NPM Motionnet G9006 Manuale utente

TA600032-EN0/0

Motionnet® Function Expansion LSI

G9006

User’s Manual

RoHS2

2011/65/EU

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INDEX 
 
Introduction ...............................................................................................................................................................1
1 How to use this manual..................................................................................................................................1
1.1 Symbol description .......................................................................................................................................1
1.2 Terminology ..................................................................................................................................................3
1.3 Notations ......................................................................................................................................................4
2 Handling the product ......................................................................................................................................5
2.1 Storing ..........................................................................................................................................................5
2.2 Unpacking.....................................................................................................................................................5
2.3 Safety ...........................................................................................................................................................5
3 Product Warranty............................................................................................................................................9
3.1 Warranty period ............................................................................................................................................9
3.2 Warranty scope.............................................................................................................................................9
4 Notice .............................................................................................................................................................9
5 Confirmation ...................................................................................................................................................9
Overview .................................................................................................................................................................10 
1 Features .......................................................................................................................................................10 
1.1 'I/O communication' state monitor ..............................................................................................................10 
1.2 Communication between CPUs .................................................................................................................11 
1.3 General-purpose one-shot signal output....................................................................................................12 
1.4 Broadcast command reception...................................................................................................................13 
1.5 Interrupt occurrence ...................................................................................................................................13 
2 Configuration ................................................................................................................................................14 
2.1 Local operation mode (message communication) .....................................................................................14 
2.2 Monitor operation mode (local information monitor)...................................................................................15 
Specification............................................................................................................................................................16 
1 Motionnet® specifications .............................................................................................................................16 
2 G9006 specifications....................................................................................................................................17 
Hardware description..............................................................................................................................................18 
1 External dimensions.....................................................................................................................................18 
2 Pin layout......................................................................................................................................................20 
3 Pin list...........................................................................................................................................................21 
4 Pin description..............................................................................................................................................23 
4.1 CLK [8]........................................................................................................................................................23 
4.2 CKSL [5] .....................................................................................................................................................23 
4.3 RST [23] .....................................................................................................................................................23 
4.4 SPD0 [1], SPD1 [2].....................................................................................................................................23 
4.5 SI [44], SO [41], SOEH [43]........................................................................................................................23 

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4.6 SOEI [46] ....................................................................................................................................................23 
4.7 MRER [37] ..................................................................................................................................................24 
4.8 MSEL [38]...................................................................................................................................................24 
4.9 TOUT [40]...................................................................................................................................................24 
4.10 BCST [3] ...................................................................................................................................................24 
4.11 DMOD [47]................................................................................................................................................24 
4.12 SS [16], SCK [17], MOSI [19], MISO [14].................................................................................................25 
4.13 A0 [20], A1 [22] .........................................................................................................................................25 
4.14 PORT0 [25], PORT1 [26], PORT2 [28] ....................................................................................................25 
4.15 PORT3 [29], PORT4 [31], PORT5 [32], PORT6 [34], PORT7 [35] ..........................................................25 
4.16 DN0 [28], DN1 [29], DN2 [31], DN3 [32], DN4 [34], DN5 [35]..................................................................25 
4.17 RSV0 [37], RSV1 [38], RSV2 [40] ............................................................................................................26 
4.18 SHT0 [11], SHT1 [12] ...............................................................................................................................26 
4.19 INT [13] .....................................................................................................................................................26 
4.20 VDD [4, 15, 21, 27, 33, 39, 45].................................................................................................................26 
4.21 GND [6, 7, 9, 10, 18, 24, 30, 36, 42, 48] ..................................................................................................26 
5 'Motionnet®' interface....................................................................................................................................27 
5.1 Single-step connection circuit.....................................................................................................................27 
5.2 Multi-steps connection circuit .....................................................................................................................28 
6 '4-wire serial' interface..................................................................................................................................29 
6.1 Single connection circuit.............................................................................................................................29 
6.2 Multiple connection circuit ..........................................................................................................................29 
Software description ...............................................................................................................................................30 
1 'Motionnet®' access ......................................................................................................................................30 
1.1 I/O communication......................................................................................................................................30 
1.2 System communication ..............................................................................................................................30 
1.3 Broadcast communication ..........................................................................................................................31 
1.4 Break communication.................................................................................................................................31 
2 '4-wire serial' access ....................................................................................................................................32 
2.1 Control method...........................................................................................................................................32 
2.2 Control commands .....................................................................................................................................35 
2.3 Registers ....................................................................................................................................................47 
2.4 Operation commands .................................................................................................................................57 
2.5 Status (MSTS)............................................................................................................................................59 
2.6 Port data memory.......................................................................................................................................61 
2.7 Port change interrupt setting memory ........................................................................................................62 
2.8 Port change interrupt flag memory .............................................................................................................63 
2.9 Local LSI connection state memory ...........................................................................................................63 
Feature Description ................................................................................................................................................64 
1 Reset ............................................................................................................................................................64 
1.1 Hardware reset...........................................................................................................................................64 
1.2 Software reset ............................................................................................................................................64 
2 Operation mode............................................................................................................................................65 
2.1 Local operation mode (message communication) .....................................................................................65 
2.2 Monitor operation mode (local information monitor)...................................................................................67 

