 KEY-E slot (PCIe + USB 2.0)

SATA Power connector

SO-DIMM DDR3L slot

CMOS jumper

Internal R speaker connector

SATA 3.0 connector

Internal L speaker connector

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