Zte MG2639 Manuale utente
MG2639 User Manual
Version：V1.0
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Copyright Statement
Copyright ©2010 by ZTE Corporation
All rights reserved.
No part of this publication may be excerpted, reproduced, translated or utilized in any form or by
any means, electronic or mechanical, including photocopying and microfilm, without the prior
written permission of ZTE Corporation.
is the registered trademark of ZTE Corporation. All other trademarks appeared in
this manual are owned by the relevant companies.
ZTE Corporation reserves the right to make modifications on print errors or update specifications
in this manual without prior notice.
ZTE Corporation keeps the right to make the final explanation to this manual.
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Descriptions of version update
Product version Document version Document No. Descriptions of
document update
MG2639 V1.0
Release for the first
time
Author
Document
version Date Written by Checked by Approved by
1.0 2011-8-22 Zhou Tao
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With strong technical force, ZTE Corporation can provide CDMA/GPRS/WCDMA module
customers with the following all-around technical support:
1. Provide complete technical documentation;
2. Provide the development board used for R&D, test, production, after-sales, etc.;
3. Provide evaluations and technical diagnosis for principle diagram, PCB, test scenarios;
4. Provide test environment;
ZTE Corporation provides customers with onsite supports, and also you could get supports
through telephone, website, instant communication, E-mail, etc.
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Preface
Summary
This document introduces MG2639 module’s product principle diagram, PINs, hardware interface
and module’s mechanical design, which can instruct the users how to quickly and conveniently
design different kinds of wireless terminals based on this type of module.
Target Readers
This document mainly applies to the following engineers:
System designing engineers
Mechanical engineers
Hardware engineers
Software engineers
Test engineers
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Contents
1GENERAL DESCRIPTION OF MODULE........................................................................1
1.1INTRODUCTION OF MODULE’S FUNCTIONS.....................................................1
1.2MODULE’S PRINCIPLE DIAGRAM .......................................................................2
1.3ABBREVIATIONS...................................................................................................3
2DESCRIPTIONS OF MODULE’S EXTERNAL INTERFACES ........................................5
2.1DEFINITIONS OF MODULE’S INTERFACES........................................................5
2.2ANTENNA INTERFACE .........................................................................................6
3MODULE’S ELECTRICAL CHARACTERISTICS ...........................................................8
3.1DESCRIPTIONS OF LEVELS OF INTERFACE SIGNALS.....................................8
3.1.1RESET..........................................................................................................8
3.1.2SIM CARD INTERFACE ...............................................................................8
3.1.3AUDIO INTERFACE .....................................................................................9
3.1.4NETWORK SIGNAL INDICATION................................................................9
3.2MODULE POWER CONSUMPTION....................................................................10
3.3RELIABILITY CHARACTERISTICS .....................................................................10
4INTERFACE CIRCUIT DESIGN ....................................................................................11
4.1RESET AND POWER DESIGN ............................................................................11
4.2UART INTERFACE...............................................................................................12
4.3SIM CARD INTERFACE .......................................................................................13
4.4AUDIO INTERFACE .............................................................................................14
5MECHANICAL DIMENSIONS .......................................................................................15
5.1APPEARANCE DIAGRAM ...................................................................................15
5.2MODULE ASSEMBLY DIAGRAM ........................................................................15
5.3PCB DIMENSIONS ..............................................................................................16
6ANTENNA INTERFACE................................................................................................16
6.1ANTENNA INSTALLATION ..................................................................................17
6.2ANTENNA PAD ....................................................................................................17
6.3ANTENNA CONNECTOR ....................................................................................17
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6.4ANTENNA SUBSYSTEM .....................................................................................18
6.4.1ANTENNA SPECIFICATIONS....................................................................18
6.4.2CABLE LOSS..............................................................................................19
6.4.3ANTENNA GAIN MAXIMUM REQUIREMENTS .........................................19
6.4.4ANTENNA MATCHING...............................................................................19
6.4.5PCB DESIGN CONSIDERATIONS.............................................................19
ANTENNA INTERFACE.................................................................................................19
7OEM/INTEGRATORS INSTALLATIONS ......................................................................20
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Figures
Figure 1-1 Module’s principle diagram ............................................................................................ 2
Figure 2-1 Antenna interface diagram............................................................................................. 6
Figure 5-1 MG2639 module’s appearance.................................................................................... 15
Figure 5-2 Module’s assembly diagram ........................................................................................ 15
Figure 5-3 Relevant PCB dimensions ........................................................................................... 16
Tables
Table 1-1 Module’s functions .......................................................................................................... 1
Table 1-1 28Pin stamp-hole definition............................................................................................. 5
Table 4-1 Voltage characteristics.................................................................................................. 11
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1 General description of module
This chapter mainly provides a general description of the module, including basic functions and
logic block diagram.
1.1 Introduction of module’s functions
The maximum operating ambient temperature of the equipment declared by the manufacturer is
75℃
Table 1-1 Module’s functions
Parameter MG2639
General Features
Frequency Bands GSM850/EGSM900/DCS1800/PCS1900
Dimensions 30.0×25.0x2.68mm
Weight 7g
Operating Temperature Range -30°C~+75°C
Storage Temperature Range -40°C~+85°C
Performance
Operating Voltage Range 3.6V~4.2V/Typical: 3.9V
Current Consumption Typically
Idle Current: 2mA
Call Current: 128mA
Max Current: 300mA
TX Power GSM850/EGSM900: Class 4 (2W)
DCS1800/PCS1900: Class 1 (1W)
RX Sensitivity <-106dBm
Interfaces
Connector 28Pin Stamp Holes
Antenna SMT 50ΩAntenna Connector
Antenna Solder Pad
Integrated Full Duplex UART AT/Data
SIM Card Interface 1.8V/3.0V
Data Features
GPRS Class 10
Mobile Station Class B
Max Downlink 85.6kbps
Max Uplink 42.8kbps
Protocol Internal TCP/IP&UDP
Embedded FTP
SMS Features
Indice
Altri manuali Zte Modulo GSM/GPRS
