Samsung GT-E1175T Manuale utente

GSM TELEPHONE

GT-E1175T

1. Safety Precautions

2. Specification

3. Product Function

4. Exploded View and Parts list

5. MAIN Electrical Parts List

6. Level 1Repair

6-1. S/W Download

7. Level 2Repair

7-1. Disassembly and Assembly Instructions

8. Level 3Repair

8-1. Block Diagram

8-2. PCB Diagram

8-3. Troubleshooting

8-4. Service Schematics

9. Reference data

GSM TELEPHONE CONTENTS

SAMSUNG Proprietary-Contents may change without notice

1. Safety Precautions

1-1

This Document can not be used without Samsung's authorization

1-1. Repair Precaution

―Repair in Shield Box, during detailed tuning. Take specially care of tuning or test, because

specipicty of cellular phone is sensitive for surrounding interference(RF noise).

―Be careful to use akind of magnetic object or tool, because performance of parts is damaged by

the influence of magnetic force.

―Surely use astandard screwdriver when you disassemble this product, otherwise screw will be

worn away.

―Use athicken twisted wire when you measure level.

Athicken twisted wire has low resistance, therefore error of measurement is few.

―Repair after separate Test Pack and Set because for short danger (for example an overcurrent

and furious flames of parts etc) when you repair board in condition of connecting Test Pack and

tuning on.

―Take specially care of soldering, because Land of PCB is small and weak in heat.

―Surely tune on/off while using AC power plug, because arepair of battery charger is dangerous

when tuning ON/OFF PBA and Connector after disassembling charger.

―Don't use as you pleases after change other material than replacement registered on SEC System.

Otherwise engineer in charge isn't charged with problem that you don't keep this rules.

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Safety Precautions

1-2

This Document can not be used without Samsung's authorization

1-2. ESD(Electrostatically Sensitive Devices) Precaution

Several semiconductor may be damaged easily by static electricity. Such parts are called by ESD

(Electrostatically Sensitive Devices), for example IC,BGA chip etc. Read Precaution below.

You can prevent from ESD damage by static electricity.

―Remove static electricity remained your body before you touch semiconductor or parts with

semiconductor. There are ways that you touch an earthed place or wear static electricity prevention

string on wrist.

―Use earthed soldering steel when you connect or disconnect ESD.

―Use soldering removing tool to break static electricity. ,otherwise ESD will be damaged by static

electricity.

―Don't unpack until you set up ESD on product. Because most of ESD are packed by box and

aluminum plate to have conductive power,they are prevented from static electricity.

―You must maintain electric contact between ESD and place due to be set up until ESD is

connected completely to the proper place or acircuit board.

2. Specification

2-1

2-1. GSM General Specification

GSM900

Phase 2

DCS1800

Phase 1

Freq.

Band[MHz]

Uplink/Downlink

880~915

925~960

1710~1785

1805~1880

ARFCN range 0~124 &

975~1023 512~885

Tx/Rx spacing 45MHz 95MHz

Mod. Bit rate/

Bit Period

270.833kbps

3.692us

270.833kbps

3.692us

Time Slot Period/Frame

Period

576.9us

4.615ms

576.9us

4.615ms

Modulation 0.3GMSK 0.3GMSK

MS Power 33dBm~5dBm 30dBm~0dBm

Power Class 5pcl ~ 19pcl 0pcl ~15

pcl

Sensitivity -102dBm -100dBm

TDMA Mux 8 8

Cell Radius 35Km 2Km

Speclflcation

2-2

TX Power

control level

GSM900

533±2

dBm

631±2

dBm

729±2

dBm

827±2

dBm

925±2

dBm

10 23±2 dBm

11 21±2 dBm

12 19±2 dBm

13 17±2 dBm

14 15±2 dBm

15 13±2 dBm

16 11±3 dBm

17 9±3 dBm

18 7±3 dBm

19 5±3 dBm

TX Power

control level DCS1800

030±3

dBm

128±3

dBm

226±3

dBm

324±3

dBm

422±3

dBm

520±3

dBm

618±3

dBm

716±3

dBm

814±3

dBm

912±4

dBm

10 10±4 dBm

11 8±4dBm

12 6±4 dBm

13 4±4 dBm

14 2±5 dBm

15 0±5 dBm

2-2. GSM Tx Power Class

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3. Operation Instruction and Installation

3-1

This Document can not be used without Samsung's authorization

Main Function

•GSM 900/1800

•1.52" CSTN

•WAP 2.0 Browser

•SMS, MMS

•64

Poly Melody

•Noise Cancellation

•JAVA

•FM radio support

•LED torchlight

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4. Exploded View and Parts List

