Texas Instruments THS3001 Manuale utente

THS3001

High Speed Current

Feedback

Operational Amplifier

E aluation Module

March 1999 Mixed-Signal Products

User’s Guide

SLOU021A

IMPORTANT NOTICE

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to verify, before placing orders, that information being relied on is current and complete. All products are sold

subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those

pertaining to warranty, patent infringement, and limitation of liability.

TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in

accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent

TIdeemsnecessarytosupport thiswarranty.Specifictestingofall parametersofeachdeviceis notnecessarily

performed, except those mandated by government requirements.

CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF

DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL

APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR

WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER

CRITICALAPPLICATIONS.INCLUSIONOFTIPRODUCTSINSUCHAPPLICATIONSISUNDERSTOODTO

BE FULLY AT THE CUSTOMER’S RISK.

In order to minimize risks associated with the customer’s applications, adequate design and operating

safeguards must be provided by the customer to minimize inherent or procedural hazards.

TIassumes noliabilityforapplicationsassistance orcustomer productdesign. TIdoes notwarrantorrepresent

thatanylicense,eitherexpressorimplied,isgrantedunderanypatentright,copyright,maskworkright,orother

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party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.

iii

Chapter Title—Attribute Reference

Preface

Related Documentation From Texas Instruments

THS3001 HIGH-SPEED CURRENT-FEEDBACK OPERATIONAL

AMPLIFIER

(literature number SLOS217) This is the data sheet

for the THS3001 operational amplifier integrated circuit that is

used in the THS3001 evaluation module.

FCC Warning

This equipment is intended for use in a laboratory test environment only. It

generates, uses, and can radiate radio frequency energy and has not been

testedforcompliancewiththelimitsofcomputing devices pursuant to subpart

Jofpart 15ofFCCrules,which aredesignedtoprovidereasonableprotection

against radio frequency interference. Operation of this equipment in other

environments may cause interference with radio communications, in which

case the user at his own expense will be required to take whatever measures

may be required to correct this interference.

Trademarks

TI is a trademark of Texas Instruments Incorporated.

Running Title—Attribute Reference

Contents

1 General Information 1-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1.1 Features 1-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1.2 Description 1-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1.3 THS3001 EVM Specifications 1-5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1.4 Using The THS3001 EVM 1-6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1.5 THS3001 EVM Performance 1-7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1.6 General High-Speed Amplifier Design Considerations 1-8. . . . . . . . . . . . . . . . . . . . . . . . . . .

2 Reference 2-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2.1 THS3001 High-Speed Operational Amplifier EVM Parts List 2-2. . . . . . . . . . . . . . . . . . . . . .

2.2 THS3001 EVM Board Layouts 2-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2.3 THS3001 Rev. A High-Speed Operational Amplifier EVM Parts List 2-4. . . . . . . . . . . . . . .

2.4 THS3001 Rev. A. EVM Board Layouts 2-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Figures

1–1 THS3001 Evaluation Module – Original Version 1-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1–2 THS3001 Rev. A Evaluation Module 1-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1–3 THS3001 EVM Schematic – Original Version 1-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1–4 THS3001 Rev. A EVM Schematic 1-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1–5 THS3001 EVM Frequency Response with Gain = 2 1-7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1–6 THS3001 EVM Frequency Response with Inverting Gain = 1 1-7. . . . . . . . . . . . . . . . . . . . . . .

2–1 THS3001 EVM Component Placement Silkscreen and Solder Pads 2-2. . . . . . . . . . . . . . . . .

2–2 THS3001 EVM PC Board Layout – Component Side 2-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2–3 THS3001 EVM PC Board Layout – Back Side 2-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2–4 THS3001 Rev. A EVM Component Placement Silkscreen and Solder Pads 2-4. . . . . . . . . . .

2–5 THS3001 Rev. A EVM PC Board Layout – Component Side 2-5. . . . . . . . . . . . . . . . . . . . . . . .

2–6 THS3001 Rev. A EVM PC Board Layout – Back Side 2-5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Tables

2–1 THS3001 EVM Parts List 2-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2–2 THS3001 Rev. A EVM Parts List 2-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1-1

General Information

This chapter details the Texas Instruments (TI) THS3001 high-speed

operational amplifier evaluation module (EVM), SLOP130. It includes a list of

EVM features, a brief description of the module illustrated with a pictorial and

aschematicdiagram,EVMspecifications,detailsonconnectingandusingthe

EVM, and a discussion on high-speed amplifier design considerations.

