TABLE O CONTENTS
1 INTRODUCTION............................................................................................................5
1.1 ABOUT THIS MANUAL........................................................................................................5
1.2 SA ETY PRECAUTIONS AND HANDLING.........................................................................5
1.3 ELECTROSTATIC DISCHARGE (ESD) PROTECTION.......................................................5
1.4 EQUIPMENT SA ETY..........................................................................................................5
1.5 MANUAL REVISIONS...........................................................................................................6
1.5.1 RELATED PRODUCTS.................................................................................................6
1.5.2 REVISION HISTORY....................................................................................................6
1.6 RELATED DOCUMENTATION.............................................................................................6
1.7 ORDERING IN ORMATION.................................................................................................7
1.7.1 Mainboards.................................................................................................................... 7
1.7.2 Housing Options............................................................................................................ 8
2 SPECI ICATION............................................................................................................9
2.1 ELECTRICAL........................................................................................................................ 9
2.1.1 Processor...................................................................................................................... 9
2.1.2 BIOS.............................................................................................................................. 9
2.1.3 Memor .......................................................................................................................... 9
2.1.4 Graphics........................................................................................................................ 9
2.1.5 Mass Storage................................................................................................................ 9
2.1.6 Intel AMT (onl supported b XEON and i7)..................................................................9
2.1.7 EC (Embedded Controller)............................................................................................9
2.1.8 Ethernet....................................................................................................................... 10
2.1.9 Indicators..................................................................................................................... 10
2.1.10 TPM 2.0..................................................................................................................... 10
2.1.11 Ignition and Power Button Signal...............................................................................10
2.1.12 Serial Ports (Optional Modules).................................................................................10
2.1.13 Interfaces................................................................................................................... 10
2.2 PHYSICAL.......................................................................................................................... 11
2.3 POWER............................................................................................................................... 12
2.3.1 POWER INPUT........................................................................................................... 12
2.3.2 Internal 12V Buck-Boost Converter (Peripheral Power, CPU, Chipset).......................12
2.3.3 POWER DISSIPATION............................................................................................... 12
2.4 ENVIRONMENTAL CONDITIONS...................................................................................... 12
3 HARDWARE RE ERENCE.........................................................................................13
3.1 PIP4x................................................................................................................................... 13
3.2 PIP4x-xHx (Header Version).............................................................................................15
3.3 PIP4xS (Short Version)......................................................................................................16
3.4 PIP4xS-xHx (Short Header Version)................................................................................18
3.5 Connector Description...................................................................................................... 19
3.5.1 Power Connector (J3).................................................................................................. 19
3.5.2 Alternative Power Connector (J1/J2 (horizontal/vertical))............................................19
3.5.3 12V Peripheral (J34).................................................................................................... 19
3.5.4 USB 3.1 (J17, J22, J85, J86).......................................................................................19
3.5.5 LAN (J28).................................................................................................................... 19
3.5.6 Other Interfaces........................................................................................................... 20
3.5.7 Serial1-4 LVTTL Connector (J23, J25, J29, J30).........................................................20
3.5.8 USB2.0 Header Connectors (J37, J31, J92, J39, *J19, *J21, *J24, *J26, *J86, *J87,
*J90, *J91)............................................................................................................................. 20
2023 b MPL AG 2 MEH-1088-001 Rev. D