Intel QM77 Manuale utente

Document Number: 328076-001

Intel® Core™ i5-3610ME

Processor (PGA) and

Mobile Intel® QM77 Express

Chipset Development Kit

User Guide

November 2012

Introduction

Intel® Core™ i5-3610ME Processor (PGA) and Mobile Intel® QM77 Express Chipset Development Kit

User Guide November 2012

2 Document Number: 328076-001

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Introduction

Intel® Core™ i5-3610ME Processor (PGA) and Mobile Intel® QM77 Express Chipset Development Kit

November 2012 User Guide

Document Number: 328076-001 3

Contents

1Introduction ...................................................................................................... 6

1.1 Terminology ........................................................................................... 6

1.2 Reference Documents.............................................................................. 8

1.3 Development Kit Items ............................................................................ 8

2Features ........................................................................................................... 9

3Power management ..........................................................................................12

3.1 Power Management States ......................................................................12

4Reference Board Summary ................................................................................14

4.1 Connectors............................................................................................17

4.1.1 Back Panel Connectors ..............................................................17

4.1.2 Configuration Settings...............................................................17

4.1.3 Header Pinout Configuration.......................................................19

4.1.3.1 J3C2/J3C1- Dual Channel LVDS Data Connector ............20

4.1.3.2 Embedded Display Port (eDP) connector .......................21

4.1.3.3 Front Panel Status Indicating and Control Connector ......22

4.2 Power On and Reset Buttons ...................................................................23

Figures

Figure 1. Block Diagram................................................................................................... 9

Figure 2. Board Layout - Top view....................................................................................14

Figure 3. Board Layout –Bottom view ..............................................................................15

Figure 4. Back Panel Connectors ......................................................................................17

Tables

Table 1. Terminology...................................................................................................... 6

Table 2. Reference Documents ........................................................................................ 8

Table 3. Feature set summary ......................................................................................... 9

Table 4. Power Management States Description ................................................................12

Table 5. Development Kit states .....................................................................................12

Table 6. Components list ...............................................................................................16

Table 7. J1D3-Clear/Keep CMOS Setting ..........................................................................17

Table 8. J1D2-Clear/Keep ME Register Setting ..................................................................18

Table 9. J1B1-Flash descriptor security override ...............................................................18

Table 10. J1D1-Enable the Operating Voltage of LVDS and eDP ............................................18

Table 11. J4C1-Select LVDS panel Operating Voltage ..........................................................18

Table 12. J3F2-Select eDP panel Operating Voltage.............................................................18

Table 13. J2G1/J2G2/J2G3 USB Port .................................................................................19

Introduction

Intel® Core™ i5-3610ME Processor (PGA) and Mobile Intel® QM77 Express Chipset Development Kit

User Guide November 2012

4 Document Number: 328076-001

Table 14. J2C1/J1C1Serial Port.........................................................................................19

Table 15. J2B1 GPIO Header ............................................................................................19

Table 16. J3B1- TPM Pin Header .......................................................................................20

Table 17. J4C2-LVDS Backlight Control Connector ..............................................................20

Table 18. J3C2 LVDS1 Connector ......................................................................................21

Table 19. J3C1 LVDS2 Connector ......................................................................................21

Table 20. J3F1 Embedded Display Port (eDP) Connector ......................................................22

Table 21. J1G3 Power Switch and HDD Indicator header......................................................22

Table 22. J1G1 Power Indicator Header .............................................................................23

Table 23. J1G2 Speaker Output Header .............................................................................23

Introduction

Intel® Core™ i5-3610ME Processor (PGA) and Mobile Intel® QM77 Express Chipset Development Kit

November 2012 User Guide

Document Number: 328076-001 5

Revision History

Date

Revision

Description

November 2012

1.0

Initial release.

Introduction

Intel® Core™ i5-3610ME Processor (PGA) and Mobile Intel® QM77 Express Chipset Development Kit

User Guide November 2012

6 Document Number: 328076-001

1Introduction

This User Guide describes the typical hardware set-up procedures, features, and use

of the Intel® Core™ i5-3610ME Processor (PGA) and Mobile Intel® QM77 Express

Chipset Development Kit. Read this document in its entirety prior to powering ON. The

Quick Start document provides quick start procedures for reference. It is

recommended to have the schematics present as you proceed through this document.

The Intel® Core™ i5-3610ME Processor (PGA) and Mobile Intel® QM77 Express

Chipset Development Kit is a dual channel DDR3 mobility platform. It is designed to

support the Ivy Bridge and Sandy Bridge processors and the Panther Point-M Chipset.

1.1 Terminology

Table 1. Terminology

Term

Description

ACPI

Advanced Configuration + Power Interface

AHCI

Advanced Host Controller Interface for Serial ATA

BCLK

FSB Clock used for CPU Clock domain (Eg: 167/200/266/333)

BIOS

Basic Input Output System

CMOS

Refers to the non-volatile configuration memory in the PCH

DDR3

Double Data Rate Synchronous Dynamic Random Access Memory third

generation

Display Port

DVI

Digital Visual Interface

eDP

Embedded Display Port

GND

Signal Ground

HDD

Hard disk drive

HDMI

High Definition Multimedia Interface

HSD

High Speed Database

IMVP-6

Intel Mobile Voltage Positioning 6

ITP-XDP

In-target-probe –eXtended debug port

Introduction

Intel® Core™ i5-3610ME Processor (PGA) and Mobile Intel® QM77 Express Chipset Development Kit

November 2012 User Guide

Document Number: 328076-001 7

Term

Description

JTAG

Joint Test Action Group, IEEE 1149.1 standard for test access port and

boundary scan.

