Dell SE2422HXB Manuale utente
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1. Disassembly Procedures
S1
Turn off the monitor.
S2
To remove the stand:
Place a flat cushion or a sitting mat near
the edge of a table and place the
monitor on it with the display facing
down.
Press the stand down to access to the
Stand release button.
Use a long screwdriver to press the
release latch.
While pressing the release latch, slide
out the stand assembly from the monitor
S3
To remove the V SA cover
Press the dimple on the V SA cover to
release it from the back of the display
S4
Unlock 4 RC screws
(Screw Torque: 8.5±1.0kgf)
S5
Unlock 2 Bracket screws
(Screw Torque: 5.0±1.0kgf)
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S6
Disassemble Rear Cover from Bezel
Notice the disassembly order:
1) Disassemble the Top part
2) Disassemble the Left / Right part
3) Disassemble the Bottom part
4) Remove Rear Cover from Bezel
S7
Disassemble CTRL BD FFC from I/F BD
and tear off CTRL BD FFC from Main
SHD and Panel
Disassemble LVDS cable from panel
S8
Remove 1 tape from Backlight Wire
S
Disassemble Backlight Wire from panel
and SPS BD
S10
Remove 2 tapes from Main SHD to take
off Main SHD from Panel
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S11
Disassemble Bezel from panel
S12
Disassemble CTRL BD from Bezel
S13
Disassemble Mylar from Main SHD
S14
Unlock 2 hex screws
(Screw Torque: 5.0±0.6kgf)
S15
Unlock 5 PCBA screws
(Screw Torque: 8.5±1.0kgf)
S16
Disassemble SPS BD and I/F BD from
Main SHD
Remove SPS wire from I/F BD
Remove LVDS cable from I/F BD
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S17
Remove electrolyte capacitors (red mark) from printed circuit boards
S17-1 Cut the glue between bulk cap. and PCB with a knife
S17-2 nsure cutting path within the glue, don’t touch bulk cap. or PCB
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S17-3 Take out bulk cap. pin solder with soldering iron and absorber
S18-4 Lift the bulk cap. up and away from the PCB
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2. Product material information
The following substances, preparations, or components should be disposed of or
recovered separately from other WEEE in compliance with Article 4 of EU Council
Directive 75/442/EEC.
Capacitors / condensers (containing
PCB/PCT)
No used
Mercury containing components
No used
Batteries
No used
Printed circuit boards (with a surface greater
than 10 square cm)
Product has printed circuit boards
(with a surface greater than 10 square
cm)
Component contain toner, ink and
liquids
No used
Plastic containing BFR
No used
Component and waste contain asbestos
No used
CRT
No used
Component contain CFC, HCFC, HFC and
HC
No used
Gas discharge lamps
No used
LCD display > 100 cm2 Product has an LCD greater than 100
cm2
External electric cable
Product has external cables
Component contain refractory ceramic fibers
No used
Component contain radio
-
active substances
No used
Electrolyte capacitors (height
> 25mm, diameter > 25mm)
Product has electrolyte capacitors
(height >25mm, diameter > 25mm)
3. Tools Required
List the type and size of the tools that would typically can be used to disassemble the
product to a point where components and materials requiring selective treatment can be
removed.
Tool Description:
- Screwdriver
- Scraper Bar
- Penknife
- Soldering iron and absorber
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