Ebyte E70-900M14S1B Manuale utente

E70-900M14S1B

CC1312 868/915MHz Wireless SOC Module

Chengdu Ebyte Electronic Technology Co.,Ltd E70-900M14S1B User Manual

CONTENTS

Disclaimer...............................................................................................................................................................................2

1 Product Overview................................................................................................................................................................ 3

1.1 Brief Introduction..................................................................................................................................................... 3

1.2 Feature...................................................................................................................................................................... 3

1.3 Application................................................................................................................................................................4

2 Specification and parameter................................................................................................................................................ 4

2.1 Limit parameter........................................................................................................................................................ 4

2.2 Operating parameter................................................................................................................................................. 4

3 Size and pin definition......................................................................................................................................................... 6

4 Basic operation.................................................................................................................................................................... 7

4.1 Hardware design....................................................................................................................................................... 7

4.2 Software program..................................................................................................................................................... 8

4.3 Program burn............................................................................................................................................................ 9

5 FAQ......................................................................................................................................................................................9

5.1 Communication range is too short............................................................................................................................9

5.2 Module is easy to damage.........................................................................................................................................9

5.3 BER(Bit Error Rate) is high................................................................................................................................... 10

6 Production guidance.......................................................................................................................................................... 10

6.1 Reflow soldering temperature................................................................................................................................ 10

6.2 Reflow soldering curve...........................................................................................................................................11

7 E70 series...........................................................................................................................................................................11

8 Antenna recommendation.................................................................................................................................................. 12

8.1 Recommendation............................................................................................................................................................ 12

9 Package for bulk order.......................................................................................................................................................12

Revision history....................................................................................................................................................................13

About us................................................................................................................................................................................13

Chengdu Ebyte Electronic Technology Co.,Ltd E70-900M14S1B User Manual

Disclaimer

EBYTE reserves all rights to this document and the information contained herein.

Products, names, logos and designs described herein may in whole or in part be

subject to intellectual property rights. Reproduction, use, modification or disclosure to

third parties of this document or any part thereof without the express permission of

EBYTE is strictly prohibited.

The information contained herein is provided “as is” and EBYTE assumes no

liability for the use of the information. No warranty, either express or implied, is given,

including but not limited, with respect to the accuracy, correctness, reliability and

fitness for a particular purpose of the information. This document may be revised by

EBYTE at any time. For most recent documents, visit www.ebyte.com.

Chengdu Ebyte Electronic Technology Co.,Ltd E70-900M14S1B User Manual

1 Product Overview

1.1 Brief Introduction

E70-900M14S1B adopts the original imported CC1312R from Texas

Instruments (TI). It integrates a single-chip microcomputer and wireless transceiver,

and uses a 48MHz industrial-grade high-precision low-temperature drift crystal

oscillator to ensure its industrial characteristics and stable performance.

The CC1312R chip has a built-in powerful 48MHz Arm Cortex-M4F

processor, and has abundant peripheral resources such as UART, I2C, SPI, ADC,

DMA, and PWM. The module leads to all the IO ports of the single-chip

microcomputer, which can be used for multi-directional development.

Since the E70-900M14S1B is a pure hardware SOC module, there is no program at the factory, and the user needs to develop it

again before it can be used.

1.2 Feature

Developed based on CC1312R, built-in powerful 48MHz Arm Cortex-M4F processor;

With 48MHz temperature compensated crystal oscillator, industrial-grade standard design

352KB system programmable flash memory, 256KB ROM for protocol and library functions；

8KB cache SRAM (available as general-purpose RAM), 80KB ultra-low leakage SRAM, SRAM adopts parity check protection

to ensure high reliability of operation

RSSI signal strength reading；

Air wake-up, that is, low power consumption function, suitable for battery-powered solutions；

Ultra-low receiving current, its receiving current is only half of similar products；

The maximum transmit power is 25mW, and the software is multi-level adjustable；

For European license-free frequency band ISM 868MHz and North America license-free ISM 915MHz frequency band；

Air transmission rate: 20～1000kbps；

2.2～3.8V power supply, power supply greater than or equal to 3.3V can guarantee the best performance；

Under ideal conditions, the communication distance can reach 1.5km；

Dual antennas are optional (IPEX/stamp hole), which is convenient for users to develop and integrate.

