Biostar B660MX-E Manuale utente

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FCC Informaon and Copyright

This equipment has been tested and found to comply with the limits of a Class B digital device,

pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protecon

against harmful interference in a residenal installaon. This equipment generates, uses, and can

radiate radio frequency energy and, if not installed and used in accordance with the instrucons,

may cause harmful interference to radio communicaons. There is no guarantee that interference

will not occur in a parcular installaon.

The vendor makes no representaons or warranes with respect to the contents here and

specially disclaims any implied warranes of merchantability or tness for any purpose. Further

the vendor reserves the right to revise this publicaon and to make changes to the contents here

without obligaon to nofy any party beforehand.

Duplicaon of this publicaon, in part or in whole, is not allowed without rst obtaining the

vendor’s approval in wring.

The content of this user’s manual is subject to be changed without noce and we will not be

responsible for any mistakes found in this user’s manual. All the brand and product names are

trademarks of their respecve companies.

Dichiarazione di conformità sintetica

Ai sensi dell’art. 2 comma 3 del D.M. 275

del 30/10/2002

Si dichiara che questo prodotto è

conforme alle normative vigenti e

soddisfa i requisiti essenziali richiesti

dalle direttive

2004/108/CE, 2006/95/CE e 1999/05/CE

quando ad esso applicabili

Short Declaration of conformity

We declare this product is complying

with the laws in force and meeting all

the essential requirements as specied

by the directives

2004/108/CE, 2006/95/CE and 1999/05/

whenever these laws may be applied

The terms HDMI and HDMI High-Denion Mulmedia Interface, and the HDMI Logo are trademarks or

registered trademarks of HDMI Licensing Administrator, Inc. in the United States and other countries.

2 / 147

2 | Table Of Contents

Table Of Contents

FCC Informaon and Copyright �� 1

Chapter 1: Introducon�� 3

1.1 Before You Start.................................................................................................................. 3

1.2 Package Checklist................................................................................................................ 3

1.3 Specicaons...................................................................................................................... 4

1.4 Rear Panel Connectors........................................................................................................ 5

1.5 Motherboard Layout .......................................................................................................... 6

Chapter 2: Hardware installaon�� 8

2.1 Install Central Processing Unit (CPU) .................................................................................. 8

2.2 Install a Heatsink............................................................................................................... 10

2.3 Connect Cooling Fans ....................................................................................................... 11

2.4 Install System Memory ..................................................................................................... 12

2.5 Expansion Slots ................................................................................................................. 14

2.6 Jumper & Switch Seng................................................................................................... 16

2.7 Headers & Connectors...................................................................................................... 17

Chapter 3: UEFI BIOS & Soware�� 23

3.1 UEFI BIOS Setup................................................................................................................ 23

3.2 BIOS Update...................................................................................................................... 23

3.3 Soware............................................................................................................................ 27

Chapter 4: Useful help�� 30

4.1 Driver Installaon ............................................................................................................. 30

4.2 AMI BIOS Beep Code......................................................................................................... 31

4.3 AMI BIOS post code .......................................................................................................... 31

4.4 Troubleshoong................................................................................................................ 33

4.5 Intel® Optane™ Technology (powered by 3D XPoint memory)......................................... 34

APPENDIX: Specicaons in Other Languages �� 35

Arabic...................................................................................................................................... 35

German................................................................................................................................... 36

Spanish ................................................................................................................................... 37

Thai ......................................................................................................................................... 38

Japan....................................................................................................................................... 39

3 / 147

Chapter 1: Introducon | 3

B660MX-E PRO I B660MH-E PRO

Chapter 1: Introducon

1�1 Before You Start

Thank you for choosing our product. Before you start installing the motherboard, please make

sure you follow the instrucons below:

• Prepare a dry and stable working environment with sucient lighng.

• Always disconnect the computer from power outlet before operaon.

• Before you take the motherboard out from an-stac bag, ground yourself properly

by touching any safely grounded appliance, or use grounded wrist strap to remove the

stac charge.

• Avoid touching the components on motherboard or the rear side of the board unless

necessary. Hold the board on the edge, do not try to bend or ex the board.

• Do not leave any unfastened small parts inside the case aer installaon. Loose parts

will cause short circuits which may damage the equipment.

• Keep the computer from dangerous area, such as heat source, humid air and water.

• The operang temperatures of the computer should be 0 to 45 degrees Celsius.

• To avoid injury, be careful of:

Sharp pins on headers and connectors

Rough edges and sharp corners on the chassis

Damage to wires that could cause a short circuit

1.2 Package Checklist

• Serial ATA Cable x2

• Rear I/O Panel for ATX Case x1

• WIFI antenna accessories x1

• Quick Installaon Guide x1

• Fully Setup Driver DVD x1

Note

»The package contents may be dierent due to the sales region or models in which it was sold. For

more informaon about the standard package in your region, please contact your dealer or sales

representave.

4 / 147

4 | Chapter 1: Introducon

1�3 Specifications

Specicaons

CPU Support

Support for 12th/13th/14th Generaon Intel® Core™ i9/ i7/ i5/ i3 processors and Intel® Penum®

processors/ Intel® Celeron® processors in the LGA1700 package

* Please refer to www.biostar.com.tw for CPU support list.

