Diamond MAGELLAN Manuale utente

Magellan User Manual Rev A.02

MAGELLAN Single Board Computer

COM ExpressTM Form-Factor Embedded-Ready

Subsystem with configurable COM CPU

Revision

Date

Comment

A.00

12/9/10

Initial Release

A.01

6/23/11

Added MAG-965-xG models

A.02

11/18/13

Added FeaturePak pinout Appendix

FOR TECHNICAL SUPPORT Diamond Systems Corporation

PLEASE CONTACT: 555 Ellis Street

Mountain View, CA 94043 USA

support@diamondsystems.com Tel 1-650-810-2500

Fax 1-650-810-2525

www.diamondsystems.com

Magellan User Manual Rev A.02 www.diamondsystems.com Page 2

CONTENTS

Important Safe-Handling Information.....................................................................................................................4

1. Introduction.......................................................................................................................................................5

1.1 Magellan Features.........................................................................................................................................6

1.2 FeaturePak and SUMIT Socket Resources ..................................................................................................7

1.3 Software Compatibility...................................................................................................................................7

1.4 Thermal Considerations and Heatspreader ..................................................................................................7

2. Functional Overview.........................................................................................................................................8

2.1 Block Diagrams..............................................................................................................................................8

2.2 Magellan Baseboard Dimensions............................................................................................................... 10

2.3 Baseboard Connector Locations................................................................................................................ 11

2.3.1 Connector Summary.......................................................................................................................... 12

2.4 Baseboard Configuration Jumpers............................................................................................................. 13

2.4.1 Configuration Jumper Summary........................................................................................................ 14

3. Getting Started............................................................................................................................................... 14

3.1 Introducing the Magellan Development Kit................................................................................................. 15

3.1.1 Magellan Cable Kit............................................................................................................................. 16

3.2 System Setup ............................................................................................................................................. 17

3.2.1 Display ............................................................................................................................................... 17

3.2.2 Keyboard and Mouse......................................................................................................................... 17

3.2.3 USB Flashdisk Socket ....................................................................................................................... 17

3.2.4 Mass Storage Devices....................................................................................................................... 17

3.2.5 Connecting Power.............................................................................................................................. 17

3.2.6 Installing Magellan in an Enclosure (optional) ................................................................................... 17

3.3 Booting the System .................................................................................................................................... 18

3.3.1 BIOS Setup........................................................................................................................................ 18

3.3.2 Operating System Drivers.................................................................................................................. 18

4. Interface Connector Details.......................................................................................................................... 19

4.1 Audio Output (AUDIO1).............................................................................................................................. 19

4.2 Serial Ports (CN3, CN4) ............................................................................................................................. 19

4.3 Auxiliary Power Output (IOP1) ................................................................................................................... 21

4.4 External Battery Input (EBT1)..................................................................................................................... 21

4.5 Input Power (PWR1)................................................................................................................................... 21

4.6 PCI-104 (PCI) Expansion Bus (PC104P1)................................................................................................. 22

4.7 JTAG Interface (JTAG1)............................................................................................................................. 23

4.8 FeaturePak Expansion Socket (MXMIO1) ................................................................................................. 23

4.9 I/O Connectors A and B (DIOA1, DIOB1) .................................................................................................. 25

4.10 LCD Backlight (INV1) ................................................................................................................................. 25

4.11 Auxiliary Signals Connector (MISC1)......................................................................................................... 25

4.12 SUMIT Expansion Bus (SUMITA1, SUMITB1)........................................................................................... 26

4.13 Gigabit Ethernet (LAN1, LAN2).................................................................................................................. 27

4.14 USB Ports 0-3 (USB1, USB2) .................................................................................................................... 27

4.15 USB Flash Module Socket (USB3)............................................................................................................. 27

4.16 VGA (VGA1)............................................................................................................................................... 28

4.17 SATA (SATA1)............................................................................................................................................ 28

4.18 LCD Panel Interface (LVDS1) .................................................................................................................... 29

5. Configuration Jumper Details ...................................................................................................................... 30

5.1 External CMOS/RTC Backup Battery Enable (JBAT1).............................................................................. 30

5.2 LCD Backlight Brightness Control Selection (JBKC1)................................................................................ 30

5.3 LCD panel signal control (JLCD1).............................................................................................................. 31

5.4 LCD panel power select (JVLCD1)............................................................................................................. 31