Chengdu Ebyte Electronic Technology Co.,Ltd E70-900M14S1B User Manual

1.3 Application

Home security alarm and remote keyless entry;

Wireless alarm security system;

Building automation solutions;

Wireless industrial-grade remote control;

Health care products;

Advanced Meter Reading Architecture(AMI);

Automotive industry applications.

2 Specification and parameter

2.1 Limit parameter

Main parameter

Performance

Remark

Min

Max

Power supply（V）

3.8

Voltage over 3.8V will cause permanent

damage to module

Blocking power（dBm）

Chances of burn is slim when modules

are used in short distance

Operating temperature（℃）

-40

2.2 Operating parameter

Main parameter

Performance

备注

Min

Type

Max

Operating voltage（V）

2.2

3.3

3.8

≥3.3 V ensures output power

Communication level（V）

3.3

For 5V TTL, it may be at risk of burning down

Operating temperature（℃）

-40

+85

Industrial grade

Operating frequency（MHz）

850

930

Support ISM band

Power

Consump-

tion

TX current（mA）

24.9

Instant power consumption

RX current（mA）

5.8

Sleep current （μA）

2.0

Shut down by software

Max TX power（dBm）

13.5

14.5

Receiving sensitivity（dBm）

-120

-121

-122

Air data rate is 5 kbps

Air data rate（bps）

1000k

Controlled via user’s programming

Chengdu Ebyte Electronic Technology Co.,Ltd E70-900M14S1B User Manual

Main parameter

Description

Remark

Reference distance

1500m

Test condition：clear and open area, antenna gain: 5dBi，

antenna height: 2.5m，air data rate: 2.5 kbps

Crystal Oscillator

48MHz

Modulation

GFSK

Package

SMD

Interface

1.27mm

CC1312R1F3RGZ

FLASH

352KB

ROM

256KB

RAM

8KB+80KB

8KB cache SRAM (available as general-purpose RAM)

80KB ultra-low leakage SRAM.

Core

Arm Cortex-M4F processor

Size

26*16mm

Antenna

IPEX/stamp hole

50 ohm impedance

Chengdu Ebyte Electronic Technology Co.,Ltd E70-900M14S1B User Manual

3 Size and pin definition

Pin No.

Item

Direction

Description

GND

Reference ground

Ground

ANT

Antenna（50 ohm impedance）

X32K_Q1

Input/Output

Connect with pin 4 to 32.768K quartz crystal

X32K_Q2

Input/Output

Connect with pin 3 to 32.768K quartz crystal

DIO_1

Input/Output

MCU GPIO

DIO_2

Input/Output

MCU GPIO

DIO_3

Input/Output

MCU GPIO

DIO_4

Input/Output

MCU GPIO

DIO_5

Input/Output

MCU GPIO

DIO_6

Input/Output

MCU GPIO

DIO_7

Input/Output

MCU GPIO

DIO_8

Input/Output

MCU GPIO

DIO_9

Input/Output

MCU GPIO

Chengdu Ebyte Electronic Technology Co.,Ltd E70-900M14S1B User Manual

DIO_10

Input/Output

MCU GPIO

DIO_11

Input/Output

MCU GPIO

GND

Reference ground

Ground

DIO_12

Input/Output

MCU GPIO

DIO_13

Input/Output

MCU GPIO

DIO_14

Input/Output

MCU GPIO

DIO_15

Input/Output

MCU GPIO

TMSC

Input

JTAG TMSC

TCKC

Input

JTAG TCKC

DIO_16

Input/Output

MCU GPIO

DIO_17

Input/Output

MCU GPIO

DIO_18

Input/Output

MCU GPIO

VCC

Power supply：2.2～3.8V DC

GND

Reference ground

Ground

DIO_19

Input/Output

MCU GPIO

DIO_20

Input/Output

MCU GPIO

DIO_21

Input/Output

MCU GPIO

DIO_22

Input/Output

MCU GPIO

RESET

Input

Module reset

DIO_23

Input/Output

MCU GPIO

DIO_24

Input/Output

MCU GPIO

DIO_25

Input/Output

MCU GPIO

DIO_26

Input/Output

MCU GPIO

DIO_27

Input/Output

MCU GPIO

DIO_28

Input/Output

MCU GPIO

DIO_29

Input/Output

MCU GPIO

DIO_30

Input/Output

MCU GPIO

GND

Reference ground

Ground

GND

Reference ground

Ground

4 Basic operation

4.1 Hardware design

It is recommended to use a DC stabilized power supply. The power supply ripple factor is as small as possible and

the module needs to be reliably grounded;

