HP ENVY Phoenix 850 Istruzioni per l'installazione

EL-MF877-00 Page 1

Template Revision B

PSG instructions for this template are available at EL-MF877-01

Product End-of-Life Disassembly Instructions

Product Category: Personal Computers

Marketing Name / Model

[List multiple models if applicable.]

HP ENVY Phoenix Desktop PC 850 / HP ENVY Phoenix Desktop PC 860

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU

directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description

Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA)

With a surface greater than 10 sq cm

MB, Memory,HDD PCA,GFX PCAODD PCA,PSU

PCA(2)

Batteries

All types including standard alkaline and lithium

coin or button style batteries MB

Mercury-containing components

For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface

greater than 100 sq cm

Includes background illuminated displays with gas

discharge lamps

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height

PSU

External electrical cables and cords

Power cord

Gas Discharge Lamps

Plastics containing Brominated Flame Retardants

weighing > 25 grams (not including PCBs or PCAs

already listed as a separate item above)

system fan, Cooler fan,PSU fan

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent

chambers, and service stations.

Components and waste containing asbestos

EL-MF877-00 Page 2

Template Revision B

PSG instructions for this template are available at EL-MF877-01

Components, parts and materials containing

refractory ceramic fibers

Components, parts and materials containing

radioactive substances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

Tool Description

Tool Size (if

applicable)

Description #1 crisscross screw driver

Description #2 hexagon screw driver

T15

Description #3 electric iron

QUICK 310

Description #4

Description #5

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Remove access panel from the unit.

2. Remove front panel from the unit.

3. Take off FIO from the unit.

4. Remove the Card reader from the unit.

5. Remove all the cable from the unit.

6. Take off PSU from the unit.

7. Remove HDD from the unit.

8. Remove ODD from the unit.

9. Take off the Graphics Card from the unit.

10. Take off the system fan from the unit.

11. Take off Memory from the unit.

12. Take off CPU cooler from the unit.

13. Take off PCA from the unit.

14. Take off battery from the unit .

15. Take off PCB from the PSU.

16. Take off CAP using electric iron from the PSU.

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations).

EL-MF877-00 Page 3

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PSG instructions for this template are available at EL-MF877-01

1. Remove access panel

from the unit.

Release screw on the access

panel. Griping the tab at the

end of access panel, pull

towards the rear and remove it

from unit.

EL-MF877-00 Page 4

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PSG instructions for this template are available at EL-MF877-01

2. Remove front panel

from the unit.

Release 3 bezel latches

from chassis by pulling the

bezel latches outwards.

3.Take off Top Panel from

the unit

EL-MF877-00 Page 5

Template Revision B

PSG instructions for this template are available at EL-MF877-01

4. Remove the Card reader

from the unit.

5. Remove all the cable

from the unit.

EL-MF877-00 Page 6

Template Revision B

PSG instructions for this template are available at EL-MF877-01

6. Take off PSU from the

unit.

Rotate the screw driver to

release PSU from the unit.

7. Remove HDD from the

unit.

EL-MF877-00 Page 7

Template Revision B

PSG instructions for this template are available at EL-MF877-01

8. Remove ODD from the

unit.

9. Take off the Graphics

Card from the unit.

10.Take off the system fan

from the unit.

EL-MF877-00 Page 8

Template Revision B

PSG instructions for this template are available at EL-MF877-01

Rotate screw driver to loose

screw and take off the

system fan.

11. Take off Memory from

the unit.

Release memory socket

levers by pulling outward.

EL-MF877-00 Page 9

Template Revision B

PSG instructions for this template are available at EL-MF877-01

12. Take off CPU cooler

from the unit.

Rotate the screw driver to

release CPU cooler from the

unit.

13. Take off PCA from the

unit.

EL-MF877-00 Page 10

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PSG instructions for this template are available at EL-MF877-01

14. Take off battery from

the unit

Rotate screw driver to loose

PCA from the unit.

15. Take off PCB from the

PSU.

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