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3 Device number setting..................................................................................................................................69 
3.1 Device number ...........................................................................................................................................69 
3.2 Virtual local LSI additional count ................................................................................................................70 
3.3 Virtual local LSI additional count setting error............................................................................................71 
4 One-shot signal output .................................................................................................................................72 
4.1 'General-purpose one-shot 0' signal (SHT0 pin) ........................................................................................72 
4.2 'General-purpose one-shot 1' signal (SHT1 pin) ........................................................................................74 
4.3 'Broadcast one-shot' signal (BCST pin)......................................................................................................76 
5 General-purpose input / output pin control...................................................................................................77 
6 Relative time management ..........................................................................................................................78 
6.1 Relative time management counter (RTMC)..............................................................................................78 
6.2 Relative time latch (RTLT) ..........................................................................................................................78 
7 ID code reading ............................................................................................................................................78 
8 Interrupt request ...........................................................................................................................................79 
8.1 Interrupt request signal...............................................................................................................................79 
8.2 Interrupt factors ..........................................................................................................................................80 
Electrical characteristics .........................................................................................................................................86 
1 Absolute maximum ratings...........................................................................................................................86 
2 Recommended operating conditions............................................................................................................86 
3 DC characteristics ........................................................................................................................................87 
4 AC characteristics ........................................................................................................................................88 
4.1 Reference clock..........................................................................................................................................88 
4.2 '4-wire serial' bus........................................................................................................................................89 

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1. Introduction

Thank you for choosing "Motionnet®" Function Expansion LSI "G9006" for your application this time.

This manual describes the specifications, functions, connecting methods, and usages of "G9006".

Be sure to read this manual thoroughly and keep it handy in order to use this product appropriately.

1.1 How to use this manual

1. Reproduction of this manual in whole or in part without permission is prohibited by the Copyright Act.

2. The contents of this manual are subject to change without prior notice along with the improvement of performance and

quality.

3. Although this manual is produced with the utmost care, please contact our sales representative if there are any questions,

errors or omissions.

1.1.1 Symbol description

1.1.1.1 Physical damage level

In this manual, the physical damage level is defined as follows.

•Serious injury

Those that might cause aftereffects such as loss of sight, injury, burn, electric shock, fracture, poisoning, or those

requiring hospitalization or long-term outpatient treatment.

•Minor injury

Those not requiring hospitalization or long-term outpatient treatment. (Other than "serious injury" above)

1.1.1.2 Hazardous level

The product is designed with the top priority for the safety of operators. However, due to the nature of the product, there are

risks that cannot be eliminated. In this manual, the seriousness and level of these risks are divided into three categories:

"Danger," "Warning," and "Caution". Be sure to read and understand the symbols descriptions thoroughly before operating or

performing maintenance work on the product.

"Danger", "Warning", and "Caution" are indicated in the order of severity of hazard: (danger > warning > caution), and the

meanings are described underneath.

D a n g e r

"Danger" indicates that it might cause an imminent risk that could result in the death or serious injury of the operator during

operations of this product.

War n i n g

"Warning" indicates that it may result in the death or serious injury of the operator during operations of this product.

C a u t i o n

"Caution" indicates that it may result in minor injury of the operator during operations of this product.

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Cau t i o n

"Caution" without warning symbol indicates that the operator is not likely to be injured, but it can cause damage or

result in a malfunction to this product or your instruments.

In addition to the hazardous level classifications described above, the following notations are also used.

I m p o r t a n c e

"Importance" indicates the information and contents that must be known particularly in operations and maintenance works of

this product.

R e m a r k s

"Remarks" indicates the useful information or contents for operations and maintenance works of this product.

1.1.1.3 Warning symbol

In this manual, the following symbols are added along with the notations "danger," "Warning," "Caution," and "Importance" to

indicate the warning contents in an easy-to-understand manner.

This symbol indicates that mishandling may cause a fire.

This symbol indicates "prohibited” actions that must not be performed in the

operation and the maintenance work of this product.

This symbol indicates “mandatory” actions that must be performed in the

operation and the maintenance work of this product.

This symbol indicates that a high voltage may be applied.

Failure to confirm safety or mishandling of the product might cause a risk of

electric shock, burn, or death.

This symbol indicates that some parts have a high surface temperature and

the mishandling can cause a risk of burns.

