Branson IPC 3000 Manuale utente

NANOSYSTEM FABRICATION FACILITY (NFF), HKUST
Version 1.0
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Standard Operating Manual
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Branson IPC 3000 O2Asher

NANOSYSTEM FABRICATION FACILITY (NFF), HKUST
Version 1.0
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Contents
1Picture and Location
2Process Capabilities
2.1 Cleanliness Standard
2.2 Recipes
2.3 Performance of Branson IPC 3000 O2Asher
3Contact List and How to Become a Qualified User
3.1 Emergency Responses and Communications
3.2 Training to Become a Qualified User
4Operating Procedures
4.1 System Description
4.2 Safety Warnings
4.3 Operation Rules
4.4 Initial System Checks
4.5 Status Checks
4.6 Steps to operate the equipment
4.6.1 Load the Wafers or Specimens into the chamber
4.6.2 Select Recipe and Run the Process
4.6.3 Pump Down and Start the Process
4.6.4 Vent and Unload the Samples

NANOSYSTEM FABRICATION FACILITY (NFF), HKUST
Version 1.0
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1. Picture and Location
Branson IPC 3000 O2Asher
This tool is located at NFF Enterprise Center Cleanroom Room 4162
Process Capabilities
Fig.1 Branson IPC 3000 O2Asher
2. Process Capabilities
2.1 Cleanliness Standard
Branson IPC 3000 O2 Asher is an “Non-Standard” equipment for Photo Resist
etching.
2.2 Recipes
Two standard recipes are provided for processing photo resist stripping and plasma
Touch Screen Panel
RF Generator
Mechnical Pump
Chamber Door
Chamber

NANOSYSTEM FABRICATION FACILITY (NFF), HKUST
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descum. Recipes’ parameters are shown below.
Plasma Descum (DESCUM.RCP)
Ramp ambient N2flow rate (slpm)
0.45
Temperature at the end of ramp (oC)
70
Power during ramp (W)
300
N2pressure (Torr)
1.3
Process O2flow rate (slpm)
0.45
Temperature at the end of ash (oC)
75
Power during ash (W)
150
O2pressure (Torr)
1.3
Ash time (minutes)
1
Photoresist Stripping (Striper.RCP)
Ramp ambient N2flow rate (slpm)
0.45
Temperature at the end of ramp (oC)
100
Power during ramp (W)
300
N2pressure (Torr)
1.3
Process O2flow rate (slpm)
0.45
Temperature at the end of ash (oC)
200
Power during ash (W)
300
O2pressure (Torr)
1.3
Ash time (minutes)
20
NOTE: Please consult with NFF staff for the feasibility if you request to run the
process by your own recipe.

NANOSYSTEM FABRICATION FACILITY (NFF), HKUST
Version 1.0
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2.3 Performance of Branson IPC 3000 O2Asher
Gases available
N2 & O2
RF Power Source
400W at 13.56 MHz
Substrate size
2”, 4” and 6” wafers or specimen
3. Contact List and How to Become a Qualified User
3.1 Emergency Responses and Communications
Security Control Center: 2358-8999 (24hr) & 2358-6565 (24hr)
Safety Officer: Mr. Wing Leong CHUNG 2358-7211 & 64406238
Deputy Safety Officer: Mr. Man Wai LEE 2358-7900 & 9621-7708
NFF EC Technician: Mr. Peter Yiu Cheong PUN 2358-7225 & 2358-7218
NFF Phase 2 Technician: Mr. Wilson Pui Keung YIP 2358-7894
3.2 Training to Become a Qualified User
Please follow the procedure below to become a qualified user.
1. Read the operation manual of Branson IPC 3000 O2asher which can be found
at NFF web site.
2. Send an e-mail to NFF requesting Branson IPC 3000 O2asher operation
training. Scheduling can take up to several weeks due to the many requests
coming in for this tool.

NANOSYSTEM FABRICATION FACILITY (NFF), HKUST
Version 1.0
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4. Operating Procedures
4.1 System Description
Branson IPC 3000 O2Asher can generate a low pressure, low temperature gaseous
plasma. Ashing, etching and polymer surface modification can be performed quickly
and reproducibly. It consists of a quartz process chamber, main unit, touch screen
panel, RF generator, pressure gauge, thermal couple and power supply. O2and N2are
provided for process and vent.
Fig2. Touch Screen Panel
Fig3. RF Generator

NANOSYSTEM FABRICATION FACILITY (NFF), HKUST
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Fig4. Mechanical Pump
Fig5. Main unit including chamber

NANOSYSTEM FABRICATION FACILITY (NFF), HKUST
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4.2 Safety Warnings
This equipment can cause injury if it is not being used under a cautious manner.
1. The quartz chamber, wafer boats (see Fig.7) are very brittle. Please handle
them carefully.
2. Load the wafers or specimens into the chamber carefully to avoid damage of
thermal couple which is isolated in a quartz tube (see Fig 6).
3. The system will be damaged if wrong recipe parameters are applied. Make
sure NFF staff knows in case of any change of recipe parameters.
4. Machine case is hot during process. Don’t touch any surface to prevent
burns.
5. Do not operate this machine if you are pregnant since small amount of
unpreventable RF power would escape from the machine.
6. Mechanical pump oil is hazardous to human body. Report to NFF staff when
spillage of oil occurs.
Fig.6 Thermal Couple inside quartz chamber Fig.7 Quartz boats
Thermal
Couple

NANOSYSTEM FABRICATION FACILITY (NFF), HKUST
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4.3 Operation Rules
1. If the equipment alarms during operation, do not try to fix the problem by
yourself and should report to NFF staff immediately.
2. Do not operate the equipment unless you are properly trained and approved by
NFF staff.
3. Do not leave an on-going experiment unattended.
4. Do not run the process for more than 30 mins.
5. Enough time of cooling is needed before unloading the wafers or specimens
from the chamber after process completed.
6. Do not start the process while the door is still open.
7. Except for “main menu”, “Process for Engineering menu” and “Diagnostics
menu”, do not click into other menus such as “Maintenance menu”.
8. Do not stop the process by an improper way during normal operation. For
example, turn off the RF generator to stop the process during normal
operation.
9. Do not change the machine settings without permission of NFF staff.
10. This equipment is only for purposes of PR stripping and Descum. For any
other request, please consult with NFF staff.
4.4 Initial System Checks
1. The RF generator is turned on by confirming that “AC ON” red light is on and
“REMOTE ENABLE” green light is on.
2. The mechanical pump is turned on
3. The computer is turned on so the touch screen is functioning.
4. The chamber should be under atmosphere pressure.

NANOSYSTEM FABRICATION FACILITY (NFF), HKUST
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5. The quartz boats, thermal couple and chamber are under good conditions and
without cracks.
6. The sealing surface and the sealing rubber of the door are under good
conditions without damage.
4.5 Status Checks
No reservation is needed for this equipment. The equipment is under “first come
first serve” basis.
4.6 Steps to Operate The Equipment
4.6.1 Load the wafers or specimens into the chamber
1. Put the wafers or specimens into suitable quartz boats. The quartz boats are
located on top of the main unit.
2. Make sure the chamber is vented.
3. If the door is locked, pull the knob and turn it in clockwise direction. Unlock
and open the chamber door.
4. Use the metal fork to load the boats into the chamber.
5. Put the boats in the center position of the chamber. Don’t damage the thermal
couple which is located at the left of the chamber.
6. Close the door, turn the knob in anti-clockwise direction and push the knob to
lock the chamber door.
4.6.2 Select recipe and run the process
1. In AllWin21 operation interface, go to “Process for Engineering menu”.
Indice
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