Intel H110 Express Manuale utente

TECHNICAL MANUAL

Intel H110 Express Chipset

Based Mini-ITX M/B

NO. G03-IH110-F

Revision: 1.0

Release date: August 31, 2021

Trademark:

* Specifications and Information contained in this documentation are furnished for information use only, and are

subject to change at any time without notice, and should not be construed as a commitment by manufacturer.

Environmental Protection Announcement

Do not dispose this electronic device into the trash while discarding. To minimize

pollution and ensure environment protection of mother earth, please recycle.

ENVIRONMENTAL SAFETY INSTRUCTION......................................................................iii

USER’S NOTICE ..................................................................................................................iv

MANUAL REVISION INFORMATION..................................................................................iv

ITEM CHECKLIST................................................................................................................iv

CHAPTER 1 INTRODUCTION OF THE MOTHERBOARD

1-1 FEATURE OF MOTHERBOARD................................................................................1

1-2 SPECIFICATION.........................................................................................................2

1-3 LAYOUT DIAGRAM....................................................................................................3

CHAPTER 2 HARDWARE INSTALLATION

2-1 JUMPER SETTING .....................................................................................................8

2-2 CONNECTORS AND HEADERS................................................................................14

2-2-1 CONNECTORS .............................................................................................14

2-2-2 HEADERS .....................................................................................................19

CHAPTER 3 INTRODUCING BIOS

3-1 ENTERING SETUP .....................................................................................................22

3-2 BIOS MENU SCREEN ................................................................................................23

3-3 FUNCTION KEYS .......................................................................................................24

3-4 GETTING HELP ..........................................................................................................24

3-5 MENU BARS...............................................................................................................24

3-6 MAIN MENU................................................................................................................25

3-7 ADVANCED MENU.....................................................................................................26

3-8 CHIPSET MENU..........................................................................................................41

3-9 SECURITY MENU.......................................................................................................45

3-10 BOOT MENU...............................................................................................................47

3-11 SAVE & EXIT MENU...................................................................................................49

TABLE OF CONTENT

iii

Environmental Safety Instruction

⚫Avoid the dusty, humidity and temperature extremes. Do not place the product in

any area where it may become wet.

⚫0 to 40 centigrade is the suitable temperature. (The temperature comes from the

request of the chassis and thermal solution)

⚫Generally speaking, dramatic changes in temperature may lead to contact

malfunction and crackles due to constant thermal expansion and contraction from

the welding spots’ that connect components and PCB. Computer should go

through an adaptive phase before it boots when it is moved from a cold

environment to a warmer one to avoid condensation phenomenon. These water

drops attached on PCB or the surface of the components can bring about

phenomena as minor as computer instability resulted from corrosion and oxidation

from components and PCB or as major as short circuit that can burn the

components. Suggest starting the computer until the temperature goes up.

⚫The increasing temperature of the capacitor may decrease the life of computer.

Using the close case may decrease the life of other device because the higher

temperature in the inner of the case.

⚫Attention to the heat sink when you over-clocking. The higher temperature may

decrease the life of the device and burned the capacitor.

USER’S NOTICE

INCLUDING THE PRODUCTS AND SOFTWARE DESCRIBED IN IT MAY BE REPRODUCED, TRANSMITTED

OR TRANSLATED INTO ANY LANGUAGE IN ANY FORM OR BY ANY MEANS WITHOUT WRITTEN

PERMISSION OF THE MANUFACTURER.

THIS MANUAL CONTAINS ALL INFORMATION REQUIRED TO USE THIS MOTHER-BOARD SERIESANDWE

DO ASSURE THIS MANUAL MEETS USER’S REQUIREMENT BUT WILL CHANGE, CORRECT ANY TIME

WITHOUT NOTICE. MANUFACTURER PROVIDES THIS MANUAL “AS IS” WITHOUT WARRANTY OF ANY

KIND, AND WILL NOT BE LIABLE FOR ANY INDIRECT, SPECIAL, INCIDENTAL OR CONSEQUENTIAL

DAMAGES (INCLUDING DAMAGES FOR LOSS OF PROFIT, LOSS OF BUSINESS, LOSS OF USE OF DATA,

INTERRUPTION OF BUSINESS AND THE LIKE).

PRODUCTS AND CORPORATE NAMES APPEARING IN THIS MANUAL MAY OR MAY NOT BE

REGISTERED TRADEMARKS OR COPYRIGHTS OF THEIR RESPECTIVE COMPANIES, AND THEY ARE

USED ONLY FOR IDENTIFICATION OR EXPLANATION AND TO THE OWNER’S BENEFIT, WITHOUT

INTENT TO INFRINGE.

Manual Revision Information

Reversion Revision History Date

1.0 First Edition August 31, 2021

Item Checklist

Motherboard

Cable(s)

I/O Back panel shield

Chapter 1

Introduction of the Motherboard

1-1 Feature of Motherboard

⚫Intel®H110 express chipset

⚫Support LGA 1151 CPU socket Intel®Core™ i7 processors / Intel®Core™ i5

processors / Intel®Core™ i3 processors / Intel®Pentium™ processors / Intel®

Celeron™ processors (TDP ≤65 W).