4-1

This Document can not be used without Samsung's authorization

4-1. Cellular phone Exploded View

QFR01

QRE01

QSP01

QCR89

QLC01

QKP01

QMI01

QMP01

QMO01

QBA01

QBC00

QMW02

QIF01

SAMSUNG Proprietary-Contents may change without notice

Exploded View and Parts List

4-2

This Document can not be used without Samsung's authorization

Design LOC Description SEC CODE

QSP01 SPEAKER 3001-002509

QCR89 SCREW-TAPPING 6002-001428

QMI01 MICROPHONE-ASSY-GT-E1170 GH30-00649A

QMO01 MOTOR DC-SCH-S369 GH31-00392A

QBA01 INNER BATTERY PACK-1000MAH,BLK,ENG,EU GH43-03184A

QMP01 A/S ASSY-PBA MAIN (COMM) GH82-04732A

QLC01 ASSY LCD-MODULE ASSY(GT-E1100) GH96-03565A

QKP01 ASSY KEYPAD-(OPEN/BLK) GH98-16048A

QBC00 ASSY COVER-BATT GH98-16533A

QRE01 ASSY CASE-REAR GH98-16487A

QIF01 PMO COVER-IF GH72-57917A

QFR01 ASSY CASE-FRONT GH98-16486A

QMW02 PCT WINDOW-MAIN(FM) GH72-58984A

4-2. Cellular phone Parts list

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5. MAIN Electrical Parts List

5-1

This Document can not be used without Samsung's authorization

Design LOC SEC CODE Description

D200,D201 0401-001110 DIODE

ZD200 0403-001688 DIODE-ZENER

D300,D301,D302 0406-001231 DIODE

ZD300 0406-001267 DIODE-ZENER

ZD301,ZD302 0406-001286 DIODE-ZENER

TR200 0505-002664 FET-SILICON

LED300 0601-002233 LED

LED304 0601-002846 LED

LED301,LED302,LED303 0601-002846 LED

TR100 1003-001440 IC

UME200 1108-000217 MEMORY

PAM100 1201-002933 PAM

U300 1203-005512 IC

U101 1203-005686 IC

U100 1204-002979 IC

UCP200 1205-003923 IC

TH200 1404-001221 THERMISTOR

R301 2007-000139 R-CHIP

L109 2007-000140 INDUCTOR

R300,R306,R312 2007-000141 R-CHIP

R104,R105 2007-000143 R-CHIP

R208 2007-000144 R-CHIP

R101,R102,R200,R202 2007-000148 R-CHIP

R108 2007-000151 R-CHIP

R107 2007-000162 R-CHIP

R307,R308 2007-000172 R-CHIP

R302,R303,R304,R305 2007-000172 R-CHIP

R309,R310 2007-000173 R-CHIP

R311 2007-000174 R-CHIP

R209 2007-001301 R-CHIP

R210 2007-001333 R-CHIP

R106 2007-003025 R-CHIP

R204 2007-010071 R-CHIP

C103 2203-000233 C-CERAMIC,CHIP

C317 2203-000359 C-CERAMIC,CHIP

U302 2203-000386 IC

SAMSUNG Proprietary-Contents may change without notice

Main Electrical Parts List

5-2

This Document can not be used without Samsung's authorization

Design LOC SEC CODE Description

C225,C227 2203-000425 C-CERAMIC,CHIP

C309,C310,C311 2203-000585 C-CERAMIC,CHIP

C302 2203-000679 C-CERAMIC,CHIP

C106 2203-000696 C-CERAMIC,CHIP

C312,C313 2203-000812 C-CERAMIC,CHIP

C111,C112,C114,C228 2203-000812 C-CERAMIC,CHIP

C220,C321,C325 2203-001153 C-CERAMIC,CHIP

C118 2203-001383 C-CERAMIC,CHIP

C116,C117 2203-001385 C-CERAMIC,CHIP

C209,C210,C229 2203-002709 C-CERAMIC,CHIP

C110 2203-005057 C-CERAMIC,CHIP

C113,C115 2203-005281 C-CERAMIC,CHIP

C224 2203-005344 C-CERAMIC,CHIP

C319,C323 2203-006048 C-CERAMIC,CHIP

C215,C231,C301,C303 2203-006048 C-CERAMIC,CHIP

C100,C104,C211,C212 2203-006048 C-CERAMIC,CHIP

C203,C204,C320 2203-006208 C-CERAMIC,CHIP

C101,C102 2203-006260 C-CERAMIC,CHIP

C208,C214,C315,C316 2203-006399 C-CERAMIC,CHIP

C202,C205,C206,C207 2203-006399 C-CERAMIC,CHIP

C109,C314 2203-006562 C-CERAMIC,CHIP

C200,C201,C226 2203-006824 C-CERAMIC,CHIP

C305,C306 2203-006841 C-CERAMIC,CHIP

C308 2203-007270 C-CERAMIC,CHIP

C108 2203-007279 C-CERAMIC,CHIP

C223 2203-007425 C-CERAMIC,CHIP

L106 2703-002170 INDUCTOR

L107 2703-002176 INDUCTOR

L306,L307,L308,L309 2703-002201 INDUCTOR

L302,L303,L304,L305 2703-002201 INDUCTOR

L105 2703-002203 INDUCTOR

L108 2703-002204 INDUCTOR

L111,L110 2703-002208 INDUCTOR

L103 2703-002268 INDUCTOR

L201 2703-003184 INDUCTOR

L301 2703-003476 INDUCTOR

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