ADLINK Technology HPERC-KBL-MC Manuale utente

Leading EDGE COMPUTING

Manual Rev.: 1.1

Rev. Date: September 28, 2021

Part Number: 50M-00048-1010

HPERC-KBL-MC/MH

High Performance Extreme Rugged Computer System

User’s Manual

ii Revision History

Revision History

Revision Description of Changes Release Date

1.0 Initial release 2020-03-02

1.1 Add MXM-T1000 MXM module; update specifiations and pin

definitions 2021-09-28

Preface iii

HPERC-IBR-H

Preface

This document contains proprietary information protected by copyright. All rights are reserved.

No part of this manual may be reproduced by any mechanical, electronic, or other means in

any form without prior written permission of the manufacturer.

Disclaimer

The information in this document is subject to change without prior notice in order to improve

reliability, design, and function and does not represent a commitment on the part of the manu-

facturer.

In no event will the manufacturer be liable for direct, indirect, special, incidental, or conse-

quential damages arising out of the use or inability to use the product or documentation, even

if advised of the possibility of such damages.

Environmental Responsibility

ADLINK is committed to fulfill its social responsibility to global environmental

preservation through compliance with the European Union's Restriction of

Hazardous Substances (RoHS) directive and Waste Electrical and Electronic

Equipment (WEEE) directive. Environmental protection is a top priority for

ADLINK. We have enforced measures to ensure that our products, manufac-

turing processes, components, and raw materials have as little impact on the

environment as possible. When products are at their end of life, our custom-

ers are encouraged to dispose of them in accordance with the product dis-

posal and/or recovery programs prescribed by their nation or company.

Battery Labels (for products with battery)

California Proposition 65 Warning

WARNING: This product can expose you to chemicals including acrylamide, arsenic,

benzene, cadmium, Tris(1,3-dichloro-2-propyl)phosphate (TDCPP), 1,4-Dioxane,

formaldehyde, lead, DEHP, styrene, DINP, BBP, PVC, and vinyl materials, which are

known to the State of California to cause cancer, and acrylamide, benzene, cadmium, lead,

mercury, phthalates, toluene, DEHP, DIDP, DnHP, DBP, BBP, PVC, and vinyl materials, which

are known to the State of California to cause birth defects or other reproductive harm. For

more information go to www.P65Warnings.ca.gov.

ᑜ㔚ᳰ⺧࿁ᡴ

iv Preface

Trademarks

Product names mentioned herein are used for identification purposes only and may be trade-

marks and/or registered trademarks of their respective companies.

Conventions

Take note of the following conventions used throughout this manual to make sure that users

perform certain tasks and instructions properly.

NOTE:

Additional information, aids, and tips that help users perform tasks.

CAUTION:

Information to prevent minor physical injury, component damage, data loss, and/or

program corruption when trying to complete a task.

WARNING:

Information to prevent serious physical injury, component damage, data loss, and/or

program corruption when trying to complete a specific task.

Table of Contents v

HPERC-KBL-M

Table of Contents

Revision History.................................................................................... ii

Preface .................................................................................................. iii

List of Figures ..................................................................................... vii

List of Tables........................................................................................ ix

1 Introduction........................................................................................ 1

1.1 About the HPERC-KBL-M.......................................................................... 1

1.2 Using this Guide ........................................................................................ 1

1.3 Requirements............................................................................................. 1

1.4 Specifications............................................................................................. 2

1.5 Block Diagram............................................................................................ 4

1.6 Power Specifications................................................................................. 5

1.7 What’s in the Box....................................................................................... 6

2 Getting Started................................................................................... 7

2.1 Preparation................................................................................................. 7

2.2 Setting Up the Work Space ...................................................................... 7

2.3 Mounting the Enclosure............................................................................ 7

2.4 Connecting Peripherals........................................................................... 11

2.5 Front Panel Connectors & LEDs ............................................................ 12

2.6 Breakout Cable Descriptions.................................................................. 14

2.7 P2 and P3 Military Connectors............................................................... 15

2.7.1 P2 and P3 Connector Locations..................................................................15

2.7.2 P2 Pin Definitions..........................................................................................16

2.7.3 P3 Pin Definitions..........................................................................................19

2.8 Powering Up the HPERC-KBL-M............................................................ 23

2.9 Internal Components............................................................................... 24

3 BIOS Setup....................................................................................... 25

3.1 Menu Structure......................................................................................... 25

3.2 Main........................................................................................................... 26

3.2.1 BIOS Information...........................................................................................26

3.2.2 Processor Information.................................................................................. 26

3.2.3 PCH Information............................................................................................26

3.2.4 ME FW Version..............................................................................................27

3.2.5 ME Firmware SKU.........................................................................................27

3.2.6 SPI Clock Frequency ....................................................................................27

3.2.7 Hardware Version..........................................................................................27

3.2.8 System Management ....................................................................................28

3.2.9 System Language .........................................................................................30

vi Table of Contents

3.2.10 System Date and Time..................................................................................30

3.3 Advanced.................................................................................................. 31

3.3.1 CPU Configuration........................................................................................31

3.3.2 Power & Performance...................................................................................32

3.3.3 PCH-FW Configuration.................................................................................33

3.3.4 Trusted Computing.......................................................................................33

3.3.5 NCT6106D Super IO Configuration..............................................................34

3.3.6 NCT5104DSEC Super IO Configuration......................................................36

3.3.7 Serial Port Console Redirection..................................................................37

3.3.8 Network Stack Configuration.......................................................................41

3.3.9 CSM Configuration........................................................................................41

3.3.10 USB Configuration........................................................................................42

3.4 Chipset ..................................................................................................... 43

3.4.1 System Agent (SA) Configuration...............................................................43

3.4.2 PCH-IO Configuration...................................................................................44

3.5 Security .................................................................................................... 47

3.5.1 Password Description ..................................................................................47

3.6 Boot........................................................................................................... 48

3.6.1 Boot Configuration .......................................................................................48

3.7 Save & Exit ............................................................................................... 49

Important Safety Instructions ............................................................ 51

Getting Service.................................................................................... 53

List of Figures vii

HPERC-KBL-M

List of Figures

Figure 1-1: HPERC-KBL-M Block Diagram ........................................................................... 4

Figure 1-2: HPERC-KBL-M Unit with Optional Accessories .................................................. 6

Figure 2-1: Top and Front Views of “MH” Enclosure with Mounting Dimensions .................. 8

Figure 2-2: Top and Front Views of “MC” Enclosure with Mounting Dimensions .................. 9

Figure 2-3: Bottom View of “MC” Enclosure with Mounting Holes....................................... 10

Figure 2-4: Front View of HPERC-KBL-M I/O Panel ........................................................... 12

Figure 2-5: P2 and P3 Military Interface Connector Pin Locations ...................................... 15

viii List of Figures

This page intentionally left blank.

List of Tables ix

HPERC-KBL-M

List of Tables

Table 1-1: HPERC-KBL-M Specifications ............................................................................ 2

Table 1-2: System Power Requirements.............................................................................. 5

Table 2-1: I/O Panel Connectors ........................................................................................ 13

Table 2-2: DB9 Male Connector Pin Definition................................................................... 14

Table 2-3: GPIO Breakout Wires........................................................................................ 14

Table 2-4: P2 Connector Pin Definitions and Signal Maps................................................. 16

Table 2-5: P3 Connector Pin Definitions and Signal Maps................................................. 19

xList of Tables

This page intentionally left blank.

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