Panasonic DVD-S75EG Manuale utente

ORDERNO.CHM0305012C2

DVDPlayer

DVD-S75EG / DVD-S75EB/ DVD-S75E

DL2S MechanismSeries

Colour

(S).......................SilverType

(K).......................Black Type(S75EG/E Only)

SPECIFICATIONS

Specifications

Power supply: AC220-240 V, 50 Hz

Power consumption: 17 W

Dimensions: 430 (W)×303 (D)×52 (H)mm

(excluding protrusions)

Mass: 2.7kg

Signal system: PAL625/50, PAL525/60, NTSC

Operating temperature range: +5 to +35°C

Operating humidityrange: 5 to 90 %RH (no

condensation)

Region number: Region No.2

Discs played [8cm or12 cm]:

(1) DVD-RAM(DVD-VRcompatible)

(2) DVD-Audio

(3) DVD-Video

(4) DVD-R(DVD-Video compatible)

(5) CD-Audio (CD-DA)

(6) Video CD

(7) SVCD (Conforming to IEC62107)

(8) CD-R/CD-RW(CD-DA, Video CD, Supper Video-CD

formatted discs)

(9) MP3/WMA

Maximumnumber oftracks and groups

recognizable:

999 tracks and 99 groups

Compatiblecompression rate:

MP3: between 32 kbpsand 320

kbps

WMA: between 48 kbpsand 192

kbps

(10)JPEG

ExifVer 2.1JPEG Baselinefiles

Maximumnumber ofpictures and groups

recognizable:

3000 pictures and 300

groups

Picture resolution: between 320×240 and 6144×

4096 pixels

(Sub sampling is4:2:2or4:2:

(11)HighMAT Level 2(Audio and Image)

Video output:

Outputlevel: 1Vp-p (75 )

Outputterminal: Pin jack (1system)/AV

Svideo output:

Youtputlevel: 1Vp-p (75 )

Coutputlevel: 0.300 Vp-p (75 )

Outputterminal: Sterminal (1system)/AV

Componentvideo output(576I):

Youtputlevel: 1Vp-p (75 )

PBoutputlebel: 0.7Vp-p (75 )

0.7

(

)

PRoutputlevel 0.7Vp-p (75 )

Outputterminal: Pin jack

(1system, Y:green, PB:

blue, PR:red)

RGBvideo output:

Routputlevel: 0.7Vp-p (75 )

G outputlevel: 0.7Vp-p (75 )

Boutputlevel: 0.7Vp-p (75 )

Outputterminal: AV

Audio output:

Outputlevel: 2Vrms (1kHz, 0dB)

Outputterminal: Pin jack/AV

Number ofterminals:

2channel: 1system

5.1-channel discrete

output

(5.1channel):

1system

Audio performance:

(1) Frequencyresponse:

DVD(linear audio): 4Hz-22 kHz(48 kHz

sampling)

4Hz-44 kHz(96 kHz

sampling)

DVD-Audio: 4Hz-88 kHz

(192 kHzsampling)

CD audio: 4Hz-20 kHz

(2) S/Nratio:

CD audio: 115 dB

(3) Dynamicrange:

DVD(linear audio): 102 dB

CD audio: 98 dB

(4) Total harmonicdistortion:

CD audio: 0.0025 %

Digital audio output:

Optical digital output: Optical terminal

Coaxial digital output: Pin jack

Pickup

Wavelength: 658 nm/790 nm

Laser power: CLASS 2/CLASS 1

Power consumption in standbymode:

1.9W

Note:

Specificationsare subjectto changewithoutnotice.

Mass and dimensionsare approximate.

Solder:

Thismodel uses lead free solder (PbF).

2003 ChinaHualu~Matsushita AVCCO., Ltd. All rights

reserved. Unauthorizedcopying and distribution isaviolation of

law.

1. Service Information Regarding MODULE P.C.B. of

DVD-S75EG/EB/E

1.1. Overview

DVD model DVD-S75EG/EB/Ewill be manufacturedusing 2 distinctlydifferent MODULEP.C.B..