LVDS

Low-voltage Differential Signaling

Operating System

PCH

Platform Controller Hub

PCI

Peripheral Component Interface

PCIe

Peripheral Component Interface Express

POST

Power-On Self Test

PPT

Panther Point

PS2

Programming System 2 (IBM) defines keyboard and mouse interface

“Save to RAM” Sleep State

“Soft Off” Sleep State

SATA

Serial - Advanced Technology Attachment

SIO

Super Input Output device

SLP

Sleep

SMBUS

System Management Bus, a two wire serial bus used for low-

bandwidth communication

SO-DIMM

Memory Module

USB

Universal Serial Bus

VAC

Volt AC

VCC

Used to signify circuit logic voltage

VDC

Volt DC

VDD

Used to signify DIMM logic supply voltage

VGA

Video Graphics Array

VID

Voltage Identification

VREF

Voltage reference

VSS

Used to signify ground connection

VTT

Used to signify signal termination voltage

Introduction

Intel® Core™ i5-3610ME Processor (PGA) and Mobile Intel® QM77 Express Chipset Development Kit

User Guide November 2012

8 Document Number: 328076-001

Term

Description

VTT

Voltage Transient Test tool

XDP

eXtended Debug Port (See ITP-XDP)

1.2 Reference Documents

Table 2. Reference Documents

Document

No./Location

Intel® Core™ i5-3610ME Processor (PGA) and Mobile Intel® QM77 Express

Chipset Development Kit Quick Start Guide

328077

1.3 Development Kit Items

The development kits include these items.

Note: All kit items need to be specifically ordered

•Board

•Fanless Chassis

•2G DDR3 non ECC SO-DIMM memory

•150W power adaptor

•SATA + power cable (custom made)

•60G SSD Hard Disk

•Intel® Core™ i5-3610ME Processor (PGA) and Mobile Intel® QM77 Express

Chipset Development Kit Quick Start

•DVD installer driver

Features

Intel® Core™ i5-3610ME Processor (PGA) and Mobile Intel® QM77 Express Chipset Development Kit

November 2012 User Guide

Document Number: 328076-001 9

2Features

Figure 1. Block Diagram

Table 3. Feature set summary

Feature

Description

Implementation

Comments

Processor

Ivy Bridge-Mobile processor

supported in 989pin rPGA

package

Ci5 Ivy Bridge 2C CR i5-3610ME 2.7G 3M

Refdes on board: U5E1

Chipset

Panther Point- M

989-pin FCBGA Foot-Print;

Refdes on board: U3D1

Memory

2x DDR3 SODIMM non ECC

slots

Maximum capacity of 8GB using 4Gb

technology;

Minimum capacity of 256 MB using 512 Mb

technology;

Supports DDR3 frequency of up to 1600

MT/s with Ivy Bridge;

Refdes on Board: DIMM1, DIMM 2

Features

Intel® Core™ i5-3610ME Processor (PGA) and Mobile Intel® QM77 Express Chipset Development Kit

User Guide November 2012

10 Document Number: 328076-001

Feature

Description

Implementation

Comments

SIO

NCT6776F

Nuvoton LPC I/O;

Refdes on Board:U2D1

Video

1x 24-bit dual channel

LVDS Interface

There are 3 connectors on board:

2 LVDS 20pins data connector

Redfes on Board:J3C2, J3C1

1 LVDS backlight connector

Redfes on Board:J4C2

Embedded Display Port

(eDP)

x4 eDP (18bit, single channel) from CPU

connected to onboard eDP connector

Redfes on Board:J3F1

Display Port

Connect from chipset Port B to DP

connector

Redfes on Board:J3A2

HDMI

Connect from chipset Port C to HDMI

connector

Redfes on Board:J4A1

DVI-D

Connect from chipset Port D to DVI-D

connector

Refdes on board: J6A1

SDVO

N/A in this Development Kit

CRT

On Board right-angled CRT Connector

Refdes on board: J6A1

PCI Express

8x PCIe lanes from Panther

Point

PCI Express 2.0 Compliance, 2.5GT/s

PCIe1-4 to PCIe x4 slot

Refdes on board: J1B2

PCIe5, PCIe 6 to 2 PCIe x1 slot (optional)

Refdes on board: J1F2, J1A1

PCIe7 to WLAN mini PCIe

Refdes on board: J6R1

PCIe8 to 82579 (Lewisville) LAN

On-Board LAN

82579 (Lewisville) PHY

supported

Refdes on board: U2C1

BIOS (SPI)

SPI flash devices

Support for multi-vendor SPI;

2x 4MB SOIC-8 parts provided on board.

Refdes on board: U2E4, U2E3

Support multi package (SOIC-8 & SOIC-16)

(optional)

Refdes on board: U2E2, U2E1

SATA

2x SATA III Ports

SATA connector with 4 pin power header on

board

SATA III connector

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