Please pay attention to the correct connection of the positive and negative poles of the power supply,

reverse connection may cause permanent damage to the module;

Please check the power supply to ensure that between the recommended supply voltage, if exceeding the maximum,

the module will be permanently damaged;

Chengdu Ebyte Electronic Technology Co.,Ltd E70-900M14S1B User Manual

Please check the stability of the power supply. Voltage can not fluctuate greatly and frequently;

When designing the power supply circuit for the module, it is often recommended to reserve more than 30% of the

margin, so the whole machine is beneficial for long-term stable operation;

The module should be as far away as possible from the power supply, transformers, high-frequency wiring and other

parts with large electromagnetic interference;

Bottom Layer High-frequency digital routing, high-frequency analog routing, and power routing must be avoided

under the module. If it is necessary to pass through the module, assume that the module is soldered to the Top Layer,

and the copper is spread on the Top Layer of the module contact part(well grounded), it must be close to the digital

part of the module and routed in the Bottom Layer;

Assuming the module is soldered or placed over the Top Layer, it is wrong to randomly route over the Bottom Layer

or other layers, which will affect the module's spurs and receiving sensitivity to varying degrees;

It is assumed that there are devices with large electromagnetic interference around the module that will greatly

affect the performance. It is recommended to keep them away from the module according to the strength of the

interference. If necessary, appropriate isolation and shielding can be done;

Assume that there are traces with large electromagnetic interference (high-frequency digital, high-frequency analog,

power traces) around the module that will greatly affect the performance of the module. It is recommended to stay

away from the module according to the strength of the interference.If necessary, appropriate isolation and shielding

can be done;

If the communication line uses a 5V level, a 1k-5.1k resistor must be connected in series (not recommended, there is

still a risk of damage);

Try to stay away from some physical layers such as TTL protocol at 2.4GHz , for example: USB3.0;

The mounting structure of antenna has a great influence on the performance of the module. It is necessary to ensure

that the antenna is exposed, preferably vertically upward. When the module is mounted inside the case, use a good

antenna extension cable to extend the antenna to the outside;

The antenna must not be installed inside the metal case, which will cause the transmission distance to be greatly

weakened.

4.2 Software program

The chip scheme of this module is the CC1312R of Texas Instruments (Texas Instruments), and the user can operate according to

the CC1312R chip book provided by TI's official website;

Users can download the CC1312R software development kit on TI's official website to effectively shorten the development

cycle;

If you encounter problems during the development process, you can log in to TI’s E2E community to ask questions, and TI’s

technical staff will answer them;

Chengdu Ebyte Electronic Technology Co.,Ltd E70-900M14S1B User Manual

4.3 Program burn

Description

Program burn

The module is a SoC module with its own GPIO port. Program download uses the CC series dedicated downloader:

JTAG downloader (or TI's official CC1312 supporting development board). Serial ports or any other ISP or ICP

tools cannot be used.

The figure below is a schematic diagram of the JTAG connection (XDS100). For the specific development method,

please refer to the relevant Ti official documents (the TDI and TDO pins may not be connected).

5 FAQ

5.1 Communication range is too short

The communication distance will be affected when obstacle exists;

Data lose rate will be affected by temperature, humidity and co-channel interference;

The ground will absorb and reflect wireless radio wave, so the performance will be poor when testing near ground;

Sea water has great ability in absorbing wireless radio wave, so performance will be poor when testing near the sea;

The signal will be affected when the antenna is near metal object or put in a metal case;

Power register was set incorrectly, air data rate is set as too high (the higher the air data rate, the shorter the

distance);

The power supply low voltage under room temperature is lower than 2.5V, the lower the voltage, the lower the

transmitting power;

Due to antenna quality or poor matching between antenna and module.

5.2 Module is easy to damage

Please check the power supply source, ensure it is in right range, or the module will be damaged;

Please check the stability of power source, the voltage cannot fluctuate too much;

Please make sure antistatic measure are taken when installing and using, high frequency devices have electrostatic

susceptibility;

Please ensure the humidity is within limited range, some parts are sensitive to humidity;

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