Texas Instruments LM60EVM Manuale utente

User’s Guide

LM60EVM

ABSTRACT

This user's guide describes the characteristics, operation, and use of the LM60EVM evaluation board. This

user's guide discusses the hardware, how to set up and configure the software, and reviews various aspects of

the software operation. Throughout this document, the terms evaluation board, evaluation module, and EVM are

synonymous with the LM60EVM. This user's guide also provides information on the operating procedure, input

and output connections, an electrical schematic, printed circuit board (PCB) layout drawings, and a parts list for

the EVM.

Table of Contents

1 Overview..................................................................................................................................................................................2

1.1 Features............................................................................................................................................................................. 2

1.2 EVM Kit Contents...............................................................................................................................................................2

2 EVM Hardware.........................................................................................................................................................................3

2.1 LM60EVM Board................................................................................................................................................................3

2.2 Perforations........................................................................................................................................................................3

2.3 Subregulator.......................................................................................................................................................................3

2.4 Programming Header.........................................................................................................................................................3

2.5 BSL Button......................................................................................................................................................................... 3

2.6 Wire Terminal and Two-Pin Header................................................................................................................................... 3

2.7 EVM Operating Conditions.................................................................................................................................................4

3 Software Download.................................................................................................................................................................5

3.1 Live Software on dev.ti.com............................................................................................................................................... 5

3.2 Offline Software..................................................................................................................................................................5

4 Software...................................................................................................................................................................................6

4.1 Home Tab...........................................................................................................................................................................6

4.2 Data Capture Tab............................................................................................................................................................... 6

4.3 Collateral Tab..................................................................................................................................................................... 8

5 Schematic, Board Layout and Bill of Materials....................................................................................................................9

5.1 LM60 Schematic................................................................................................................................................................ 9

5.2 PCB Layout........................................................................................................................................................................ 9

5.3 Bill of Materials.................................................................................................................................................................10

www.ti.com Table of Contents

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LM60EVM 1

Trademarks

Chrome™ is a trademark of Google LLC.

Microsoft®, Windows®, and Internet Explorer® are registered trademarks of Microsoft Corporation.

macOS® and Safari® are registered trademarks of Apple Inc.

Linux® is a registered trademark of Linus Torvalds.

Firefox® is a registered trademark of Mozilla Foundation.

All trademarks are the property of their respective owners.

1 Overview

The LM60EVM allows users to evaluate the performance of the LM60 analog temperature sensor. The

EVM comes in a USB stick form factor for control and data logging, and has an onboard MSP430F5528

microcontroller that connects the host computer and the analog interface of the LM60 device. The module is

designed with perforations between the sensor and host controller on the EVM board. The perforation allows the

user flexibility in their evaluation:

• The user can connect the LM60 to the user's system/host.

• The user can connect the EVM host and software to the user's system with LM60 devices.

• Small individual boards allow the user to place sensors in the user's system.

• Hole spacing is compatible with common 0.1" prototyping breadboards.

1.1 Features

This EVM has the following features:

• Provides GUI for easy setup

• Perforated PCB allows for placement flexibility

• Two-pin header and wire terminal for connecting higher external power supply

• Software runs online or through offline installation

1.2 EVM Kit Contents

Table 1-1 details the contents of the EVM kit. Contact the nearest Texas Instruments Product Information Center

if any components are missing. TI highly recommends that users check the TI website at https://www.ti.com to

verify that they have the latest versions of the related software.

Table 1-1. EVM Kit Contents

Item Quantity

LM60EVM 1

CAUTION

The LM60 integrated circuit and other components on the LM60EVM can be damaged by

electrostatic discharge (ESD). Texas Instruments recommends that all integrated circuits be handled

with appropriate precautions. Failure to observe proper handling and installation procedures can

cause damage. ESD damage can range from subtle performance degradation to complete device

failure.

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2 EVM Hardware

2.1 LM60EVM Board

Figure 2-1 shows an image of the LM60EVM with some of the hardware features of the design labeled.

Figure 2-1. LM60EVM

2.2 Perforations

There are perforations between the USB controller and the LM60 sensor. These pins are labeled with their

functions on the board silkscreen, and can be used to either debug or provide an electrical connection when the

LM60 and controller board need to separated for testing.

2.3 Subregulator

The onboard 3.3-V regulator (U1) is enabled and disabled with switch S1. The subregulator must be enabled for

normal operation of the LM60EVM. The green LED (D3) illuminates when the subregulator is enabled.

