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DELL E2222H Teardown Instruction

1

1. Remove Rear Cover Screw and Stand

Screws

a. Remove screws “1~6” on rear cover with

electric screwdriver

b. Torque: 12. +/- .5Kgf/cm, Phillips

screwdriver

4. Remove VGA screw

a. Remove screws “1~2” with electric

screwdriver

b. Torque: 12. +/- .5Kgf/cm, hex screwdriver

2. Remove Rear Cover

a. Pry off the back cover of the machine

with the aid of the dismantling fixture, in

the sequence of “Bottom->Left/Right-

>Top”

5. Remove Chassis Screw

a. Remove screws “1~2” with electric

screwdriver

b. Torque: 3.5 +/- .5Kgf/cm, Phillips

screwdriver

b. Remove Light Bar and Keypad Cable:

a.

Remove acetate cloth tape marked with

“1”, then remove light bar (grasp on Pin

then pull outwards to remove)

b.

Remove Keypad cable “2”

6. Remove Aluminium Foil and LVDS Cable

a. Remove aluminium tape then remove LVDS

cable (Pinch on clips on the sides)

Start

DELL E2222H Teardown Instruction

2

7. Remove PCBA 1

a. Remove mylar (squared in red in the

upper picture)

b. Remove grounding screw “1” then

locking screws marked “2~5” with

electric screwdriver

c. Torque: 5.5 +/- .5Kgf/cm, Phillips

screwdriver

1 .

Remove Keypad

a. Remove keypad from front cover

(loosen hook circled in red first)

8. Remove PCBA 2

a. Remove PI board and IF board

b. Separate PI board from IF board

11. Remove Components on PI Board 1

a. Remove electrolyte capacitor >25mm height

(squared in red) from printed circuit boards

b. Cut the glue between bulk cap and PCBA with

knife – ensure cutting path within the glue,

don’t touch bulk cap and PCBA

9.

Remove LVDS Cable and Light Bara

a. Remove light bar from PI board (grasp

on Pin then pull upwards to remove)

b. Remove LVDS cable from IF board (lift

cover before remove)

12. Remove Components on PI Board 2

a. Take out the capacitor pin solder with

soldering iron

b. Lift the bulk capacitor away from power

board

S7 S1

DELL E2222H Teardown Instruction

3

1. Product Material Information

The following substances, preparation, or components should be disposed of or recovered separately

from other WEEE in compliance with Article 4 of EU Council Directive 75/422/EEC.

Capacitors / Condensers (containing PCB/PCT) Not used

Mercury containing components Not used

Batteries Not used

Printed circuit boards (with surface greater than 1

square cm)

Product has printed circuit boards (with surface

greater than 1 square cm)

Component contain toner, ink and liquids Not used

Plastic containing BFR

Component and waste contain asbestos Not used

CRT Not used

Component contain CFC, HCFC, HGC and HC Not used

Gas discharge lamps Not use

LCD display > 1 cm2 Product LCD greater than 1 cm2

External electric cable Product has external cables

Component contain refractory ceramic fibers Not used

Component contains radio-active substances Not used

Electrolyte capacitors (height > 25mm,

diameter >25mm)

Product has electrolyte capacitors (height > 25mm)

2. Tools Required

List the type and size of the tools that would typically can be used to disassemble the product to a

point where components and materials requiring selective treatment can be removed.

Tool Description:

-Screwdriver (Philip head with Φ5 mm & Φ3 mm)

-Screwdriver (Hexagonal to remove VGA connectivity)

-Soldering iron

-Knife