HPE Aruba 6200F Istruzioni per il montaggio

MF877-00 Page 1

Template Revision C, 30-July-2018

HPE instructions for this template are available at MF877-01

Product End-of-Life Disassembly Instructions

Product Category: Networking

Marketing Name / Model

[List multiple models if applicable.]

JL725A Aruba 6200F 24G CL4 4SFP+ 370W SWCH Swch

JL727A Aruba 6200F 48G CL4 4SFP+ 370W Swch

Name / Model #3

Name / Model #4

Name / Model #5

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HPE products to remove components and materials requiring selective treatment, as defined by

Directive 2012/19/EU of the European Parliament and of the Council on Waste Electrical and Electronic Equipment

(WEEE).

1.0

Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA)

With a surface greater than 10 sq cm

Batteries All types including standard alkaline and lithium

coin or button style batteries

Mercury-containing components For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface

greater than 100 sq cm

Includes background illuminated displays with gas

discharge lamps

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height

External electrical cables and cords

Gas Discharge Lamps

Plastics containing Brominated Flame Retardants

weighing > 25 grams (not including PCBs or PCAs

already listed as a separate item above)

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent

chambers, and service stations.

Components and waste containing asbestos

MF877-00 Page 2

Template Revision C, 30-July-2018

HPE instructions for this template are available at MF877-01

Item Description Notes

Quantity

of items

included

in product

Components, parts and materials containing

refractory ceramic fibers

Components, parts and materials containing

radioactive substances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

Tool Description Tool Size (if

applicable)

Torque Driver (Standard)

Torque Bit T10

Torque Bit T25

Torque Bit M4 Philip

Head

Cutter

oldering Station

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Remove PULL OUT

2. Unscrew and remove – M5 SCREW at 1 Location

3. Unscrew and remove – M3 SCREW at 14 Locations and CHASSIS COVER

4. Remove – INSULATOR from CHASSIS COVER

5. Cut and remove – CABLE TIE at 2 location

6. Unplug - AC connector from POWER SUPPLY

7. Unplug – Cable connect between POWER SUPPLY and PCBA, MAIN BOARD

8. Unplug – POWER SUPPLY connector from PCBA, MAIN BOARD

9. Unplug - FAN connector from PCBA, MAIN BOARD

10. Remove – FAN CABLE from COVER, COMMON DIVERTER

11. Unplug –FFC CABLE from PCBA, LED BOARD

12. Unscrew – M3 SCREW at 2 Locations

13. Unscrew – M3 SCREW at 4 locations

14. Remove – CABLE and SHIELD PSU CABLE from CHASSIS

15. Slide out the POWER SUPPLY connector through the window opening slowly

16. Remove – POWER SUPPLY from CHASSIS

17. Unscrew and remove – M4 SCREW at 1 Location

18. Unplug –FFC CABLE from PCBA, MAIN BOARD

19. Unscrew and remove – M3 SCREW at 2 locations

20. Remove - PCA, LED BOARD

21. Remove - PUSHBUTTON

22. Unscrew and remove – M4 SCREW at 6 Locations and FAN

23. Unplug and remove - AC socket from CHASSIS

24. Remove – COIN BATTERY from BATTERY SOCKET

25. Unscrew and remove – M3 SCREW at 11 Locations and PCBA, MAIN BOARD

26. Remove - INSULATOR from CHASSIS

MF877-00 Page 3

Template Revision C, 30-July-2018

HPE instructions for this template are available at MF877-01

27. Remove – COVER, COMMON DIVERTER from CHASSIS

28. Remove – FRONT OVERLAY from CHASSIS

29. Desolder and Remove – Capacitor from PSU PCBA

30. Remove - SADDLE CABLE from SHIELD PSU CABLE

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations).

MF877-00 Page 4

Template Revision C, 30-July-2018

HPE instructions for this template are available at MF877-01

MF877-00 Page 5

Template Revision C, 30-July-2018

HPE instructions for this template are available at MF877-01

MF877-00 Page 6

Template Revision C, 30-July-2018

HPE instructions for this template are available at MF877-01

MF877-00 Page 7

Template Revision C, 30-July-2018

HPE instructions for this template are available at MF877-01

MF877-00 Page 8

Template Revision C, 30-July-2018

HPE instructions for this template are available at MF877-01

MF877-00 Page 9

Template Revision C, 30-July-2018

HPE instructions for this template are available at MF877-01

MF877-00 Page 10

Template Revision C, 30-July-2018

HPE instructions for this template are available at MF877-01

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