AXIOMTEK ETM831 Series Manuale utente

ETM831 Series Quick Installation Guide

Version A1 November 2009

Printed in Taiwan

9418G831000E

Figure 2: ETM831 Thermal Solution Design Guide

Please refer to the ETM831 Series Product Information CD for the complete User’s Manual, drivers and

utilities. User’s Manual and related documents are Acrobat PDF format.

ETM831 Series Quick Installation Guide

Version A1 November 2009

Printed in Taiwan

9418G831000E

I. Checklist

9ETM831 Module x 1

9Quick Installation Guide x 1

9Product Information CD-ROM x 1

91 SATA Cable x 1

Note: Please contact your local vendors if any damaged or missing items.

DO NOT apply power to the board if any damaged components.

II. Connectors

Connectors Label

SATA Connector SATA1

SATA Connector SATA2

DDRⅡSO-DIMM DIMM1

ETX Connector – X1 SCN3

ETX Connector – X2 SCN1

ETX Connector – X3 SCN4

ETX Connector – X4 SCN2

Audio Connector

(CH5.1: Rear-R/L, Center, LFE)

SFC1

Auto Power Button JP1

III. Jumper Settings

Before applying the power to ETM831 Series, please make sure all

jumper settings are defaulted as the following table:

Description Jumper Setting

Auto-Power Button

Selection (JP1)

Manual

Power

Button

(Default)

Automatic

Power

Button

Please refer to the ETM831 Series Product Information CD for the complete User’s Manual, drivers and

utilities. User’s Manual and related documents are Acrobat PDF format.

ETM831 Series Quick Installation Guide

Version A1 November 2009

Printed in Taiwan

9418G831000E

IV. Board Layout

Please refer to the ETM831 Series Product Information CD for the complete User’s Manual, drivers and

utilities. User’s Manual and related documents are Acrobat PDF format.

Component Side

Solder Side

ETM831 Series Quick Installation Guide

Version A1 November 2009

Printed in Taiwan

9418G831000E

V. Heatspreader Installation

1. There is a protective plastic covering on the thermal pads. This

must be removed before the heatspreader can be mounted.

Each heatspreader is designed for a specific ETM module. The

thermal pads on the heatspreader are designed to make contact

with the necessary components on the ETM module. When

mounting the heatspreader you must make sure that the thermal

pads on the heatspreader make complete contact (no space

between thermal pad and component) with the corresponding

components on the ETM module. This is especially critical for ETM

modules that have higher CPU speeds (for example 1.0GHz or

more) to ensure that the heatspreader acts as a proper thermal

interface for cooling solutions.

2. The two M2.5x12 screws and two M2.5x8 screws are used to mount

the heatspreader and ETM module assembly to the baseboard.

(see Figure 1)

3. If you have an additional thermal solution on the heatspreader,

please refer to the ETM831 thermal solution design guide (see

Figure 2) to design your thermal solution.

Figure 1: ETM831 Heatspreader Assembly Guide

Please refer to the ETM831 Series Product Information CD for the complete User’s Manual, drivers and

utilities. User’s Manual and related documents are Acrobat PDF format.

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