⚫Support 2* DDR4 2133MHz SO-DIMM up to 32GB and dual channel function

⚫Integrated with 1* Intel i219V Gigabit Ethernet LAN chip, 1* Intel i211AT Gigabit

Ethernet LAN chip

⚫Support USB 3.0 data transport demand

⚫Support 2 * SATAIII (6Gb/s) Devices

⚫Support 1* VGA port & 1* HDMI port

⚫Support 1* PCIE 2.0 x16 slot

⚫Support 1* full-size Mini-PCIE/mSATA slot

⚫Support 1* M.2 Socket 3 slot for M-key type 2242/2260 SATA SSD

⚫Support Smart FAN function

⚫Supports ACPI S3 Function

⚫Compliance with ErP Standard

⚫Support Watchdog Timer Technology

1-2 Specification

Spec

Description

Design

⚫Mini-ITX form factor 6 layers; PCB size: 17.0x17.0cm

Chipset

⚫Intel H110 Express Chipset

CPU Socket

⚫Support Intel®LGA 1151 Socket Core™ i7 processors, Intel®

Core™ i5 processors, Intel®Core™ i3 processors, Intel®

Pentium™ processors, Intel®Celeron™ processors

* for detailed CPU support information please visit our website

Memory Slot

⚫2*DDR4 SO-DIMM slot

⚫Support DDR4 2133 MHz SO-DIMM up to 32GB

⚫Support dual channel function

Expansion Slot

⚫1* PCIE x 16 slot

⚫1* Full-size Mini-PCIE/ MSATA shared slot (MPE1)

Storage

⚫2* SATA III 6G/s connector

⚫1 * full-size Mini-PCIE/ MSATA shared slot (MPE1)

⚫1* M.2 Socket 3 slot (M-key, support type 2242/2260 SATA

SSD)

Gigabit LAN Chip

⚫Integrated with 1* Intel i219V Gigabit Ethernet LAN chip, 1*

Intel i211AT Gigabit Ethernet LAN chip

⚫Support Fast Ethernet LAN function of providing

10/100/1000Mbps Ethernet data transfer rate

BIOS

⚫AMI 64Mb Flash ROM

Multi I/O

Rear Panel I/O:

⚫3* Serial port connector, 1* VGA port

(COM1_COM2/COM3_VGA, COM1 supports

RS232/422/485 function )

⚫1* HDMI port

⚫4* USB 3.0 port

⚫2* RJ-45 LAN port

⚫1*3-jack audio connector

Internal I/O Connectors& Headers:

⚫1*24-pin main power connector

⚫1*4-pin 12V power connector

⚫1*CPUFAN connector & 1* SYSFAN connector

⚫1*Front panel audio header

⚫1*SPDIF-out header

⚫1*Front panel header

⚫1*9-Pin USB 2.0/1.1 header for 2* USB 2.0/1.1 ports

⚫1*4-Pin USB 2.0/1.1 header for 1* USB 2.0/1.1 ports

⚫1*USB 2.0 vertical connector

⚫1*PS2 Keyboard & Mouse header

⚫1*SMBUS header

⚫1*GPIO header

⚫2*Serial port header (COM5/6,COM5 support

RS232/422/485)

⚫1*Jumper & Header Combo Block (JP1)

⚫1*EDP connector

1-3 Layout Diagram

Rear IO Diagram

Serial Port (COM1)

Serial Port

(COM2)

Serial Port (COM3)

VGA

HDMI Port

RJ-45 LAN Ports

USB 3.0 Ports

Line-IN

Line-OUT

MIC-IN

Motherboard Internal Diagram-Front

Note: SIM card slot only work when compatible SIM card installed & 3G LAN card installed in MPE1 Mini-PCIE slot.

VGA (Top)

COM port (Bottom)

COM Ports

RJ-45 LAN Ports

Over

USB 3.0 Ports

HDMI Port

LINE-OUT

/MIC Port

ATX Power

Connector

ATX 12V

Power Connector

CPUFAN Header

LGA 1151

CPU Socket

Intel H110 Chipset

PCI Express 2.0 x 16 Slot (PCIE1)

USB 2.0

Headers

Serial Port Headers

(COM5~6)

EDP

Connector

*DDR4 SODIMM Slot

(SODIMM1/2)

SATAIII Ports

(SATA1/2)

SYSFAN1 Header

Front Panel

Header

*SIM Card

Slot

*Full-size

Mini-PCIE/MSATA

Slot (MPE1)

SPDIF_OUT

Header

GPIO Header

PS/2 Keyboard & Mouse

Header

M.2 Socket 3

Connector

(MH1/2)

SUBUS Header

USB 2.0

Virtical Connector

Motherboard Jumper Position

JCOMP2

JP2

JCOMP1

JCOMP3

EDP_BKPWR

EDP_LCDPWR

JP1: Jumper & Header

Combo Block

MPE_PWR

JP_TEST

JBAT

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