5.5 LCD backlight inverter power select (JINV1).............................................................................................. 31

5.6 Serial port COM3 mode select (JCOM3).................................................................................................... 32

5.7 Serial port COM4 mode select (JCOM4).................................................................................................... 33

5.8 Serial port signals to MXM or Supper I/O (JCOM2) ................................................................................... 33

5.9 On-board Power Supply Power-up/down Behavior (JPSON1, JPSON2).................................................. 34

6. BIOS ................................................................................................................................................................ 35

6.1 BIOS Functions........................................................................................................................................... 35

6.2 Entering the BIOS....................................................................................................................................... 35

6.3 Storing Default BIOS Settings.................................................................................................................... 35

Magellan User Manual Rev A.02 www.diamondsystems.com Page 3

6.4 Setting the Date and Time.......................................................................................................................... 35

6.5 ISA Bus IRQ Selection ............................................................................................................................... 35

6.6 Boot Menu .................................................................................................................................................. 35

6.7 Chipset........................................................................................................................................................ 36

6.8 Super I/O Configuration.............................................................................................................................. 36

6.9 Console Redirection ................................................................................................................................... 36

6.10 Power Type Select...................................................................................................................................... 36

6.11 Boot Delay.................................................................................................................................................. 36

6.12 Saving the Changes ................................................................................................................................... 36

7. Watchdog Timer............................................................................................................................................. 37

7.1 Registers..................................................................................................................................................... 37

7.2 Programming Sample Code ....................................................................................................................... 38

8. Accessories.................................................................................................................................................... 39

8.1 Thermal Pad............................................................................................................................................... 39

8.2 PC/104 Hardware Kit.................................................................................................................................. 39

9. Specifications................................................................................................................................................. 40

10. Appendix A..................................................................................................................................................... 41

10.1 FP-DAQ1616 Pinout................................................................................................................................... 41

10.1.1 DIOA1: Analog I/O Signals ................................................................................................................ 41

10.1.2 DIOB1: Digital I/O Signals.................................................................................................................. 42

10.2 FP-GPIO96 Pinout...................................................................................................................................... 43

10.2.1 DIOA1 ................................................................................................................................................ 43

10.2.2 DIOB1 ................................................................................................................................................ 44

Magellan User Manual Rev A.02 www.diamondsystems.com Page 4

IMPORTANT SAFE-HANDLING INFORMATION

WARNING: ESD-Sensitive Electronic Equipment!

Observe ESD-safe handling procedures when working with

this product.

Always use this product in a properly grounded work area and

wear appropriate ESD-preventive clothing and/or accessories.

Always store this product in ESD-protective packaging when

not in use.

Safe Handling Precautions

Magellan contains numerous I/O connectors that connect to sensitive electronic components. This creates many

opportunities for accidental damage during handling, installation and connection to other equipment. The list here

describes common causes of failure found on boards returned to Diamond Systems for repair. This information is

provided as a source of advice to help you prevent damaging your Diamond (or any vendor’s) embedded

computer boards.

ESD damage –This type of damage is almost impossible to detect, because there is no visual sign of failure or

damage. The symptom is that the board simply stops working, because some component becomes defective.

Usually the failure can be identified and the chip can be replaced.

To prevent ESD damage, always follow proper ESD-prevention practices when handling computer boards.

Damage during handling or storage –On some boards we have noticed physical damage from mishandling. A

common observation is that a screwdriver slipped while installing the board, causing a gouge in the PCB surface

and cutting signal traces or damaging components.

Another common observation is damaged board corners, indicating the board was dropped. This may or may not

cause damage to the circuitry, depending on what is near the corner. Most of our boards are designed with at

least 25 mils clearance between the board edge and any component pad, and ground / power planes are at least

20 mils from the edge to avoid possible shorting from this type of damage. However these design rules are not

sufficient to prevent damage in all situations.

A third cause of failure is when a metal screwdriver tip slips, or a screw drops onto the board while it is powered

on, causing a short between a power pin and a signal pin on a component. This can cause overvoltage / power

supply problems described below. To avoid this type of failure, only perform assembly operations when the

system is powered off.

Sometimes boards are stored in racks with slots that grip the edge of the board. This is a common practice for

board manufacturers. However our boards are generally very dense, and if the board has components very close

to the board edge, they can be damaged or even knocked off the board when the board tilts back in the rack.

