HP ProDesk 600 G1 Tower Istruzioni per l'installazione

Product End-of-Life Disassembly Instructions

Product Category: Personal Computers

Marketing Name / Model

[List multiple models if applicable.]

HP ProDesk 600 G1 Tower Business PC

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic

instructions for the disassembly of HP products to remove components and materials requiring selective treatment ,as

defined by EU directive 2002/96/EC,Waste Electrical and Electronic Equipment (WEEE)

1.0 Items Requiring Selective

Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA)

With a surface greater than 10 sq cm

Yes

Batteries

All types including standard alkaline and lithium

coin or button style batteries Yes

Mercury-containing components

For example, mercury in lamps, display

backlights, scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface

greater than 100 sq cm

Includes background illuminated displays with gas

discharge lamps

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height

Liteon 320W STD

External electrical cables and cords

Yes

Gas Discharge Lamps

Plastics containing Brominated Flame Retardants

weighing > 25 grams (not including PCBs or PCAs

already listed as a separate item above)

Components and parts containing toner and ink

Include the cartridges, print heads, tubes, vent

including liquids, semi-liquids (gel/paste) and toner

chambers, and service stations.

Components and waste containing asbestos

EL-MF877-00 Page 1

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PSG instructions for this template are available at EL-MF877-01

Components, parts and materials containing

refractory ceramic fibers

Components, parts and materials containing

radioactive substances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where

components and materials requiring selective treatment can be removed.

Tool Description

Tool Size (if

applicable)

#1Torx Screwdriver

#2 Phillips Screwdriver

#3 Micro shear

T-15

170II

Description #4

Description #5

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective

treatment:

1. Remove the access panel.(see Figure 1 below)

2. Disconnect the cables from the board.(see Figure 2-7 below)

3. Remove the HDD、slim ODD、ODD from cage.(see Figure 8-10 below)

4. Remove the Memory from the board.(see Figure 11 below)

5. Remove the CPU HeatSink from the board(see Figure 12&13 below)

6. Remove the fan from CPU HeatSink(see Figure 14&15 below)

7. Remove the CPU from the board.(see Figure 16&17 below))

8. Remove the battery from the system board.(see Figure 18 below)

9. Remove M/B from chassis.(see Figure 19&20 below)

10. Remove system fan from chassis.(see Figure 21&22 below)

11. Remove PSU from chassis.(see Figure 23-25 below)

12. Remove Speaker from chassis .(see Figure 26&27 below)

13. Remove front bezel.(see Figure 28 below)

14. Remove Front I/O and power LED cable.(see Figure 29-31 below)

15. Remove PSU cover.(see Figure 32&33 below)

16. Remove PSU PCA,and disconnect power cables.(see Figure 34&35 below)

17. Remove the Electrolytic Capacitors.(see Figure 36-38 below)

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations).

EL-MF877-00 Page 2

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PSG instructions for this template are available at EL-MF877-01

EL-MF877-00 Page 3

Template Revision B

PSG instructions for this template are available at EL-MF877-01

Figure1 Remove the access panel Figure2 Disconnect PSU cables from the board

Figure3 Disconnect the ODD/HDD PSU cables Figure4 Disconnect the cables from the ODD

Figure5 Disconnect the cables from the HDD Figure6 Disconnect the cooler cable

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PSG instructions for this template are available at EL-MF877-01

Figure7 Disconnect the Front IO cable Figure8 Remove the HDD from cage

Figure9 Remove the slim ODD from cage Figure10 Remove the ODD from cage

Figure11 Remove the Memory from the board Figure12 Loose the screws from the CPU HeatSink

EL-MF877-00 Page 5

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PSG instructions for this template are available at EL-MF877-01

Figure13 Remove the CPU HeatSink from the board Figure14 Loose the screws from the CPU HeatSink

Figure15 Remove the fan from CPU HeatSink Figure16 Rotate the handle and open it up

Figure17 Remove the CPU from the board Figure18 Remove the battery from the system board

EL-MF877-00 Page 6

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PSG instructions for this template are available at EL-MF877-01

Figure19 Loose the screws from board Figure20 Remove M/B from chassis

Figure21 Loose the screws from system fan Figure22 Remove system fan

Figure23 Loose the screws from PSU Figure24 Press the baffle and slide the PSU

EL-MF877-00 Page 7

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PSG instructions for this template are available at EL-MF877-01

Figure25 Remove PSU from chassis Figure26 Loose the screw from Speaker

Figure27 Remove Speaker Figure28 Remove front bezel

Figure29 Loose the screw of FIO Figure30 Remove FIO

EL-

Tem

F877-00

late Revisio

Figure31 R

Figure33 Li

Figure35 R

（Liteon 32

move powe

t the cover

move PSU

W STD）

PSG instruc

r LED cable

ff the power

B from PS

ions for this

supply

Chassis

emplate are

Figu

vailable at E

e32 Remov

e34 Cut the

e36 Show

-MF877-01

the screw

cable tie

le-Cap on P

on the PS

CBA

chassis

e 8

EL-MF877-00 Page 9

Template Revision B

PSG instructions for this template are available at EL-MF877-01

Figure37 Remove Ele-Cap from PCBA

Figure38 Remove Ele-Cap from PCBA

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