Dell 2720HB Manuale utente



DELL E

1. Disas

Tur

Pla

the

rel

720HB

embly Pr

off the m

e the mon

desk.

ove VES

ase button

Use a long

push the r

hole just a

cedures

nitor.

itor on a so

cover to a

and thin s

lease latc

ove the st

ft cloth alo

cess the

rewdriver t

located in

nd.

Once t

base a

Press d

latch o

separat

Unlock



(Screw

Unlock

(Screw

e latch is r

ay from th

wn on the

the botto

base fro

screws o

orque: 8~

CLMN sc

orque: 4.5

leased, re

monito

quick rele

of the bas

stand col

Rear Cov

0kgf)

rews

±0.5kgf)

ove the

se tab

e to

mn.



Dis

Not

ssemble

itor

ice the dis

isassembl

eparate R

ear Cove

ssembly o

the Top p

the Left /

the Botto

from Bez

from the

der :

Right part

part

Remov

backlig

Remov

SPS B

Remov

panel

Disass

Unlock

off Co

(Screw

DELL

Control B

2 tapes fr

t wire

LVDS ca

backlight

2 tape fro

mble Beze

screws o

trol BD fr

orque: 0.9

E2720H

FFC cabl

m LVDS c

le from pa

ire from p

m Main SH

l from the

Control B

m Bezel

~1kgf)

e from I/F

ble and

anel and

D and

anel

to take



DELL E

S11

Dis

S12

Unl

scr

(Sc

720HB

ssemble

ck 5 PCB

rew Torque

ylar from

screws a

: 6.5±1.0kg

: 5.0±0.6kg

ain SHD

d 2 hex

Disass

Main S

Remov

mble SPS

SPS wire

LVDS ca

BD and I/F

from I/F

le from I/F

BD from



S15



ove elect

-1 Cut the

-2 Ensure

olyte capa

glue betwe

utting pat

itors (red

n bulk ca

within the

ark) from

. and PCB

glue, don’t

rinted circ

with a knif

touch bulk



DELL

it boards

cap. or PC

E2720H

5DELL E2720HB

S15-3 Take out bulk cap. pin solder with soldering iron and absorber

S15-4 Lift the bulk cap. up and away from the PCB

6DELL E2720HB

2. Product material information

The following substances, preparations, or components should be disposed of or

recovered separately from other WEEE in compliance with Article 4 of EU Council

Directive 75/442/EEC.

Capacitors / condensers (containing

PCB/PCT) No used

Mercury containing components No used

Batteries No used

Printed circuit boards (with a surface greater

than 10 square cm) Product has printed circuit boards

(with a surface greater than 10 square

cm)

Component contain toner, ink and liquids No used

Plastic containing BFR No used

Component and waste contain asbestos No used

CRT No used

Component contain CFC, HCFC, HFC and

HC No used

Gas discharge lamps No used

LCD display > 100 cm2 Product has an LCD greater than 100

cm2

External electric cable Product has external cables

Component contain refractory ceramic fibers No used

Component contain radio-active substances No used

Electrolyte capacitors (height

> 25mm, diameter > 25mm) Product has electrolyte capacitors

(height >25mm, diameter > 25mm)



3. Tools Required

List the type and size of the tools that would typically can be used to disassemble the

product to a point where components and materials requiring selective treatment can be

removed.

Tool Description:

- Screwdriver

- Scraper Bar

- Penknife

- Soldering iron and absorber

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