Diamond recommends that all our boards be stored only in individual ESD-safe packaging. If multiple boards are

stored together, they should be contained in bins with dividers between boards. Do not pile boards on top of each

other or cram too many boards into a small location. This can cause damage to connector pins or fragile

components.

Power supply wired backwards –Our power supplies and boards are not designed to withstand a reverse

power supply connection. This will destroy each IC that is connected to the power supply. In this case the board

will most likely will be unrepairable and must be replaced. A chip destroyed by reverse power or by excessive

power will often have a visible hole on the top or show some deformation on the top surface due to vaporization

inside the package. Check twice before applying power!

Bent connector pins –This type of problem is often only a cosmetic issue and is easily fixed by bending the pins

back to their proper shape one at a time with needle-nose pliers. This situation can occur when pulling a ribbon

cable off of a pin header. Note: If the pins are bent too severely, bending them back can cause them to weaken

unacceptably or even break, and the connector must be replaced.

Magellan User Manual Rev A.02 www.diamondsystems.com Page 5

1. INTRODUCTION

The Magellan Embedded-Ready Subsystem is a high performance, highly integrated board-level embedded

single board computer matching the footprint of the popular COM Express computer-on-module (COM) standard.

Magellan’s CPU core consists of a COM Express CPU module mounted on its bottom side, an approach that

improves thermal management and increases the space for I/O functions and connectors. This innovative design

has enabled Magellan to integrate additional serial and Ethernet controllers, a complete set of peripheral interface

header connectors, a PCI-104TM expansion stack, SUMITTM bus connector, and a MXM I/O FeaturePakTM socket

all within the compact COM Express footprint.

Thanks to Magellan’s flexible architecture, you can select from a wide range of COM Express-based CPUs to

meet each application’s specific performance, power, and cost requirements. Available processors include Intel’s

Atom and Core 2 Duo CPUs.

Magellan is offered in a range of models that vary according to the choice of COM Express CPU module, on-

board SO-DIMM SDRAM capacity, and input power option as shown in the table below.

Magellan Model

COM Express

CPU Module

Processor Type

Processor

Clock

RAM

Input Power

MAG-965-4G

CME-965-L7500

Intel Core 2 Duo LV

1.6GHz

4GB SO-DIMM SDRAM

+7-36VDC input

MAG-965-1G

CME-965-L7500

Intel Core 2 Duo LV

1.6GHz

1GB SO-DIMM SDRAM

+7-36VDC input

MAG-965LC-4G

CME-965-L7500

Intel Core 2 Duo LV

1.6GHz

4GB SO-DIMM SDRAM

+12VDC only

MAG-965LC-1G

CME-965-L7500

Intel Core 2 Duo LV

1.6GHz

1GB SO-DIMM SDRAM

+12VDC only

MAG-Z510-1G

CME-Z510-1G

Intel Atom Z510

1.1GHz

1GB soldered SDRAM

+7-36VDC input

MAG-Z510LC-1G

CME-Z510-1G

Intel Atom Z510

1.1GHz

1GB soldered SDRAM

+12VDC only

Figure 1: Edge View of the Magellan Embedded-Ready Subsystem SBC

Magellan’s features comprise functions provided by the “Magellan baseboard”, or application layer, (top board in

stack shown in Figure 1) along with functions implemented on the attached COM Express computer-on-module

(COM) macrocomponent (bottom board in stack), along with a heatspreader mounted on the bottom.

These features are summarized on the next page.

Magellan User Manual Rev A.02 www.diamondsystems.com Page 6

1.1 Magellan Features

Note: The COM Express COM features listed here are typical. Refer to the appropriate

COM Express CPU module’s user manual for detailed specifications.

CPU: choice of two COM Express CPU modules

1.1GHz Intel Atom Z510, using the CME-Z510-1G COM Express CPU module

1.6GHz Intel Core 2 Duo LV, using the CME-965-L7500 COM Express CPU module

RAM

Atom Z510: 1GB of DDR2 SDRAM soldered on-board

Core 2 Duo LV: 1GB or 4GB SO-DIMM DDR2 SDRAM

Chipset

Atom Z510: US15WPT

Core 2 Duo LV: 965GME with ICH8M

BIOS: AMI PnP Flash BIOS

Storage

One SATA port supports one device

On-board USB flashdisk socket

Serial Ports:

Two RS-232 serial ports

Two RS-232/422/485 serial ports

Four USB 2.0 ports

Networking:

1 gigabit Ethernet from COM CPU

1 gigabit Ethernet from Intel 82574 controller on baseboard

Display:

LVDS LCD flat panel interface

Diamond supports Sharp LQ121S1LG41 and LQ121S1LG42 flat panels

VGA CRT

USB keyboard and mouse

Audio: AC’97 audio CODEC; mic in, line in/out

Watchdog timer: Non-maskable interrupt or reset modes

Other I/O: SMBus; LPC interface

Expansion buses:

PCI-104 or SUMIT bus connector stackable expansion (see below)

FeaturePak™ socket ( see below)

Power

Power input: +7-36VDC or +12VDC only (LC models)

On-board power supply: Built-in +7-36V DC/DC power supply

On-board RTC backup battery; connector for external battery

Operating environment:

Temperature MAG-965-xG models: -40°C to +80° (-40°F to +176°F)

All other models: -40°C to +85° (-40°F to +185°F)

Humidity: 0-90% non-condensing

Dimensions:

MAG-Z510-1G: 4.9 x 3.7 x 1.77 in. (125 x 95 x 45 mm)

MAG-965 models: 4.9 x 3.7 x 2.24 in (125 x 95 x 57 mm)

Weight:

MAG-Z510-1G: 11.7oz (332g)

MAG-965 models: 19.2oz (544g)

Form-factor: COM Express footprint (4.92 x 3.74 in.)

Magellan User Manual Rev A.02 www.diamondsystems.com Page 7

1.2 FeaturePak and SUMIT Socket Resources

Magellan’s FeaturePak and SUMIT expansion sockets provide the host interface resource support indicated in the

tables below. For further details on these expansion standards, visit FeaturePak.org and SFF-SIG.org/sumit.html.

1.3 Software Compatibility

Magellan’s operating system compatibility is a function of both the Magellan baseboard and the specific COM

Express CPU module attached to it. The baseboard and has been qualified for use with Windows XP/XPe and

Linux 2.6. The operating systems supported by the COM Express CPU module vary according to the specific

COM Express module used. Consult the appropriate COM Express CPU module’s user manual for details on its

operating system support.

1.4 Thermal Considerations and Heatspreader

All models of Magellan are specified for an operating temperature range of -40oC to +85oC. Diamond Systems

provides a heatspreader attached to the Magellan single board computer as a conductive cooled thermal layer.

However, this heatspreader by itself does not constitute the complete thermal solution necessary for any specific

implementation, but provides a common interface between the single board computer and the customer’s

implementation-specific thermal solution.

For Magellan MAG-965 models, the heatspreader is only a partial thermal solution. To achieve the full -40oC to

+85oC operating range with these models, the outside surface of the Magellan MAG-965 heatspreader must be

kept at a temperature not to exceed +85oC. If your environment exceeds this temperature specification, you are

responsible for removing the additional heat from the system through either an additional passive thermal solution

or fan solution.

Magellan’s integrated heatspreader makes thermal contact with the heat generating components and provides a

flat surface on the bottom of the assembly for mating to the system enclosure. This technique facilitates efficient

removal of heat from the COM module without the need for a fan. Four mounting holes on the bottom of the

conduction cooled heatspreader are provided to mount Magellan in an enclosure or to a bulkhead. These

mounting holes are #6-32 threaded holes on 2.8" centers.

Magellan User Manual Rev A.02 www.diamondsystems.com Page 8

2. FUNCTIONAL OVERVIEW

2.1 Block Diagrams

Figure 2 illustrates Magellan’s functional blocks, including circuitry contained on both the Magellan baseboard and

the COM Express CPU module. As indicated in the block diagram, the baseboard circuitry primarily comprises

interface connections and additional LAN and serial I/O, while the COM Express module integrates the system’s

core embedded PC functionality. Although COM Express CPU module processors and precise functions vary

between specific modules, the block diagram of a typical COM Express CPU module appears in Figure 3.

Figure 2: Magellan Functional Block Diagram

Magellan User Manual Rev A.02 www.diamondsystems.com Page 9

Figure 3: Typical COM Express CPU Module Functional Block Diagram

Magellan User Manual Rev A.02 www.diamondsystems.com Page 10

2.2 Magellan Baseboard Dimensions

Figure 4 shows the overall dimensions of the Magellan baseboard.

Figure 4: Baseboard Dimensions

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