These 2 versions of MODULEP.C.B. will be referredto as P.C.B. types “B”and “C”.

[This mainService Manual is applicable ONLYto P.C.B. “TYPE B”.]

P.C.B. type “C”is coveredbyotherSupplement Service Manual.

Firstproduction units will all have P.C.B. type “B”.

Note:

Although different IC partnumber’s are used, the features, function and performance are

identical.

1.2. HowtoDistinguishtheTypes ofMODULE P.C.B.

Types “B”and “C”of MODULEP.C.B. canbe distinguisheddepend on partnumberof MODULE

P.C.B. as shownbelow.

Figure

1.3. Difference Comparison Chart(onlymainparts)

[Differences and Comparison Chart]

Description / Ref. # Type A Type B Type C

MODULEP.C.B. Does not exist REP3500E REP3585C-C

AVdecorder(IC3001) ----- ROM2

(MN2DS0002AP1) ROM2

(MN2DS0002AP1)

SDRAM(IC3051) ----- 64Mbit

(C3ABPG000102) 64Mbit(Part# not yet

decided)

SDRAM(IC3061) ----- 64Mbit

(C3ABPG000102) -----

LATCH (IC6311) ----- C0JBAH000074 -----

LATCH (IC6312) ----- C0JBAH000074 -----

FLASH ROM(IC6301) ----- RFKFSS70R160 Part# not yetdecided.

CAUTION:ALWAYSCONFIRMTHEP.C.B. PARTNUMBER AND TYPE AND REFER TOTHE

APPROPRIATESERVICEMANUALBEFORETROUBLESHOOTINGOR REPLACINGANYPARTS.

2. SAFETY PRECAUTIONS

2.1. GENERALGUIDELINES

1. Whenservicing, observetheoriginal leaddress. Ifashortcircuit

isfound, replace all parts whichhavebeenoverheatedor

damagedbytheshortcircuit.

2. Afterservicing, see toitthat all theprotectivedevices suchas

insulation barriers, insulation papersshieldsareproperly

installed.

3. Afterservicing, make thefollowing leakagecurrentchecks to

preventthecustomerfrom being exposedtoshock hazards.

2.1.1. LEAKAGE CURRENT COLD CHECK

1. Unplug theACcord and connect ajumperbetweenthetwo

prongson theplug.

2. Measuretheresistance value, withanohmmeter, betweenthe

jumperedACplug and eachexposedmetalliccabinet parton the

equipmentsuchas screwheads, connectors, control shafts, etc.

Whentheexposedmetallicparthas areturn pathtothechassis,

thereading shouldbebetween1M and 5.2M . / Whenthe

exposedmetal does nothaveareturn pathtothechassis, the

reading must be . Figure 1

2.1.2. LEAKAGE CURRENT HOT CHECK (See Figure1.)

1. Plug theACcord directlyintotheACoutlet. Donotuse an

isolation transformerfor thischeck.

2. Connect a1.5k , 10 watts resistor, inparallel witha0.15 F

capacitors, betweeneachexposedmetallicparton theset and a

good earthground suchas awaterpipe, as shownin Figure 1 .

3. Use anACvoltmeter, with1000 ohms/voltor moresensitivity, to

measurethepotential across theresistor.

4. Check eachexposedmetallicpart, and measurethevoltageat

eachpoint.

5. Reverse theACplug intheACoutlet and repeat eachoftheabove

measurements.

6. Thepotential at anypointshouldnotexceed0.75 volts RMS. A

leakagecurrenttester(Simpson Model 229 or equivalent) maybe

usedtomake thehotchecks, leakagecurrentmu3st notexceed1/

2milliamp. Incase ameasurementisoutsideofthelimits

specified, thereisapossibilityofashock hazard, and the

equipmentshouldberepairedand recheckedbeforeitisreturned

tothecustomer.