2.4 Programming Header

The LM60EVM comes pre-loaded with firmware that is necessary for correct operation. Header J2 is provided

for Spy-Bi-Wire access to the MSP430F5528, but TI does not recommend that users access this header

or reprogram the device. This header may be required for recovery, however, if firmware corruption of the

LM60EVM occurs at any point.

2.5 BSL Button

The LM60EVM features push-button SW1 for entering USB BSL mode. This can be used for any necessary

firmware updates. This method is preferred over the use of the Spy-Bi-Wire programming header for firmware

2.6 Wire Terminal and Two-Pin Header

The onboard wire terminal (J3) and two-pin header (J4) can be used to connect an external power supply of

up to 10 V. In normal operation, connect the two-pin header using the provided two-pin header shunt. When

connecting an external power supply, disconnect the header by removing the shunt and screw down the wire

terminal to secure the external power supply wires in place.

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LM60EVM 3

2.7 EVM Operating Conditions

The LM60EVM power is supplied through the USB connector. The LDO (U1) converts the 5 V from the USB to

3.3 V used by the LM60 and the MSP430. The EVM may be directly inserted into a USB port on a PC or laptop,

or may be connected to the latter using an appropriate USB cable. Section 2.7 shows the different temperature

limits for the the controller and device sides of the EVM. These are set by the onboard MSP430F5528 and the

LM60 ICs on the controller and breakout portions, respectively.

Table 2-1. LM60EVM Temperature Limits

BOARD SECTION CONDITIONS TEMPERATURE RANGE

Controller Board Recommended operating free-air

temperature, TA

-40 °C to 125 °C

Absolute maximum junction temperature, TJ95 °C

LM60 Breakout Recommended operating free-air

temperature, TA

LM60B: -25 °C to 125 °C

LM60C: -40 °C to 125 °C

Absolute maxmimum junction temperature,

125 °C

EVM Hardware www.ti.com

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3 Software Download

The PC GUI Software for LM60EVM runs on TI's GUI Composer framework. The software is available as a live

version that runs in a browser and as a download for offline use. The software is compatible with Microsoft®

Windows®, macOS®, and Linux® operating systems.

3.1 Live Software on dev.ti.com

The live software currently works on Google Chrome™, Firefox®, and Safari® browsers. Internet Explorer® is not

supported. Users can access the live version through one of the following actions:

• Go to the EVM tool page and click View.

• Go to https://dev.ti.com/gallery/info/THSApps/LM60_GUI and select the LM60 GUI from the gallery.

• Click the application icon within the gallery to launch the software. Click the prompt to install the TI Cloud

Agent Bridge browser plugin.

3.2 Offline Software

3.2.1 Download from dev.ti.com

Users can access the latest version of the offline software by navigating to the live version as noted above. Look

for the download icon and download both the application and runtime for the operating system (see Figure 3-1).

Figure 3-1. Download Pop-Up

www.ti.com Software Download

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LM60EVM 5

4 Software

4.1 Home Tab

At start-up, the Home tab is displayed (Figure 4-1). Press the Learn More button to see device features and a

pinout diagram. The Home tab has shortcut icons to the Data Capture and Collateral tabs for quick access.

Figure 4-1. Home

4.2 Data Capture Tab

The Save Start and Save Stop buttons on the Data Capture tab allow the user to begin recording the

temperature data in a .csv file. Press the Save Start button to start the download and press Save Stop to

stop the download.

The Data Capture tab will automatically begin collecting temperature data when the application is launched. The

data is displayed in a scalar graph and will default to a refresh rate of 1 second. The drop-down menu allows the

user to change the refresh rate for the graph and temperature display. The options are the following:

• Off

• As Fast As Possible

• Every 500 ms

• Every 1 s

• Every 5 s

• Every 10 s

• Every 60 s

Additionally, the LM60EVM comes equipped with a firmware-based, low-pass filter to remove noise that can

cause erroneous temperature measurements. This method eliminates the need for implementing an extra

resistor and capacitor. The alpha value controls how much noise is filtered out. An alpha value of 1 (default)

will behave like no filter is being used. On the other hand, an alpha value of 0.1 eliminates a lot of noise. Try

inputting different alpha values between 0.001 and 1 to see how the filter response changes in real time.

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Figure 4-2. Data Capture Without Filter

Figure 4-3. Data Capture After Filter Implemented

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LM60EVM 7

4.3 Collateral Tab

As Figure 4-4 shows, the Collateral tab includes links to various related literature, including the device data sheet

and any corresponding application notes.

