TESSERA Stick LIN-78K0 Manuale utente

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Stick LIN-78K0
Hardware Manual
2008/6 The 2nd edition
TESSERA TECHNOLOGY INC.

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[NOTES]
The information in this document is subject to change without notice. No part of this
document may be copied or reproduced in any form or by any means without the
prior written consent of TESSERA TECHNOLOGY INC..
TESSERA TECHNOLOGY INC.. assumes no liability for infringement of patents or
copyrights of third parties by or arising from use of a product described herein.
This product is designed and manufactured with intention for use in evaluation and
prototyping by engineers with knowledge of security, safety and reliability.
TESSERA TECHNOLOGY INC.. would like to inform, that the standard quality
assurance procedure(s) have not been fully applied to this product and its
documentation and that TESSERA TECHNOLOGY INC.. cannot assure the full
and error free function and/or the standard quality level.
[CAUTION]
This equipment should be handled like a CMOS semiconductor device. The user
must take all precautions to avoid build-up of static electricity while working with
this equipment. All test and measurement tool including the workbench must be
grounded. The user/operator must be grounded using the wrist strap. The
connectors and/or device pins should not be touched with bare hands.

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Contents
1Introduction.............................................................................................................................4
1.1 Features......................................................................................................................... 4
1.2 Hardware Overview........................................................................................................ 4
1.3 Attached goods list......................................................................................................... 5
1.4 Block Diagram................................................................................................................ 5
2Interface Connection..............................................................................................................6
2.1 J1.................................................................................................................................... 6
3Switches and LEDs ................................................................................................................7
3.1 SW1: Debug switch........................................................................................................ 7
3.2 SW2: writer switch.......................................................................................................... 7
3.3 LED1 .............................................................................................................................. 8
3.4 LED2: Power Indication.................................................................................................. 8
3.5 LED3 .............................................................................................................................. 9
4Power Source........................................................................................................................10
5Design Data........................................................................................................................... 11
5.1 Parts Layout..................................................................................................................11
5.2 Circuit Schematics ....................................................................................................... 12
5.3 Body Dimensions......................................................................................................... 14
5.4 Board dimensions ........................................................................................................ 15
5.5 PCB Layout.................................................................................................................. 16
5.5.1 Silk of the top side.....................................................................................................16
5.5.2 Silk of the bottom side...............................................................................................17
5.5.3 PCB Layout: The first layer .......................................................................................18
5.5.4 PCB Layout: The second layer..................................................................................19
5.5.5 PCB Layout: The third layer......................................................................................20
5.5.6 PCB Layout: The fourth layer....................................................................................21

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1Introduction
μPD78F8020D is the NEC Electronics 8 bit single chip microcomputer. The
features and hardware specification of Stick LIN-78K0 are described.
1.1 Features
Features of the Stick LIN-78K0 are as follows.
●The evaluation board used the NEC Electronics 8bit single chip microcontroller
μPD78F8020D (The part of 8-bit microcontroller is same as 78K0/KE2). All
of the ROM, RAM, circumference circuit and LIN transceiver are efficiently built
in one chip on a Stick LIN-78K0.
●High-speed operation is realized via the 20MHz internal clock.
●128 Kbytes of Flash EEPROM, available on the chip,
●Stick LIN-78K0 is programmable and debuggable from PC via USB connection
without any additional hardware tools.
●FT2232L (FTDI) is available on board for USB interface (USB2.0 compatible).
●The size of the module is, 82mm x 23mm.
1.2 Hardware Overview
MCU μPD78F8020DGB
Clock 20MHz main
Interfaces USB connector (Type A)
Expansion interface (J1)
Power supply 5.0V by USB, 7.0V-18.0V by Expansion
interface

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1.3 Attached goods list
● Stick LIN-78K0
● Development tool/Manual CD-ROM
● Expansion interface cable for LIN (separate cable with clip)
1.4 Block Diagram
USB I/F
I/O I/F
FLMD0
UART0
Writer SW
OCD1B
OCD1A
RESET
UART6
UART
UART
Debug SW
Ch1
Ch2
USB-UART
FT2232L
5V→8.5V
Voltage Converter
8-bit Micro
(78K0/KE2)
Analog
Driver
LIN
P70
VSUP
MCU UPD78F8020D
5V
5V
5V

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2Interface Connection
2.1 J1
Expansion Interface: J1 J1: Hirose DF11-10DP-2DS
J1 Name Connection to MCU Notes
1 VSUP (VSUP,HDS) External Power Supply
2 LIN LIN LIN Bus
3 DR1 DR1 Low side Pre driver
4 DR21 DR21 Low side driver for Relay
5 DR22 DR22 Low side driver for Relay
6 DR22_I DR22_I Driver 22 control signal input
7 DR4 DR4 Hall sensor power supply
driver
8 DR21_I DR21_I Driver 21 control signal input
9 GND
10 SWI SWI High voltage SW input
Location of J1: TOP VIEW
1Pin
9Pin 10Pin
2Pin

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3Switches and LEDs
3.1 SW1: Debug switch
The mode selection for Debugging with the ID78K0-TK.
Setting of SW1
Normal Mode OFF
Debugging Mode ON
SW1: TOP VIEW
3.2 SW2: writer switch
Programming mode selection for Flash EEPROM on the MCU with PG-FPL3.
Setting of SW2
Normal Mode OFF
Flash Programming Mode ON
SW2: TOP VIEW
SW1
SW2

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3.3 LED1
LED1 is connected to Low side driver DR3.
LED1 status
P33 Output data DR3 status LED
High ON Green
Low OFF Off
LED1: TOP VIEW
3.4 LED2: Power Indication
LED2 is a green LED to indicate the availability of power.
LED2 status
Status LED
Power ON Green
Power OFF Off
LED2: TOP VIEW
LED1
LED2

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3.5 LED3
LED3 indicate LIN Bus Pull-up.
LED3
LIN Bus Pull-up LED
Pull-up enable Green
Pull-up disable Off
LED3: TOP VIEW
LED3

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4Power Source
Stick LIN-78K0 are able to choice two ways of power source.
MCU power(VDD) and driver module power(VSUP) are both supplied when power
source are supplied from either USB or expansion interface(VSUP).
If you supply power using the expansion interface(VSUP), then keep power source
voltage DC7.0V-DC18.0V.
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