BOSER Technology HS-7322 Manuale utente

HS-7322

Intel® GM45/Mobile Dual-Core processor

PICMG1.3 Half-size SBC

•1066/800/667MHz FSB•CompactFlash•

•8-bit GPIO•DVI-I/CRT/LVDS•Dual GB LAN•

•Audio•SATA•RS-232/422/485•4 COM•

•7 USB2.0•WDT•H/W Monitor•

The accuracy of contents in this manual has passed thorough checking and review before

publishing. BOSER Technology Co., Ltd., the manufacturer and publisher, is not liable for

any infringements of patents or other rights resulting from its use. The manufacturer will

not be responsible for any direct, indirect, special, incidental or consequential

damages arising from the use of this product or documentation, even if advised of

the possibility of such damage(s).

This manual is copyrighted and BOSER Technology Co., Ltd. reserves all

documentation rights. Unauthorized reproduction, transmission, translation, and

storage of any form and means (i.e., electronic, mechanical, photocopying, recording)

of this document, in whole or partly, is prohibited, unless granted permission by BOSER

Technology Co., Ltd.

BOSER Technology Co., Ltd. reserves the right to change or improve the contents of

this document without due notice. BOSER Technology Co., Ltd. assumes no

responsibility for any errors or omissions that may appear in this manual, nor does

it make any commitment to update the information contained herein.

BOSER is a registered trademark of BOSER Technology Co., Ltd.

ISB is a registered trademark of BOSER Technology Co., Ltd.

Intel is a registered trademark of Intel Corporation.

Award is a registered trademark of Award Software, Inc.

AMI is a registered trademark of AMI Software, Inc.

All other trademarks, products and or product names mentioned herein are

mentioned for identification purposes only, and may be trademarks and/or

registered trademarks of their respective companies or owners.

Edition 1.6, October 06, 2010

Table of Contents

Chapter 1 General Description ..................................1

1.1 Major Features....................................................................... 2

1.2 Specifications ........................................................................ 2

1.3 Board Dimensions................................................................. 4

Chapter 2 Unpacking ..................................................5

2.1 Opening the Delivery Package............................................. 5

2.2 Inspection............................................................................... 5

Chapter 3 Hardware Installation ..............................7

3.1 Before Installation ................................................................. 7

3.2 Board Layout ......................................................................... 8

3.3 Jumper List ............................................................................ 9

3.4 Connector List ....................................................................... 9

3.5 Configuring the CPU ........................................................... 10

3.6 System Memory ................................................................... 10

3.7 VGA Controller .................................................................... 10

3.8 Serial ATA Connector ......................................................... 13

3.9 Serial Port Connectors ....................................................... 13

3.10 Ethernet Connector............................................................. 14

3.11 USB Port............................................................................... 15

3.12 CMOS Data Clear................................................................. 15

3.13 Parallel Port.......................................................................... 16

3.14 Power and Fan Connectors................................................ 16

3.15 Keyboard/Mouse Connectors ............................................ 17

3.16 System Front Panel Control ............................................... 17

3.17 Watchdog Timer .................................................................. 18

3.18 Audio Connectors ............................................................... 20

3.19 8-bit GPIO Function............................................................. 20

3.20 CompactFlashSocket ...................................................... 21

Chapter 4 AMI BIOS Setup.....................................23

4.1 Starting Setup...................................................................... 23

4.2 Using Setup ......................................................................... 24

4.3 Main Menu............................................................................ 25

4.4 Advanced Settings .............................................................. 26

4.5 Advanced PCI/PnP Settings............................................... 29

4.6 Boot Settings ....................................................................... 30

4.7 Security Settings ................................................................. 31

4.8 Advanced Chipset Settings................................................ 32

4.9 Exit Options ......................................................................... 33

Chapter 5 Software Utilities..................................... 35

5.1 Chipset Driver Installation.................................................. 35

5.2 VGA Driver Installation ....................................................... 38

5.3 LAN Driver Installation........................................................ 41

5.4 Audio Driver Installation..................................................... 43

Declaration of Conformity -- CE Mark

BOSER Technology hereby acknowledges that compliance testing in

accordance with applicable standards of the EU’s EMC Directive,

89/336/EEC, was successfully completed on a sample of the equipment

identified below:

Equipment Class: Information Technology Equipment

Product Model Series: HS-7322

This Product Complies With: EN55022: Class A for Radiated emissions

EN50082-2: Heavy Industrial EMC Immunity

We, the undersigned, hereby declare that the equipment specified above

conforms to the above directives and standards.

Manufacturer:

BOSER TECHNOLOGY CO., LTD.