Figure 4-4. Collateral

Software www.ti.com

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5 Schematic, Board Layout and Bill of Materials

5.1 LM60 Schematic

VBUS

220 ohm

3P3V

3NC 4

OUT 5

GND

TLV70033DCKR

VBUS

D-

D+

GND

2.2uF

100k

1.0k

GND

10uF

GND

6.2V

BZT52C6V2T-7 1.00M

1.50k

GND

10pF

16V

10pF

16V

GND

PUR

GNDGND

Green

GND

TPD4E004DRYR

IO1

IO2

GND 3

IO3 4

IO4 5

VCC

GNDGND

VCC

110

MP2MP1

MP3 MP4

SW1

GND

0.1uF

10V

GNDGND

BSL

3NC 4

OUT 5

GND

TLV70033DCKR

VCC

VBUS

VCORE VUSB

2.2uF

V18

GND

SBWTCK

10uF

Header_3x1

GND

SBWTDIO

0.47uF

6.3V

0.47uF

6.3V

0.47uF

6.3V

C10

GND GND GND

GND

VCC

Super Red

1.0k

R13

XT2IN

MSP430F5528IRGCR

P6.0/CB0/A0 1

P6.1/CB1/A1 2

P6.2/CB2/A2 3

P6.3/CB3/A3 4

P6.4/CB4/A4 5

P6.5/CB5/A5 6

P6.6/CB6/A6 7

P6.7/CB7/A7 8

P5.0/A8/VREF+/VEREF+

P5.1/A9/VREF-/VEREF-

AVCC1

P5.4/XIN

P5.5/XOUT

AVSS1 14

DVCC1

15 DVSS1 16

VCORE

P1.0/TA0CLK/ACLK

P1.1/TA0.0

P1.2/TA0.1

P1.3/TA0.2

P1.4/TA0.3

P1.5/TA0.4

P1.6/TA1CLK/CBOUT

P1.7/TA1.0

P2.0/TA1.1 26

P2.1/TA1.2 27

P2.2/TA2CLK/SMCLK 28

P2.3/TA2.0 29

P2.4/TA2.1 30

P2.5/TA2.2 31

P2.6/RTCCLK/DMAE0 32

P2.7/UCB0STE/UCA0CLK 33

P3.0/UCB0SIMO/UCB0SDA

P3.1/UCB0SOMI/UCB0SCL

P3.2/UCB0CLK/UCA0STE

P3.3/UCA0TXD/UCA0SIMO

P3.4/UCA0RXD/UCA0SOMI

DVSS2 39

DVCC2

P4.0/PM_UCB1STE/PM_UCA1CLK 41

P4.1/PM_UCB1SIMO/PM_UCB1SDA 42

P4.2/PM_UCB1SOMI/PM_UCB1SCL 43

P4.3/PM_UCB1CLK/PM_UCA1STE 44

P4.4/PM_UCA1TXD/PM_UCA1SIMO 45

P4.5/PM_UCA1RXD/PM_UCA1SOMI 46

P4.6/PM_NONE 47

P4.7/PM_NONE 48

VSSU 49

PU.0/DP

PUR

PU.1/DM

VBUS

VUSB

V18

AVSS2 56

P5.2/XT2IN

P5.3/XT2OUT

TEST/SBWTCK 59

PJ.0/TDO 60

PJ.1/TDI/TCLK 61

PJ.2/TMS 62

PJ.3/TCK 63

RST/NMI/SBWTDIO 64

QFN PAD 65

XT2OUT

4NC

VCC

33.0k

R14

PUR

SBWTDIOV18

VCORE SBWTCK

VBUS

2200pF

50V

C13

VUSBVCC

GND

0.1uF

10V

C14

0.1uF

10V

C15

0.1uF

10V

C16

GNDGND GND

VBUS = 5V INPUT

VUSB = 3.3V OUT

VUSB 12mA Max

6.2V

BZT52C6V2T-7

ADC

3P3V

GND

ADC

50V

680pF

C12

GND

50V

0.1uF

C11

25V

100pF

C17 0

R15

GND

SH-J4

60900213421

J3 OSTTE020161

J4PEC02SAAN

VO 2

+VS

GND

Place C17 as

close to the

ADC pin on the

MSP430 as

possible

Figure 5-1. LM60 Schematic

5.2 PCB Layout

Figure 5-2. Top View

Figure 5-3. Bottom View

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LM60EVM 9

5.3 Bill of Materials

Table 5-1. Bill of Materials (BOM)

DESIGNATOR QTY VALUE DESCRIPTION PACKAGE REFERENCE PART NUMBER MANUFACTURER

!PCB1 1 Printed Circuit Board SENS097 Any

C1, C6 2 2.2uF CAP, CERM, 2.2 uF, 16 V, +/- 10%, X5R, 0402 0402 GRM155R61C225KE11D MuRata

