SSPBM-K100-BTE
Advanced Microwave
Technologies
DVANTECH
CONTENTS
1. SAFETY ................................................................................................................. 6
2. GENERAL INFORMATION .................................................................................. 9
2.1 INTRODUCTION ............................................................................................................................ 9
2.2 DESCRIPTION ................................................................................................................................9
2.2.1 Power Supply ............................................................................................................................ 9
2.2.2 Up-Converter Assembly ........................................................................................................... 10
2.2.3 RF Driver Module.................................................................................................................... 10
2.2.4 RF High Power Module............................................................................................................ 10
2.2.5 Waveguide Arm Assembly ....................................................................................................... 10
2.3 PACKING LIST ............................................................................................................................. 11
2.4 SSPB SPECIFICATIONS................................................................................................................ 14
3. INTERFACES ...................................................................................................... 18
3.1 RELAY INTERFACE..................................................................................................................... 18
3.2 RS-232 INTERFACE...................................................................................................................... 20
3.3 RS-485 INTERFACE...................................................................................................................... 21
3.4 RF OUTPUT MONITOR INTERFACE ........................................................................................... 21
4. UNPACKING AND INSTALLATION .................................................................. 22
4.1 INITIAL INSPECTION .................................................................................................................. 22
4.2 UNPACKING ................................................................................................................................22
4.3 INSTALLATION ........................................................................................................................... 22
4.3.1 Mechanical Installation............................................................................................................. 22
4.3.2 Electrical Connections.............................................................................................................. 23
4.3.3 RF Connections ....................................................................................................................... 23
4.3.4 Cooling Considerations ............................................................................................................ 24
5. INITIAL POWER ON AND CHECKOUT ............................................................ 25
5.1 PRE-POWER PROCEDURES......................................................................................................... 25
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