Safety Instructions

Integrated circuits on computer boards are sensitive to static electricity. To

avoid damaging chips from electrostatic discharge, observe the following

precautions:

Do not remove boards or integrated circuits from their anti-static packaging

until you are ready to install them.

Before handling a board or integrated circuit, touch an unpainted portion of

the system unit chassis for a few seconds. This helps to discharge any static

electricity on your body.

Wear a wrist-grounding strap, available from most electronic component

stores, when handling boards and components. Fasten the ALLIGATOR clip

of the strap to the end of the shielded wire lead from a grounded object.

Please wear and connect the strap before handle the HS-7322 to ensure

harmlessly discharge any static electricity through the strap.

Please use an anti-static pad when putting down any components or parts or

tools outside the computer. You may also use an anti-static bag instead of

the pad. Please inquire from your local supplier for additional assistance in

finding the necessary anti-static gadgets.

NOTE: DO NOT TOUCH THE BOARD OR ANY OTHER SENSITIVE

COMPONENTS WITHOUT ALL NECESSARY ANTI-STATIC

PROTECTIONS.

Chapter 1

General Description

The HS-7322 is an Intel® GM45/ICH9-M chipset-based board

designed, the board supports Socket P for Intel® Mobile Dual-Core

processor. The HS-7322 is an ideal all-in-one PICMG1.3 Half-size

SBC. Additional features include an enhanced I/O with CF,

DVI-I/CRT/LVDS, dual GB LAN, audio, SATA, 4 COM, and 7 USB2.0

interfaces.

The Intel® GM45 integrated Intel® Graphics Media Accelerator 4500

MHD with 352MB video memory supports CRT/Panel displays up to

2048 x 1536. It also supports 24-bit single/dual-channel LVDS

interface.

System memory is also sufficient with the two 240-pin DIMM sockets

up to 4GB DDR2 SDRAM.

Additional onboard connectors include seven advanced USB2.0 ports

providing faster data transmission. And two RJ-45 connectors for

10/100/1000 Based Ethernet uses. To ensure the reliability in an

unmanned or standalone system, the watchdog timer (WDT) onboard

HS-7322 is designed with software that does not need the arithmetical

functions of a real-time clock chip. If any program causes unexpected

halts to the system, the onboard WDT will automatically reset the CPU

or generate an interrupt to resolve such condition.

1.1 Major Features

The HS-7322 comes with the following features:

¾Socket P for Intel® Mobile Dual-Core processor, supports

1066/800/667MHz FSB

¾2 x DIMMs up to 4GB DDR2 SDRAM

¾Intel® GM45/ICH9-M system chipset

¾Intel® GM45 integrated for CRT & LVDS

¾2 x 10/100/1000 Mbps Ethernet

¾High Definition audio codec

¾Supports CF, 3 x SATA, 4 x COM, 7 x USB2.0

¾Supports 24-bit LVDS, 8-bit GPIO, H/W Monitor function

¾Option for DVI-I display

1.2 Specifications

zSystem

CPU:

Intel® Mobile Dual-Core processor, supports Merom 65nm and

Penryn 45nm (Socket P)

FSB:

1066/800/667MHz FSB

BIOS:

AMI PnP Flash BIOS

System Chipset:

Intel® GM45/ICH9-M

I/O Chipset:

Winbond W83627UHG

System Memory:

2 x 240-pin DIMM sockets DDR2 800MHz up to 4GB

Storage:

1 x Type II CF socket

Watchdog Timer:

Software programmable time-out intervals from 1~255 sec. or

1~255 min.

H/W Status Monitor:

Monitoring temperatures, voltages, and cooling fan status

Operating Temperature:

0~+60 degrees C

Operating Humidity:

0~95%, non-condensing

Size (L x W):

167.6x 126.4 mm

zI/O Interface

MIO:

3 x RS-232

1 x RS-232/422/485

7 x USB2.0 (6 x internal, 1 x external)

1 x Parallel

3 x SATA

1 x PS/2 for KB/MS

GPIO:

8-bit general purpose input/output port

zDisplay

Chipset:

Intel® GM45 integrated Intel® Graphics Media Accelerator

4500 MHD

Display Memory:

352MB video memory

LVDS:

24-bit single/dual-channel

Resolution:

2048 x 1536

DVI Chipset:

Intel® GM45 integrated Intel® Graphics Media Accelerator

4500 MHD

zAudio

Chipset:

RealTek ALC262 High Definition audio codec

Audio Interface (w/pin header):

MIC In, Line Out

zEthernet

Chipset:

Dual RealTek RTL8111C 10/100/1000 Mbps LAN

Ethernet Interface:

2 x RJ-45

1.3 Board Dimensions

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