HP V191 Istruzioni per l'installazione

EL-MF877-00 Page 1

Template Revision B

PSG instructions for this template are available at EL-MF877-01

Product End-of-Life Disassembly Instructions

Product Category: Monitors and Displays

Marketing Name / Model

[List multiple models if applicable.]

HP V191 18.5-inch LED Backlit LCD Monitor

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU

directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description

Notes

Quantity of items included

in product

Printed Circuit Boards (PCB) or Printed

Circuit Assemblies (PCA)

With a surface greater than 10 sq cm

Batteries

All types including standard alkaline and

lithium coin or button style batteries

Mercury-containing components

For example, mercury in lamps, display

backlights, scanner lamps, switches,

batteries

Liquid Crystal Displays (LCD) with a

surface greater than 100 sq cm

Includes background illuminated displays

with gas discharge lamps

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing

PCB/PCT)

Electrolytic Capacitors / Condensers

measuring greater than 2.5 cm in diameter

or height

External electrical cables and cords

LV1911 V191 : 2

W1971a/W1972a/W1952a:3

Gas Discharge Lamps

Plastics containing Brominated Flame

Retardants weighing > 25 grams (not

including PCBs or PCAs already listed as a

separate item above)

Components and parts containing toner

Include the cartridges, print heads, tubes,

EL-MF877-00 Page 2

Template Revision B

PSG instructions for this template are available at EL-MF877-01

and ink, including liquids, semi-liquids

(gel/paste) and toner

vent chambers, and service stations.

Components and waste containing

asbestos

Components, parts and materials

containing refractory ceramic fibers

Components, parts and materials

containing radioactive substances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

Tool Description

Tool Size (if

applicable)

Description #1 Screw driver of "+" type

200mm

Description #2 Hexagonal nut screw driver for DVI and D-SUB connector

200mm

Description #3

Description #4

Description #5

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Dismantle the screws of stand，get down the stand

2. Dismantle the cover of monitor

3. Dismantle the button，pull out the pin of KEPC board ,get down the KEPC board

4. Dismantle mainframe

5. Dismantle BEZEL

6. Dismantle the screws of PANEL

7. Pull out the PIN of lamp

8. Pull out the PIN of LVDS cable，separate the mainframe and PANEL

9. Dismantle the power board screws

10. Dismantle the VGA/DVI screws

11. First: Tear off the adhesive tape;

12. Second: Pull out the connector PIN which connect PWPC and main board;

13. Third: Take off both boards

14. Pull out the pin of KEPC cable

15.

16.

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations).

Pls. refer the attached:

HP 185 Disassembly Process

External ElectricCables DissectingProcess

1.RemoveCable From Display Head. 2.Dissecting to Complete.

Power Cable

D-SUB &DVI Cable

AUDIO Cable

Remove Stand Base From Display

1.Take Screw(*5) from RearCover. 2. Demount Stand & RemoveStand Base Form

Display.

Remove Rear Cover From DisplayHead

1.Both Hands Upwardly Pull Up.

3. Toward the arrowhead , take the

RearCoverfrom the Front Cover. 4. RemoveRear Cover.

2.Turn over Display Head.

Remove KEPC board From Front Cover

1. Takethe KEPC assembly from the Front

Cover. 2.Remove Connectoroff from KEPC board

and disassemble KEPC assembly .

Remove Mainframe &Panel

1. Remove Connector off from Power

board & Panel. 2.Remove the Conductive Tape from

the Mainframe.

3.RemoveMainframe & Panel. 4.Removethe connecting wire

Remove Front Cover &Panel

1.Turn over Panel, and remove the Front

Coveroff from Panel.

2. Dissecting to complete.

3. Demount BRACKET-L& BRACKET-R Form

LNT panel.

Direct at the LNT panel Modle

Take Screw off From Mainframe Assembly

1.Take Screw(*4or 2) from Mainframe.

3. Take Screw(*6) from Power Bd & Main Bd .

2.Tearoff Mylar form mainframe

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