Fortec Star COMe-bSC6 Manuale utente

The information contained in this document has been carefully researched and is, to the best

of our knowledge, accurate. However, we assume no liability for any product failures or

damages, immediate or consequential, resulting from the use of the information provided

herein. Our products are not intended for use in systems in which failures of product could

result in personal injury. All trademarks mentioned herein are property of their respective

owners. All specifications are subject to change without notice.

Manual

COMe-bSC6

Kontron

Our company network supports you worldwide with offices in Germany, Austria,

Switzerland, Great Britain and the USA. For more information please contact:

FORTEC Elektronik AG

Hauptniederlassung

Lechwiesenstr. 9

86899 Landsberg am Lech

Telefon: +49 (0) 8191 91172-0

Telefax: +49 (0) 8191 21770

E-Mail: [email protected]

Internet: www.fortecag.de

FORTEC Elektronik AG

Büro West

Hohenstaufenring 55

50674 Köln

Telefon: +49 (0) 221 272 273-0

Telefax: +49 (0) 221 272 273-10

E-Mail: [email protected]

Internet: www.fortecag.de

FORTEC Elektronik AG

Büro Wien

Nuschinggasse 12

A-1230 Wien

Telefon: +43 1 8673492-0

Telefax: +43 1 8673492-26

E-Mail: [email protected]

Internet: www.fortec.at

ALTRAC AG

(Tochter der FORTEC):

Bahnhofstraße 3

CH-5436 Würenlos

Telefon: +41 (0) 44 7446111

Telefax: +41 (0) 44 7446161

E-Mail: [email protected]

Internet: www.altrac.ch

COMe-bSC6

Document Revision 150

www.kontron.com

» Table of Contents «

1User Information..................................................................................6

1.1 About This Document.................................................................................................................... 6

1. Copyright Notice.......................................................................................................................... 6

1.3 Trademarks................................................................................................................................. 6

1.4 Standards................................................................................................................................... 6

1.5 Warranty.................................................................................................................................... 7

1.6 Technical Support......................................................................................................................... 7

Introduction........................................................................................8

.1 Product Description...................................................................................................................... 8

. Naming clarification..................................................................................................................... 8

.3 Understanding COM Express® Functionality.......................................................................................8

.4 COM Express® Documentation.........................................................................................................9

.5 COM Express® Benefits.................................................................................................................. 9

3Product Specification..........................................................................10

3.1 Module definition....................................................................................................................... 10

3. Functional Specification............................................................................................................... 11

3.3 Block Diagram............................................................................................................................ 17

3.4 Variant Matrix............................................................................................................................ 17

3.5 Accessories............................................................................................................................... 18

3.6 Electrical Specification................................................................................................................ 19

3.6.1 Supply Voltage........................................................................................................................... 19

3.6. Power Supply Rise Time................................................................................................................ 19

3.6.3 Supply Voltage Ripple..................................................................................................................19

3.6.4 Power Consumption..................................................................................................................... 19

3.6.5 ATX Mode.................................................................................................................................. 0

3.6.6 Single Supply Mode..................................................................................................................... 0

3.7 Power Control............................................................................................................................ 1

3.8 Environmental Specification.........................................................................................................

3.8.1 Temperature Specification............................................................................................................

3.8. Humidity...................................................................................................................................

3.9 Standards and Certifications......................................................................................................... 3

3.10 MTBF........................................................................................................................................ 5

3.11 Mechanical Specification.............................................................................................................. 6

3.1 Module Dimensions..................................................................................................................... 7

3.13 Thermal Management, Heatspreader and Cooling Solutions................................................................. 8

3.14 Onboard Fan Connector................................................................................................................ 9

4Features and Interfaces.......................................................................30

4.1 S5 Eco Mode.............................................................................................................................. 30

4. LPC.......................................................................................................................................... 31

www.kontron.com

COMe-bSC6 /

4.3 Serial Peripheral Interface (SPI)....................................................................................................3

4.4 SPI boot.................................................................................................................................... 3

4.5 M.A.R.S.................................................................................................................................... 34

4.6 UART........................................................................................................................................ 35

4.7 Fast I C.................................................................................................................................... 36

4.8 GPIO - General Purpose Input and Output.........................................................................................37

4.9 Dual Staged Watchdog Timer.........................................................................................................38

4.10 Speedstep Technology................................................................................................................. 39

4.11 C-States.................................................................................................................................... 40

4.1 Hyper Threading......................................................................................................................... 41

4.13 VID-x....................................................................................................................................... 4

4.14 Intel® Turbo Boost Technology and AVX...........................................................................................43

