Content
1 PICO-IMX8M-MINI Introduction .............................................................................................................3
1.1 Summary .....................................................................................................................................3
1.2 Processor Features......................................................................................................................3
1.3 SoM Specifications ......................................................................................................................4
1.4 Block Diagram..............................................................................................................................5
1.5 PCB Dimension............................................................................................................................6
1.6 Pin Definition................................................................................................................................6
1.7 Development Kit (EM-IMX8M-MINI)...........................................................................................14
2 Peripheral Introduction.........................................................................................................................15
2.1 Display .......................................................................................................................................15
2.2 Camera I/F.................................................................................................................................15
2.3 Audio..........................................................................................................................................16
2.3.1 Digital Interface (SAI).......................................................................................................16
2.3.2 Sony/Philips Digital Interface ...........................................................................................18
2.4 Ethernet .....................................................................................................................................18
2.5 USB ...........................................................................................................................................19
2.6 PCIe...........................................................................................................................................19
2.7 EMMC/SD/SDIO ........................................................................................................................19
2.7.1 EMMC 5.1........................................................................................................................19
2.7.2 SD/SDIO3.0 .....................................................................................................................20
2.8 SPI .............................................................................................................................................21
2.8.1 ECSPI..............................................................................................................................21
2.8.2 QSPI ................................................................................................................................21
2.9 UART .........................................................................................................................................21
2.10 I2C ...........................................................................................................................................22
2.11 PWM ........................................................................................................................................23
2.12 JTAG........................................................................................................................................23
3 Product Electrical Characteristics ........................................................................................................24
3.1 Dissipation and Temperature .....................................................................................................24
3.2 Reliability of Test ........................................................................................................................24