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1.1.2 Terminology

Terminology used in this manual is described below.

Refer to the following web page for terms that are not described in this section:

<https://www.pulsemotor.com/technology/terms/> [only Japanese]

Table 1.1-1 Motionnet® Product Lineup

Device

Type

Model

Product

CPU

Center

Center LSI

G9001A

Necessary

Local

Local LSI

I/O device

G9002A

Unnecessary

G9205A

Unnecessary

G9006

Necessary

Data device

G9103C

Optional

G9004A

Optional

Monitor

G9006

Necessary

Hub

HUB-LSI

G9H50A

Unnecessary

⚫Center LSI

LSI product "G9001A".

⚫Local LSI

LSI products such as "G9002A", "G9103C", "G9004A", and "G9205A".

⚫Center CPU

CPU connected to "Center LSI".

⚫Local CPU

CPU connected to "Local LSI".

⚫Request frame

Request from "Center LSI" to "Local LSI".

This includes the "Device number" of the destination.

⚫Response frame

Response from "Local LSI" to "Center LSI".

This includes the "Device number" of the sender.

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1.1.3 Notations

(1) Negative logic pin names and negative logic signal names are not decorated with overline, etc.

For details on the logic, see "4.3 Pin list".

(2) "0" in bit description of registers indicates that only "0" can be written and only "0" can be read out.

(3) The specific bit of status and register are shown as "status name. bit name" or "register name. bit name".

(For example, RADD.MONI represents the MONI bit in RADD register.)

(4) If there is a description of time, the value at "Internal clock frequency = 40 MHz" is shown unless otherwise

specified.

(5) Regarding the signal state of "ON" or "OFF", "H level" or "1" indicates "ON" in the case of positive logic.

"L level" or "0" indicates "ON" in the case of negative logic.

(6) The numeric suffix "b" represents a binary number, and "h" represents a hexadecimal number.

No suffix is added to a decimal number.

Even if it is a binary or hexadecimal number, a suffix is not added in some graphs when the binary or hexadecimal

number is the same as the decimal number.

(7) The range of consecutive bit positions is indicated by " : ".

(For example, MSTS [7:0] represents the 7th to 0th bits of MSTS.)

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1.2 Handling the product

1.2.1 Storing

Store the product in an environment where condensation does not occur at a temperature of -65 to +150°C.

1.2.2 Unpacking

When unpacking, make sure that the ordered quantity of product and moisture-proof desiccant are included.

1.2.3 Safety

This section describes basic safety precautions for safer operations.

Follow the instructions below when you use the product. Failure to comply with the items may result in injuries or disasters.

1.2.3.1 Precautions for design

C a u t i o n

⚫Use a product within the range of rated voltage, temperature, input / output voltage, and current. If it

is used outside the rated range, the failure rate may increase even if it operates normally during a

short period of time. Even within a rated range, the failure rates vary with the operating temperature

and the voltage. Take this into account when designing your equipment. Do not exceed the absolute

maximum rating even for a moment.

⚫Avoid the influence of heat generation from the surroundings and keep the ambient temperature of

the LSI as low as possible.

⚫Latch-up phenomenon can cause heat and smoke, so be aware of the following:

Be sure to keep the voltage levels of input / output pins within the absolute maximum rating ranges.

Consider the power-on timing.

Make sure that no abnormal noise enters LSI.

Unused input pins must be connected to VDD or GND, or must be pulled-up or pulled-down.

Pull-up or pull-down the potential of unused bidirectional pins.

Do not short-circuit the output.

Protect against induction or static electricity etc. from a high-voltage generator circuit.

⚫Do not apply excessive voltage to the LSI due to noise, surge, static electricity, etc.

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1.2.3.2 Precautions for transportation and storage

C a u t i o n

⚫Handle LSIs and LSI packages with care. Do not throw or drop LSIs. Otherwise, the LSI may be

damaged, or the aluminum laminate package may be broken so that the airtightness may be impaired.

⚫Do not store it where there is a risk of getting wet or being exposed to direct sunlight.

⚫Do not store it where toxic gas (corrosive gas, etc.) is generated or where there is a lot of dust.

⚫When storing the product, use an antistatic storage container to prevent pressure on the LSI.

⚫Follow the shipping box precautions during transportation and storage.

⚫Keep storage temperature and humidity below 30°C and 70% RH.

⚫Store in a place with little temperature change.

⚫Rapid temperature changes during storage can cause condensation which cause lead wire oxidation

and corrosion that reduce solder wettability.

⚫Install an antistatic mat on the surface of storage shelf and ground the mat surface.

(resistance between surface and ground is 7.5 × 105 to 1 × 109 Ω)

⚫When re-storing LSI after removing it from its package, use an antistatic storage container.

Indice

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