
Helios Junior, User’s guide 02/2008
Page 3
ECRESO – 20, avenue Neil Armstrong – Parc d’Activites JF Kennedy – 33700 Bordeaux-Merignac – France
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[email protected] TABLE OF CONTENTS
1. INTRODUCTION.......................................................................................................................................5
1.1. INTRODUCTION .................................................................................................................................5
1.2. PACKING ..........................................................................................................................................5
1.3. GUARANTEE CLAUSES .......................................................................................................................5
1.4. SAFETY INSTRUCTIONS......................................................................................................................6
1.5. RADIO AND TELEVISION INTERFERENCES............................................................................................6
2. DESCRIPTION..........................................................................................................................................7
2.1. GENERAL DESCRIPTION .....................................................................................................................7
2.2. HELIOS JUNIOR FRONT PANEL............................................................................................................ 8
2.3. HELIOS JUNIOR BACK PANEL.............................................................................................................. 9
2.4. DETAILED DESCRIPTION OF THE HELIOS JUNIOR .............................................................................10
2.4.1. 1U Rack.................................................................................................................................11
2.4.2. Power supply.........................................................................................................................11
2.4.3. Main board.............................................................................................................................11
2.4.4. RF amplifier part....................................................................................................................11
2.4.5. Monitoring/ Display part.........................................................................................................11
3. TECHNICAL SPECIFICATIONS ............................................................................................................13
3.1. RF SECTION :..................................................................................................................................13
3.2. COMPOSITE OPERATION : ................................................................................................................13
3.3. MONAURAL OPERATION: ..................................................................................................................13
3.4. AF INPUTS:.....................................................................................................................................13
3.5. COMMAND INPUT:............................................................................................................................13
3.6. HF OUTPUT: ...................................................................................................................................14
3.7. POWER SUPPLY: .............................................................................................................................14
3.8. INTERFACE PANEL: .......................................................................................................................... 14
3.9. ENVIRONMENT : ..............................................................................................................................14
3.10. PHYSICAL: ..................................................................................................................................14
3.11. OTHER:.......................................................................................................................................15
3.12. SPARE PARTS:.............................................................................................................................15
4. USE.........................................................................................................................................................16
4.1. OPERATION DESCRIPTION................................................................................................................16
4.1.1. Reset .....................................................................................................................................16
4.1.2. Configuration menu ...............................................................................................................16
4.2. MENUS SELECTION.......................................................................................................................... 16
4.3. SYNOPTIC OF DIFFERENT MENUS .....................................................................................................18
5. INSTALLATION......................................................................................................................................24
5.1. PHYSICAL SET-UP ...........................................................................................................................24
5.1.1. Input settings (MONO or MPX) .............................................................................................24
5.1.2. Pre-emphasis (ONLY IN MONO) ..........................................................................................25
5.1.3. Input range (MONO and MPX).............................................................................................. 25
5.2. INSTALLATION .................................................................................................................................26
5.3. CONNECTIONS ................................................................................................................................26
5.3.1. Load test................................................................................................................................27
5.3.2. Mains connection ..................................................................................................................27