HPE Aruba 6200F Istruzioni per il montaggio
MF877-00 Page 1
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01
Product End-of-Life Disassembly Instructions
Product Category: Networking
Marketing Name / Model
[List multiple models if applicable.]
JL725A Aruba 6200F 24G CL4 4SFP+ 370W SWCH Swch
JL727A Aruba 6200F 48G CL4 4SFP+ 370W Swch
Name / Model #3
Name / Model #4
Name / Model #5
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HPE products to remove components and materials requiring selective treatment, as defined by
Directive 2012/19/EU of the European Parliament and of the Council on Waste Electrical and Electronic Equipment
(WEEE).
1.0
Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
3
Batteries All types including standard alkaline and lithium
coin or button style batteries
1
Mercury-containing components For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
Liquid Crystal Displays (LCD) with a surface
greater than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
1
External electrical cables and cords
Gas Discharge Lamps
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
Components and waste containing asbestos
MF877-00 Page 2
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01
Item Description Notes
Quantity
of items
included
in product
Components, parts and materials containing
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description Tool Size (if
applicable)
Torque Driver (Standard)
Torque Bit T10
Torque Bit T25
Torque Bit M4 Philip
Head
Cutter
S
oldering Station
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Remove PULL OUT
2. Unscrew and remove – M5 SCREW at 1 Location
3. Unscrew and remove – M3 SCREW at 14 Locations and CHASSIS COVER
4. Remove – INSULATOR from CHASSIS COVER
5. Cut and remove – CABLE TIE at 2 location
6. Unplug - AC connector from POWER SUPPLY
7. Unplug – Cable connect between POWER SUPPLY and PCBA, MAIN BOARD
8. Unplug – POWER SUPPLY connector from PCBA, MAIN BOARD
9. Unplug - FAN connector from PCBA, MAIN BOARD
10. Remove – FAN CABLE from COVER, COMMON DIVERTER
11. Unplug –FFC CABLE from PCBA, LED BOARD
12. Unscrew – M3 SCREW at 2 Locations
13. Unscrew – M3 SCREW at 4 locations
14. Remove – CABLE and SHIELD PSU CABLE from CHASSIS
15. Slide out the POWER SUPPLY connector through the window opening slowly
16. Remove – POWER SUPPLY from CHASSIS
17. Unscrew and remove – M4 SCREW at 1 Location
18. Unplug –FFC CABLE from PCBA, MAIN BOARD
19. Unscrew and remove – M3 SCREW at 2 locations
20. Remove - PCA, LED BOARD
21. Remove - PUSHBUTTON
22. Unscrew and remove – M4 SCREW at 6 Locations and FAN
23. Unplug and remove - AC socket from CHASSIS
24. Remove – COIN BATTERY from BATTERY SOCKET
25. Unscrew and remove – M3 SCREW at 11 Locations and PCBA, MAIN BOARD
26. Remove - INSULATOR from CHASSIS
MF877-00 Page 3
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01
27. Remove – COVER, COMMON DIVERTER from CHASSIS
28. Remove – FRONT OVERLAY from CHASSIS
29. Desolder and Remove – Capacitor from PSU PCBA
30. Remove - SADDLE CABLE from SHIELD PSU CABLE
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
1
3
3
3
2
3
MF877-00 Page 4
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01
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MF877-00 Page 5
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01
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MF877-00 Page 6
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01
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MF877-00 Page 7
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01
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MF877-00 Page 8
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01
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0
MF877-00 Page 9
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01
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MF877-00 Page 10
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01
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