HP Z VR Backpack G1 Istruzioni per l'installazione

EL-MF877-00 Page 1

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PSG instructions for this template are available at EL-MF877-01

Product End-of-Life Disassembly Instructions

Product Category: Desktop PC

Marketing Name / Model

[List multiple models if applicable.]

HP Z VR Backpack G1 Workstation

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU

directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA)

With a surface greater than 10 sq cm

MB/dock borad

Batteries

All types including standard alkaline and lithium coin

or button style batteries Main battery/RTC

Mercury-containing components

For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface greater

than 100 sq cm

Includes background illuminated displays with gas

discharge lamps

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height

External electrical cables and cords

POWER CORD/ dock cable

Gas Discharge Lamps

Plastics containing Brominated Flame Retardants

weighing > 25 grams (not including PCBs or PCAs

already listed as a separate item above)

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent

chambers, and service stations.

Components and waste containing asbestos

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Components, parts and materials containing

refractory ceramic fibers

Components, parts and materials containing

radioactive substances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

Tool Description

Tool Size (if

applicable)

Description #1 Screwdriver

#1, #0, T8

Description #2

Description #3

Description #4

Description #5

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Remove screw rubber foot and screw *6 pcs

2. Disassemble the rear cover from the top cover

3. Remove the top FFC cable

4. Remove battery cable and DC-in cable from MB connector

5. Remove CPU Fan ,connector and screw *3

6. Remove GPU Fan ,connector and screw *3

7. Remove Thermal module and screw *8

8. Remove antenna support L lower and screw *2

9. Remove Main and Aux

10. Remove Waln card and screw *1

11. Remove lower holder BKT and screw *2

12. Remove internal battery and screw *3 /Remove RTC battery

13. Remove external battery BKT L / R and screw *4

14. Remove DC-in BKT and screw *1

15. Remove DC-in cable

16. Remove Antenna support R upper and screw *1

17. Remove Antenna support L upper and screw *1

18. Remove Absorber on top IO holder BKT

19. Remove top IO holder BKT and screw *2

20. Remove sheilding can

21. Remove fan screw nut *2

22. Remove power board and screw *2

23. Remove VR DC-out cable

24. Remove MB and screw *2

25. Remove power button BLM

26. Remove MB

27. Remove VR DC-out BKT and screw *2

28. Remove screw rubber foot and screw *6 pcs

29. Remove bottom door from the Dock cover

30. Remove left / right cover from the Dock cover

31. Remove Dock cover from Dock inside

32. Remove DC cable*2

33. Remove Docking MB and screw *6.

34. Remove DC holder BKT and screw*2

35. Remove DC cable and Dock DC PCB.

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36.

37.

38.

39.

40.

41.

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations).

1. Remove screw rubber foot and screw *6 pcs

2. Disassemble the rear cover from the top cover

3. Remove the top FFC cable

EL-MF877-00 Page 4

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4. Remove battery cable and DC-in cable from MB connector

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Remove External battery cable.

Remove DC-in cable.

5. Remove CPU Fan ,connector and screw *3

6. Remove GPU Fan ,connector and screw *3

EL-MF877-00 Page 6

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7. Remove Thermal module and screw *8

8. Remove antenna support L lower and screw *2

EL-MF877-00 Page 7

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PSG instructions for this template are available at EL-MF877-01

9. Remove Main and Aux

10. Remove Waln card and screw *1

EL-MF877-00 Page 8

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PSG instructions for this template are available at EL-MF877-01

11. Remove lower holder BKT and screw *2

12. Remove internal battery and screw *3 / Remove RTC battery

Battery location: Backpack inside on the bottom position.

EL-MF877-00 Page 9

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EL-MF877-00 Page 10

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RTC battery location/ Remove RTC 2032 battery on the motherboard:

13. Remove external battery BKT L / R and screw *4

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