4.15 Display Configuration.................................................................................................................. 44

4.16 Hybrid Graphics / Multi-monitor....................................................................................................48

4.17 Intel® vPro™ technology.............................................................................................................. 49

4.18 ACPI Suspend Modes and Resume Events..........................................................................................50

4.19 USB......................................................................................................................................... 51

5System Resources...............................................................................5

5.1 Interrupt Request (IRQ) Lines........................................................................................................ 5

5. Memory Area............................................................................................................................. 53

5.3 I/O Address Map......................................................................................................................... 53

5.4 Peripheral Component Interconnect (PCI) Devices.............................................................................54

5.5 I C Bus..................................................................................................................................... 54

5.6 JILI I C Bus............................................................................................................................... 54

5.7 SDVO I C Bus............................................................................................................................. 54

5.8 System Management (SM) Bus.......................................................................................................55

6Connectors........................................................................................56

6.1 Connector Location..................................................................................................................... 56

7Pinout List.........................................................................................57

7.1 General Signal Description............................................................................................................ 57

7. Connector X1A Row A................................................................................................................... 58

7.3 Connector X1A Row B................................................................................................................... 60

7.4 Connector X1B Row C................................................................................................................... 6

7.5 Connector X1B Row D................................................................................................................... 64

8BIOS Operation...................................................................................66

8.1 Determining the BIOS Version.......................................................................................................66

8. BIOS Update.............................................................................................................................. 66

8.3 Setup Guide............................................................................................................................... 68

8.4 POST Codes................................................................................................................................ 68

8.4.1 Start AMI® Aptio Setup Utility....................................................................................................... 68

COMe-bSC6 /

8.5 BIOS Setup................................................................................................................................ 70

8.5.1 Main........................................................................................................................................ 70

8.5. Advanced.................................................................................................................................. 7

8.5.3 Chipset..................................................................................................................................... 96

8.5.4 Boot....................................................................................................................................... 11

8.5.5 Security.................................................................................................................................. 114

8.5.6 Save & Exit............................................................................................................................... 116

COMe-bSC6 / User Information

1 User Information

1.1 About This Document

This document provides information about products from Kontron Europe GmbH and/or its subsidiaries. No warranty of

suitability, purpose, or fitness is implied. While every attempt has been made to ensure that the information in this

document is accurate, the information contained within is supplied “as-is” and is subject to change without notice.

For the circuits, descriptions and tables indicated, Kontron assumes no responsibility as far as patents or other rights of

third parties are concerned.

1.2 Copyright Notice

translated into any language or computer language, in any form or by any means (electronic, mechanical, photocopying,

recording, or otherwise), without the express written permission of Kontron Europe GmbH.

DIMM-PC®, PISA®, ETX®, ETXexpress®, microETXexpress®, X-board®, DIMM-IO® and DIMM-BUS® are trademarks or

registered trademarks of Kontron Europe GmbH. Kontron is trademark or registered trademark of Kontron AG.

1.3 Trademarks

The following lists the trademarks of components used in this board.

» IBM, XT, AT, PS/ and Personal System/ are trademarks of International Business Machines Corp.

» Microsoft is a registered trademark of Microsoft Corp.

» Intel is a registered trademark of Intel Corp.

» All other products and trademarks mentioned in this manual are trademarks of their respective owners.

1.4 Standards

Kontron Europe GmbH is certified to ISO 9000 standards.

COMe-bSC6 / User Information

1.5 arranty

For this Kontron Europe GmbH product warranty for defects in material and workmanship exists as long as the warranty

period, beginning with the date of shipment, lasts. During the warranty period, Kontron Europe GmbH will decide on its

discretion if defective products are to be repaired or replaced.

Within the warranty period, the repair of products is free of charge as long as warranty conditions are observed.

Warranty does not apply for defects arising/resulting from improper or inadequate maintenance or handling by the buyer,

unauthorized modification or misuse, as well as the operation outside of the product´s environmental specifications and

improper installation and maintenance.

Kontron Europe GmbH will not be responsible for any defects or damages to other products not supplied by Kontron

Europe GmbH that are caused by a faulty Kontron Europe GmbH product.

1.6 Technical Support

Technicians and engineers from Kontron Europe GmbH and/or its subsidiaries are available for technical support. We are

committed to make our product easy to use and will help you use our products in your systems.

Please consult our Website at http://www.kontron.com/support for the latest product documentation, utilities, drivers

and support contacts. Consult our customer section http://emdcustomersection.kontron.com for the latest BIOS

downloads, Product Change Notifications, Board Support Packages, DemoImages, 3D drawings and additional tools and

software. In any case you can always contact your board supplier for technical support.