Topic Page

1.1 Features 1–2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1.2 Description 1–2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1.3 THS3001 EVM Specifications 1–5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1.4 Using The THS3001 EVM 1–6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1.5 THS3001 EVM Performance 1–7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1.6 General High-Speed Amplifier Design Considerations 1–8. . . . . . . . . . .

Chapter 1

Features

1-2

General Information

1.1 Features

THS3001 operational amplifier EVM features include:

High Bandwidth — 340 MHz, –3 dB at ±15 VCC & Gain = 2

±5-V to ±15-V Operation

Inverting and Noninverting Single-Ended Inputs

ModuleGainSetto+2(Noninverting)and–1(Inverting)—Adjustable

Through Component Change.

Nominal 50-ΩImpedance Inputs and Outputs

Standard SMA Miniature RF Connectors

Good Example of High-Speed Amplifier Design and Layout

1.2 Description

The TI THS3001 high-speed current-feedback operational amplifier

evaluationmodule(EVM)isacompletehigh-speedamplifiercircuit.Itconsists

of the TI THS3001 high-speed current-feedback operational amplifier IC,

along with a small number of passive parts, mounted on a small circuit board

measuring approximately 1.7 inch by 1.4 inch. The EVM uses standard SMA

miniatureRF connectors forinputs and outputsand is completelyassembled,

fully tested, and ready to use — just connect it to power, a signal source, and

a load (if desired).

Two versions of the THS3001 EVM are available. The original appears in

Figure 1–1 and the Rev. A version appears in Figure 1–2.

Figure 1–1.THS3001 Evaluation Module – Original Version

NONINVERTING

+ +

+VCC

GND

–VCC

–IN

GND

+IN

GND

INVERTING

LITERATURE NO

SLOP 130

009957 THS3001 EVM

OUT

GND

Description

1-3

General Information

Figure 1–2.THS3001 Rev. A Evaluation Module

NONINVERTING

+VCC

R1 C3

GND

–VCC

R3 U1

–IN

GND

OUT

GND

+IN

GND

INVERTING

SLOP130 Rev A

THS3001 EVM Board

INSTRUMENTS

+TEXAS

Rev. A

The THS3001 EVM is equipped with both noninverting and inverting inputs.

The noninverting input is set for a gain of 2 and the inverting input is set for a

gain of 1. Each input is terminated with a 50-Ωresistor to provide correct line

impedance matching (Figure 1–3 for original version and Figure 1–4 for Rev.

A). The amplifier IC output is routed through a 50-Ωresistor both to provide

correct line impedance matching and to help isolate capacitive loading on the

output of the amplifier. Capacitive loading directly on the output of the IC

decreases the amplifier’s phase margin and can result in peaking or

oscillations.

Figure 1–3.THS3001 EVM Schematic – Original Version

Non-

Inverting

Input

Inverting

Input

VCC

Output

49.9 Ω

1 kΩ

0.1 µF

1 kΩ

49.9 Ω

6.8 µF/35 V

–VCC

–

THS3001 R2

49.9 Ω

0.1 µF+

6.8 µF/35 V

Description

1-4

General Information

Figure 1–4.THS3001 Rev. A EVM Schematic

–IN

Inverting

+IN

Noninverting

Out

49.9 Ω

–VCC

–U1

THS3001

6.8 µF

1 kΩR4

1 kΩ

49.9 Ω

0.1 µF

6.8 µF

0.1 µF

VCC

–VCC

VCC

GND

J1 1–VCC

3VCC

Rev. A

EventhoughtheTHS3001isacurrent-feedbackamplifier,thegainoftheEVM

can easily be changed to support a particular application by simply changing

the ratio of resistors R1, R4, and R5 (R1, R2, and R4 for Rev. A) as described

in the following equations:

Inverting Gain

R2(Rev.A)

Noninverting Gain

)

R1(Rev.A)

In addition, some applications, such as those for video, may require the use

of 75-Ωcable and 75-ΩEVM input termination and output isolation resistors.

Any of the resistors on the EVM board can be replaced with a resistor of a

different value; however, care must be taken because the surface-mount

solder pads on the board are somewhat fragile and will not survive many

desoldering/soldering operations.

Because of the current feedback architecture, extra care must be taken to

ensure that a feedback resistor is always included in the design. In addition,

there must never be a capacitor directly in the feedback path between the

amplifier output and the noninverting input. Disregarding this guideline will

likely result in a part that oscillates.

Indice

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