AMD Turion 64 Manuale operativo
Advanced Micro Devices
AMD Turion™ 64 Mobile Technology
Product Data Sheet
• Compatible with Existing 32-Bit Code Base
– Including supportforSSE,SSE2,SSE3*, MMX™,
3DNow!™technology,and legacy x86 instructions
*SSE3 supported by Rev. E and later processors
– Runs existing operating systems and drivers
– Local APIC on the chip
• AMD64 Technology
– AMD64 technology instruction set extensions
– 64-bit integer registers, 48-bit virtual addresses,
40-bit physical addresses
– Eight additional 64-bit integer registers (16 total)
– Eight additional 128-bit SSE registers (16 total)
• Enhanced Virus Protection
– No Execute (NX) bit in page-translation tables
specifies whether code can be executed from the
page
• HyperTransport™ Technology to I/O Devices
– One 16-bit link supporting speeds up to 800 MHz
(1600 MT/s) or 3.2 Gbytes/s in each direction
• 64-Kbyte 2-Way Associative ECC-Protected
L1 Data Cache
– Two 64-bit operations per cycle, 3-cycle latency
• 64-Kbyte 2-Way Associative Parity-Protected
L1 Instruction Cache
– With advanced branch prediction
• 16-Way Associative ECC-Protected
L2 Cache
– Exclusive cache architecture—storage in addition
to L1 caches
– Up to 1 Mbyte per L2 cache
– 1 Mbyte and 512-Kbyte options
• Machine Check Architecture
– Includes hardware scrubbing of major
ECC-protected arrays
754-Pin Package Specific Features
• Refer to the AMD Functional Data Sheet,
754-Pin Package, order# 31410, for functional,
mechanical, and electrical details of 754-pin
packages.
• Packaging
– 754-pin lidless micro PGA
– 1.27-mm pin pitch
– 29 x 29-row pin array
– 40 mm x 40 mm organic substrate
– Organic C4 die attach
• Integrated Memory Controller
– Low-latency, high-bandwidth
– 72-bitDDRSDRAMat100,133,166,and200MHz
– Supports up to two unbuffered SO-DIMMs
– ECC checking with double-bit detect and single-bit
correct
• Electrical Interfaces
– HyperTransport™ technology: LVDS-like
differential, unidirectional
– DDR SDRAM: SSTL_2 per JEDEC specification
– Clock, reset, and test signals also use DDR
SDRAM-like electrical specifications.
• Power Management
– Multiple low-power states including Deeper Sleep
(C3 with AltVID)
– System Management Mode (SMM)
– ACPI compliant, including support for processor
performance states
– AMD PowerNow!™ technology is designed to
dynamically switch between multiple low-power
states based on application performance
requirements.
32816Publication # 3.05Revision:
September 2006Issue Date:
2
32816 Rev. 3.05 September 2006
AMD Turion™ 64 Mobile Technology Product Data Sheet
Socket S1g1 Processor Specific
Features
• Refer to the Socket S1g1 Processor Functional
Data Sheet, order# 31731, for functional and
mechanical details of socket S1g1 processors.
Refer to the AMD NPT Family 0Fh Processor
Electrical Data Sheet, order# 31119, for
electrical details of socket S1g1 processors.
• Packaging
– 638-pin lidless micro PGA package
– 1.27-mm pin pitch
– 26 x 26 pin grid array
– 35 mm x 35 mm organic substrate
– Compliant with RoHS (EU Directive 2002/95/EC)
withlead used only insmall amounts inspecifically
exempted applications
• Integrated Memory Controller
– Low-latency, high-bandwidth
– 128-bit DDR2 SDRAM controller operating at up
to 333 MHz
– Supports up to two unbuffered SO-DIMMs
• Electrical Interfaces
– HyperTransport™ technology: LVDS-like
differential, unidirectional
– DDR2 SDRAM: SSTL_1.8 per JEDEC
specification
– Clock, reset, and test signals also use DDR2
SDRAM-like electrical specifications
• Power Management
– Multiple low-power states.
– System Management Mode (SMM)
– ACPI compliant, including support for processor
performance states.
– AMD PowerNow!™ technology is designed to
dynamically switch between multiple low-power
states based on application performance
requirements.
3
AMD Turion™ 64 Mobile Technology Product Data Sheet
32816 Rev. 3.05 September 2006
Revision History
Date Revision Description
September 2006 3.05 Third public release.
Added RoHS compliance statement for socket S1g1 processor-specific features.
August 2006 3.03 Second public release.
Updated Machine Check Architecture section.
June 2006 3.01 Initial public release.
© 2005, 2006 Advanced Micro Devices, Inc. All rights reserved.
The contents of this document are provided in connection with Advanced Micro Devices, Inc.
(“AMD”) products. AMD makes no representations or warranties with respect to the accuracy
or completeness of the contents of this publication and reserves the right to make changes to
specifications and product descriptions at any time without notice. The information contained
herein may be of a preliminary or advance nature and is subject to change without notice. No
license, whether express, implied, arising by estoppel or otherwise, to any intellectual
property rights is granted by this publication. Except as set forth in AMD’s Standard Terms
and Conditions of Sale, AMD assumes no liability whatsoever, and disclaims any express or
implied warranty, relating to its products including, but not limited to, the implied warranty of
merchantability, fitness for a particular purpose, or infringement of any intellectual property
right.
AMD’s products are not designed, intended, authorized or warranted for use as components in
systems intended for surgical implant into the body, or in other applications intended to
support or sustain life, or in any other application in which the failure of AMD’s product could
create a situation where personal injury, death, or severe property or environmental damage
may occur. AMD reserves the right to discontinue or make changes to its products at any time
without notice.
Trademarks
AMD, the AMD Arrow logo, AMD Turion and combinations thereof, 3DNow!, and AMD PowerNow! are trademarks of Advanced
Micro Devices, Inc.
HyperTransport is a licensed trademark of the HyperTransport Technology Consortium.
MMX is a trademark of Intel Corporation.
Other product names used in this publication are for identification purposes only and may be trademarks of their respective companies.
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