C2, C7 2 10uF CAP, CERM, 10 uF, 10 V, +/- 20%, X5R, 0603 0603 C1608X5R1A106M080AC TDK

C3, C4 2 10pF CAP, CERM, 10 pF, 16 V,+/- 10%, C0G, 0402 0402 C0402C100K4GACTU Kemet

C5, C14, C15, C16 4 0.1uF CAP, CERM, 0.1 uF, 10 V,+/- 10%, X5R, 0402 0402 LMK105BJ104KV-F Taiyo Yuden

C8, C9, C10 3 0.47uF CAP, CERM, 0.47 uF, 6.3 V, +/- 10%, X7R, 0402 0402 JMK105B7474KVHF Taiyo Yuden

C11 1 0.1uF CAP, CERM, 0.1 uF, 50 V, +/- 10%, X5R, 0402 0402 C1005X5R1H104K050BB TDK

C12 1 680pF CAP, CERM, 680 pF, 50 V, +/- 10%, X7R, AEC-

Q200 Grade 1, 0402

0402 CGA2B2X7R1H681K050BA TDK

C13 1 2200pF CAP, CERM, 2200 pF, 50 V, +/- 5%, X7R, 0402 0402 CL05B222JB5NNNC Samsung Electro-Mechanics

C17 1 100pF CAP, CERM, 100 pF, 25 V, +/- 5%, C0G/NP0,

0402

0402 C0402C101J3GACTU Kemet

D1, D2 2 6.2V Diode, Zener, 6.2 V, 300 mW, SOD-523 SOD-523 BZT52C6V2T-7 Diodes Inc.

D3 1 Green LED, Green, SMD LED, GREEN, 0603 SML-LX0603GW-TR Lumex

D4 1 Super Red LED, Super Red, SMD LED_0603 150060SS75000 Wurth Elektronik

J1 1 Connector, Plug, USB Type A, R/A, Top Mount

SMT

USB Type A right angle 48037-1000 Molex

J2 1 Header, 2.54 mm, 3x1, Gold, TH Header, 2.54 mm, 3x1, TH GBC03SAAN Sullins Connector Solutions

J3 1 Terminal Block, 2x1, 3.5mm, TH 2x1 Terminal Block OSTTE020161 On-Shore Technology

J4 1 Header, 100mil, 2x1, Tin, TH Header, 2 PIN, 100mil, Tin PEC02SAAN Sullins Connector Solutions

L1 1 220 ohm Ferrite Bead, 220 ohm @ 100 MHz, 0.45 A, 0402 0402 BLM15AG221SN1D MuRata

R1, R2 2 22 RES, 22, 5%, 0.1 W, AEC-Q200 Grade 0, 0402 0402 ERJ-2GEJ220X Panasonic

R3 1 100k RES, 100 k, 5%, 0.1 W, AEC-Q200 Grade 0,

0402

0402 ERJ-2GEJ104X Panasonic

R4, R13 2 1.0k RES, 1.0 k, 5%, 0.1 W, AEC-Q200 Grade 0, 0402 0402 ERJ-2GEJ102X Panasonic

R5 1 1.00Meg RES, 1.00 M, 1%, 0.063 W, AEC-Q200 Grade 0,

0402

0402 RMCF0402FT1M00 Stackpole Electronics Inc

R6 1 1.50k RES, 1.50 k, 1%, 0.063 W, AEC-Q200 Grade 0,

0402

0402 RMCF0402FT1K50 Stackpole Electronics Inc

R7 1 47 RES, 47, 5%, 0.1 W, AEC-Q200 Grade 0, 0402 0402 ERJ-2GEJ470X Panasonic

R8 1 110 RES, 110, 1%, 0.1 W, AEC-Q200 Grade 0, 0402 0402 ERJ-2RKF1100X Panasonic

R14 1 33.0k RES, 33.0 k, 1%, 0.063 W, 0402 0402 RC0402FR-0733KL Yageo America

R15 1 0 RES, 0, 0%, 0.25 W, AEC-Q200 Grade 0, 0603 0603 RCS06030000Z0EA Vishay-Dale

S1 1 Switch, Slide, SPST, Top Slide, SMT Switch, Single Top Slide,

2.5x8x2.5mm

CHS-01TB Copal Electronics

SH-J4 1 Shunt, 2.54mm, Gold, Black Shunt, 2.54mm, Black 60900213421 Wurth Elektronik

SW1 1 Switch, SPST-NO, Off-Mom, 0.05A, 12VDC, SMD 3.9x2.9mm PTS820 J20M SMTR LFS C&K Components

Schematic, Board Layout and Bill of Materials www.ti.com

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