Chipset Intel® B660

Memory

Supports Dual Channel DDR4 1866/ 2133/ 2400/ 2666/ 2800/ 2933/ 3200/ 3600(OC)/ 3733(OC)/ 3800(OC)/

3866(OC)/ 4600+(OC)

4x DDR4 DIMM Memory Slot, Max. Supports up to 128 GB Memory

Each DIMM supports non-ECC 4/8/16/32GB DDR4 module

Support Intel® Extreme Memory Prole (XMP) memory modules

* Please refer to www.biostar.com.tw for Memory support list.

Storage

-- Total supports 2x M.2 socket and 4x SATA III (6Gb/s) ports

Intel 12th/13th/14th Processors

1x M.2 (M Key) Socket (M2_PCIEG4_64G):

Supports M.2 Type 2280 SSD module

Supports PCIe 4.0 x4 (64Gb/s) - NVMe/ AHCI SSD

Intel B660 Chipset

1x M.2 (M Key) Socket (M2_PCIEG4_64G_SATA):

Supports M.2 Type 2242/2260/2280 SSD module

Supports PCIe 4.0 x4 (64Gb/s) - NVMe/ AHCI SSD

Supports M.2 Type SATA module

4x SATA III Connector (6Gb/s) :

Supports AHCI, RAID 0, 1, 5, 10 & Intel® Rapid Storage Technology

LAN Intel® I219V

10/ 100/ 1000 Mb/s auto negoaon, Half / Full duplex capability

Audio Codec ALC897

7.1 Channels, High Denion Audio, Hi-Fi(Front)

USB 6x USB 3.2 (Gen1) port (4 on rear I/Os and 2 via internal headers)

6x USB 2.0 port (2 on rear I/Os and 4 via internal headers)

Expansion Slots

Intel 12th/13th/14th Processors

1x PCIe 4.0 x16 Slot (x16 mode)

Intel B660 Chipset

1x PCIe 3.0 x16 Slot (x4 mode)

1x PCIe 3.0 x1 Slot

Rear I/Os

B660MX-E PRO

2x WIFI Antenna Port

1x PS/2 Keyboard/ Mouse Port

1x HDMI

1x VGA+DVI Port

4x USB 3.2 (Gen1) port

2x USB 2.0 port

1x LAN port

3x Audio Jack

B660MH-E PRO

2x WIFI Antenna Port

1x PS/2 Keyboard/ Mouse Port

1x HDMI

1x VGA Port

4x USB 3.2 (Gen1) port

2x USB 2.0 port

1x LAN port

3x Audio Jack

Internal I/Os

4x SATA III Connector (6Gb/s)

1x M.2 (E Key) Socket : Supports 2230 type Wi-Fi & Bluetooth module and Intel® CNVi

2x USB 2.0 Header (each header supports 2 USB 2.0 ports)

1x USB 3.2 (Gen1) Header (each header supports 2 USB 3.2 (Gen1) ports)

1x 8-Pin Power Connector

1x 24-Pin Power Connector

1x CPU Fan Connector

1x CPU water cooling connector (CPU_OPT)

1x System Fan Connector

1x Front Panel Header

1x Front Audio Header

1x Internal Stereo Speaker Header

1x Clear CMOS Header

1x COM Port Header

1x TPM Header

2x LED Header (5V)

1x LED Header (12V)

* M.2 (E Key) Wi-Fi card is not provided

Form Factor uATX Form Factor, 244 mm x 244 mm

OS Support Windows 10(64bit) / Windows 11(64bit)

* Biostar reserves the right to add or remove support for any OS with or without noce.

5 / 147

Chapter 1: Introducon | 5

B660MX-E PRO I B660MH-E PRO

1.4 Rear Panel Connectors

B660MX-E PRO

B660MH-E PRO

Note

»VGA/ HDMI/ DVI-D ports only work with an Intel® integrated Graphics Processor.

»Maximum resoluon

HDMI: 4096 x 2160 @24Hz

VGA: 1920 x 1200 @60Hz

DVI-D: 1920 x 1200 @60Hz (B660MX-E PRO)

»The mainboard supports three onboard display outputs at same me and the display output

conguraon can be selected in Intel graphics driver ulity.

»When using the front HD audio jack and plug in the headset / microphone , the rear sound will be

automacally Disabled.

»The WiFi antenna port allows you to connect to the E Key module and use the WiFi & Bluetooth

funcon.

6 / 147

6 | Chapter 1: Introducon

1.5 Motherboard Layout

B660MX-E PRO

Note

» represents the 1st pin.

7 / 147

Chapter 1: Introducon | 7

B660MX-E PRO I B660MH-E PRO

B660MH-E PRO

Note

» represents the 1st pin.

8 / 147

8 | Chapter 2: Hardware installaon

Chapter 2: Hardware installaon

2.1 Install Central Processing Unit (CPU)

Step 1: Locate the CPU socket on the motherboard

Note

»Remove pin cap before installaon, and make good preservaon for future use. When the CPU is

removed, cover the pin cap on the empty socket to ensure pin legs won’t be damaged.

»The motherboard might equip with two dierent types of pin cap. Please refer below instrucon to

remove the pin cap.

Step 2: Open ILM Lever and then load plate using nger tab.

Step 3: Align and seat processor package on socket.

9 / 147

Chapter 2: Hardware installaon | 9

B660MX-E PRO I B660MH-E PRO

Step 4: Close the load plate.

Step 5: Remove and save cover.

Step 6: Close ILM Lever and latch

Note

»Ensure that you install the correct CPU designed for LGA1700 socket.

»The CPU ts only in one correct orientaon. Do not force the CPU into the socket to prevent

damaging the CPU.

10 / 147

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