HP EliteDesk 705 G3 Istruzioni per il montaggio

EL-MF877-00 Page 1

Template Revision B

PSG instructions for this template are available at EL-MF877-01

Product End-of-Life Disassembly Instructions

Product Category:

Desktop

Marketing Name / Model

[List multiple models if applicable.]

HP EliteDesk 705 G3 Desktop Mini Business PC

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU

directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA)

With a surface greater than 10 sq cm

Batteries

All types including standard alkaline and lithium coin

or button style batteries

Mercury-containing components

For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface greater

than 100 sq cm

Includes background illuminated displays with gas

discharge lamps

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height

External electrical cables and cords

Gas Discharge Lamps

Plastics containing Brominated Flame Retardants

weighing > 25 grams (not including PCBs or PCAs

already listed as a separate item above)

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent

chambers, and service stations.

Components and waste containing asbestos

Components, parts and materials containing

refractory ceramic fibers

EL-MF877-00 Page 2

Template Revision B

PSG instructions for this template are available at EL-MF877-01

Components, parts and materials containing

radioactive substances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

Tool Description

Tool Size (if

applicable)

Screwdriver Torx #15

Screwdriver Philips #3

Screwdriver Philip #2

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Remove access panel

2. Remove HDD and HDD FAN for Dolomite and Hood Sensor

3. Remove system fan

4. Remove heat sink from M/B

5. Remove WLAN Card from M/B

6. Remove ambient sensor fly cable and Speaker cable

7. Remove M/B and battery

8. Remove Memory

9. Remove Rear IO (HDMI/DP/SERIAL) card and M.2 card

10. Remove front bezel

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations).

EL-MF877-00 Page 3

Template Revision B

PSG instructions for this template are available at EL-MF877-01

1.Remove access panel

Release 1 thumb

screw on the access

panel as photo1

shown

(Screwdriver Philips

#3)

Handle the chassis

and push access

panel as the

direction then

remove the access

panel as photo2

shown

Photo1

Photo2

EL-MF877-00 Page 4

Template Revision B

PSG instructions for this template are available at EL-MF877-01

2 .Remove HDD and HDD FAN for Dolomite and Hood

Sensor

Lift HDD latch up

then press HDD the

forward for escaping

from cage as photo1

shown

Pull the connector

first then pull HDD

SATA FFC cable out

of motherboard as

photo2 shown

Photo1

Photo2

Push the latch

PUSH

PULL

EL-MF877-00 Page 5

Template Revision B

PSG instructions for this template are available at EL-MF877-01

Release 3 screws of

HDD cage first then

remove hood sensor

cable from M/B as

photo3 shown

(Screwdriver Torx

#15)

Remove hood

sensor from HDD

cage. as photo4

shown

Photo3

Photo4

EL-MF877-00 Page 6

Template Revision B

PSG instructions for this template are available at EL-MF877-01

3. Remove system fan

Lift system fan up

then remove it as

photo1 shown

Remove system fan

cable from M/B as

photo2 shown

Photo1

Photo2

EL-MF877-00 Page 7

Template Revision B

PSG instructions for this template are available at EL-MF877-01

4. Remove heat sink from M/B

Release 3 screws by

order 3 to 1 to free

heat sink from

chassis as photo1

shown

(Screwdriver Torx

#15)

Photo1

EL-MF877-00 Page 8

Template Revision B

PSG instructions for this template are available at EL-MF877-01

5. Remove WLAN Card from M/B

Pull out antenna

from WLAN card as

photo1 shown

Release 1 screws

from M/B as photo2

shown

(Screwdriver Philips

#2)

Remove WLAN card

as photo3 shown

Photo1

Photo2

Photo3

EL-MF877-00 Page 9

Template Revision B

PSG instructions for this template are available at EL-MF877-01

6. Remove ambient sensor fly cable and Speaker cable

Remove ambient

sensor fly cable and

SPK cable from M/B

as photo1 shown

Photo1

EL-MF877-00 Page 10

Template Revision B

PSG instructions for this template are available at EL-MF877-01

7. Remove M/B and battery

Release 4 screws by

order 4 to 1 to free

M/B from chassis as

photo1 shown

(Screwdriver Torx

#15)

Follow the direction

to drag M/B out of

chassis as photo2

shown

Remove battery from

M/B by loosing the

clip outwards as

direction shown

Photo1

Photo2

Photo3

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