3. PREVENTIONOF ELECTROSTATICDISCHARGE

(ESD) TO ELECTROSTATICALLY SENSITIVE (ES)

DEVICES

Some semiconductor(solidstate)devices canbe damagedeasilybystatic electricity. Such

components commonlyare calledElectrostaticallySensitive (ES)Devices. Examples of typical

ES devices are integratedcircuits and some field-effecttransistorsand semiconductor"chip"

components. The following techniques shouldbe usedto helpreduce the incidence of

component damage causedbyelectrostatic discharge (ESD).

1. Immediatelybeforehandling anysemiconductor componentor

semiconductor-equippedassembly, drainoff anyESDon your

bodybytouching aknownearthground. Alternatively, obtainand

wearacommerciallyavailabledischargingESDwrist strap, which

shouldberemovedfor potential shock reasonsprior toapplying

powertotheunitundertest.

2. Afterremoving anelectrical assemblyequippedwithES devices,

place theassemblyon aconductivesurface suchas alminum foil,

topreventelectrostaticchargebuildup or exposureofthe

assembly.

3. Use onlyagrounded-tipsoldering iron tosolderor unsolderES

devices.

4. Use onlyananti-staticsolderremoval device. Somesolder

removal devices notclassifiedas "anti-static(ESDprotected)"

cangenerate electrical chargesufficienttodamageES devices.

5. Donotuse freon-propelledchemicals. These cangenerate

electrical charges sufficienttodamageES devices.

6. DonotremoveareplacementES device from its protective

packageuntil immediatelybeforeyou arereadytoinstall it. (Most

replacementES devices arepackagedwithleadselectrically

shortedtogetherbyconductivefoam, alminum foil or

comparableconductivematerial).

7. Immediatelybeforeremoving theprotectivematerial from the

leadsofareplacementES device, touchtheprotectivematerial to

thechassisor circuitassemblyintowhichthedevice will be

installed.

Caution

Besureno powerisappliedtothechassisor circuit, and observe

all othersafetyprecautions.

8. Minimizebodilymotionswhenhandling unpackagedreplacement

ES devices. (Otherwise hamless motion suchas thebrushing

togetherofyour clothes fabricor thelifting ofyour footfrom a

carpetedfloor cangenerate staticelectricity(ESD) sufficient

todamageanES device).

4. Precaution ofLaser Diode

5. Aboutlead free solder (PbF)

Distinction of PbF PCB:PCBs (manufactured) using leadfree solderwill have a PbF stamp on

the PCB.

Caution:

-Pbfree solderhas ahighermelting pointthanstandard solder;

Typicallythmelting pointis50 -70°F(30 -40°C) higher. Please use

ahigh temperaturesoldering iron. Incase ofthesoldering iron

withtemperaturecontrol,please set itto700 ±20°F(370 ±10°C).

-Pbfree solderwill tend tosplashwhenheatedtoo high (about

1100°F/ 600°C).

Whensoldering or unsoldering, please completelyremoveall ofthe

solderon thepinsor solderarea, and besuretoheat thesoldering

points withthePbfree solderuntil itmelts enough.

6. General Description

6.1. Operating instructions

7. PREVENTIONOF STATICELECTRICITY

DISCHARGE

The laserdiode inthe traverse unit(optical pickup) maybrake downdue to static electricityof

clothes orhumanbody. Use due caution to electrostatic breakdownwhenservicing and

handling the laserdiode.

7.1. Grounding for electrostaticbreakdownprevention

Some devices suchas the DVD playeruse the optical pickup (laserdiode)and the optical

pickup will be damagedbystatic electricityinthe working environment. Proceedservicing

works underthe working environment where grounding works is completed.

7.1.1. Worktablegrounding

1. Putaconductivematerial (sheet) or iron sheet on thearea where

theoptical pickup isplaced, and ground thesheet.

7.1.2. Humanbodygrounding

1. Use theanti-staticwrist straptodischargethestaticelectricity

form your body.

7.1.3. Handling ofoptical pickup

1. Tokeepthegood qualityoftheoptical pickup maintenance parts

during transportation and beforeinstallation, thebothendsofthe

laserdiodeareshort-circuited. Afterreplacing theparts withnew

ones, removetheshortcircuitaccordingtothecorrect procedure.

(See thisTechnical Guide.)

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