COMe-bSC6 / Introduction

2 Introduction

2.1 Product Description

In 011, Intel® introduced its first quad core CPU suitable for the COM Express® platform. With the quad-core CPU Core™

i7- 715QE and the dual-core CPUs Core™ i3/i5/i7, COM Express® reaches ground-breaking performance values: both for

CPU and GPU rankings. With various CPUs COMe-bSC# serves your individual performance needs, starting with a 1.1 GHz

version Celeron® 847E.

Kontron's COMe-bSC# is available as COM Express® basic form factor (1 5x95mm) for Pin-out Type (COMe-bSC ) and

Pin-out Type 6 (COMe-bSC6).

2.2 Naming clarification

COM Express® defines a Computer-On-Module, or COM, with all components necessary for a bootable host computer,

packaged as a super component.

» COMe-bXX# modules are Kontron's COM Express® modules in basic form factor (1 5mm x 95mm)

» COMe-cXX# modules are Kontron's COM Express® modules in compact form factor (95mm x 95mm)

» COMe-mXX# modules are Kontron's COM Express® modules in mini form factor (55mm x 84mm)

The product names for Kontron COM Express® Computer-on-Modules consist of a short form of the industry standard

(COMe-), the form factor (b=basic, c=compact, m=mini), the capital letters for the CPU and Chipset Codenames ( ) and

the pin-out type (#) followed by the CPU Name.

2.3 Understanding COM Express® Functionality

All Kontron COM Express® basic and compact modules contain two 0pin connectors; each of it has two rows called Row

A & B on primary connector and Row C & D on secondary connector. COM Express® Computer-on-modules feature the

following maximum amount of interfaces according to the PICMG module Pin-out type:

Feature Pin-Out Type 1 Pin-Out Type 10 Pin-Out Type 2 Pin-Out Type 6

HD Audio 1x 1x 1x 1x

Gbit Ethernet 1x 1x 1x 1x

Serial ATA 4x 4x 4x 4x

Parallel ATA - - 1x -

PCI - - 1x -

PCI Express x1 6x 6x 6x 8x

PCI Express x16 (PEG) - - 1x 1x

USB Client 1x 1x - -

USB 2.0 8x 8x 8x 8x

USB 3.0 - x - 4x

VGA 1x - 1x 1x

LVDS Dual Channel Single Channel Dual Channel Dual Channel

DP++ (SDVO/DP/HDMI/DVI) 1x optional 1x 3x shared with PEG 3x

LPC 1x 1x 1x 1x

External SMB 1x 1x 1x 1x

External I2C 1x 1x 1x 1x

GPIO 8x 8x 8x 8x

SDIO shared w/GPIO 1x optional 1x optional - 1x optional

UART (2-wire COM) - x - x

FAN PWM out - 1x - 1x

COMe-bSC6 / Introduction

2.4 COM Express® Documentation

This product manual serves as one of three principal references for a COM Express® design. It documents the

specifications and features of COMe-bSC6. Additional references are available at your Kontron Support or at PICMG®:

» The COM Express® Specification defines the COM Express® module form factor, pin-out, and signals. This document

is available at the PICMG® website by filling out the order form.

» The COM Express® Design Guide by PICMG® serves as a general guide for baseboard design, with a focus on

maximum flexibility to accommodate a wide range of COM Express® modules.

Some of the information contained within this product manual applies only to certain

product revisions (CE: xxx). If certain information applies to specific product revisions (CE:

xxx) it will be stated. Please check the product revision of your module to see if this

information is applicable.

2.5 COM Express® Benefits

COM Express® modules are very compact, highly integrated computers. All Kontron COM Express® modules feature a

standardized form factor and a standardized connector layout which carry a specified set of signals. Each COM is based on

the COM Express® specification. This standardization allows designers to create a single-system baseboard that can

accept present and future COM Express® modules.

The baseboard designer can optimize exactly how each of these functions implements physically. Designers can place

connectors precisely where needed for the application on a baseboard designed to optimally fit a system’s packaging.

A single baseboard design can use a range of COM Express® modules with different sizes and pin-outs. This flexibility can

differentiate products at various price/performance points, or when designing future proof systems that have a built-in

upgrade path. The modularity of a COM Express® solution also ensures against obsolescence when computer technology

evolves. A properly designed COM Express® baseboard can work with several successive generations of COM Express®

modules.

A COM Express® baseboard design has many advantages of a customized computer-board design and, additionally,

delivers better obsolescence protection, heavily reduced engineering effort, and faster time to market.

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