Freescale Semiconductor 1322x-USB Dongle Manuale utente

Document Number: 1322xUSBRM

Rev. 1.5

11/2010

1322x-USB Dongle

Reference Manual

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product or service names are the property of their respective owners.

1322x-USB Reference Manual, Rev. 1.5

Freescale Semiconductor i

Contents

About This Book

Audience. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . iii

Organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . iii

Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . iii

Chapter 1

Safety Information

1.1 FCC Guidelines. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1

1.2 FCC Labeling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1

1.2.1 47 C.F.R. Sec. 15.21. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1

1.2.2 47 C.F.R. Sec.15.105(b) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2

1.2.3 47 C.F.R. Sec.15.203 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2

1.3 Regulatory Approval For Canada. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2

1.4 Disposal Instructions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2

Chapter 2

1322x USB Dongle Overview

2.1 Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1

2.2 Available Devices. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2

2.3 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2

2.4 Driver Considerations. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-3

2.5 Board Level Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-3

Chapter 3

System Overview and Functional Descriptions

3.1 System Block Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1

3.2 System Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1

3.3 Power Source . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-3

3.4 Low-cost 2.4 GHz ISM Band radio . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-4

3.5 USB Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-4

3.6 Clock. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-5

3.7 Reset Switch and LEDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-5

3.8 FLASH Memory Recovery Jumpers and Erase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-5

3.9 Optional Debug/Development Interface (ARM JTAG Interface) . . . . . . . . . . . . . . . . . . . . . . . 3-6

Chapter 4

Schematic, Board Layout, and Bill of Materials

Chapter 5

PCB Manufacturing Specifications

5.1 Single PCB Construction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-1

5.2 Panelization. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-2

1322x-USB Reference Manual, Rev. 1.5

ii Freescale Semiconductor

5.3 Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-3

5.4 Solder Mask . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-3

5.5 Silk Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-3

5.6 Electrical PCB Testing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-3

5.7 Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-3

5.8 Hole Specification/Tool Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-4

5.9 File Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-4

1322x-USB Reference Manual, Rev. 1.5

Freescale Semiconductor iii

About This Book

This manual describes the Freescale 1322x USB Dongle, which is an IEEE 802.15.4 compliant wireless

node based on the Freescale MC1322x device. The 1322x USB Dongle provides a platform to evaluate the

MC1322x device, develop software and applications, and demonstrate IEEE 802.15.4 and ZigBee

networking capabilities.

Audience

This manual is intended for system designers.

Organization

This document is organized into five chapters.

Chapter 1 Safety Information — Highlights some of the FCC requirements.

Chapter 2 1322x USB Dongle Overview — Introduces the 1322x USB Dongle, which is an

IEEE 802.15.4 compliant wireless node based on the Freescale MC1322X device.

Chapter 3 System Overview and Functional Descriptions — Provides an overview of the

1322x USB Dongle and its connections.

Chapter 4 Schematic and Bill of Material — Provides the schematic, board layout, and Bill

of Materials.

Chapter 5 PCB Manufacturing Specifications — This chapter provides the specifications

used to manufacture the 1322x USB Dongle printed circuit board (PCB).

Revision History

The following table summarizes revisions to this document since the previous release (Rev 1.4).

Revision History

Location Revision

Chapter 2

Chapter 3 Added dimensions to photos.

1322x-USB Reference Manual, Rev. 1.5

iv Freescale Semiconductor

Definitions, Acronyms, and Abbreviations

The following list defines the acronyms and abbreviations used in this document.

ADC Analog to Digital Converter

AES Advanced Encryption Standard

ARM Advanced RISC Machine

CTS Clear to Send

DAC Digital to Analog Converter

DMA Direct Memory Access

I2C Inter-Integrated Circuit is a multi-master serial computer bus

ISM Industrial Scientific Medical 2.4 GHz radio frequency band

JTAG Joint Test Action Group

LGA Land Grid Array

MAC Media Access Controller

MCU Microcontroller Unit

NEXUS An embedded processor development tool interface that helps design engineers

identify software and hardware-level issues.

SN Sensor Node

pcb Printed circuit board

PiP Platform in Package

PWM Pulse-width modulation

RTS Request to Send

SMA Connector SubMiniature version “A” connector

SPI Serial Peripheral Interface

SSI Synchronous Serial Interface

TACT Switch A switch that provides a slight “snap” or “click” to the user to indicate function.

TELCO Telephone Company

USB Universal Serial Bus

VCP Virtual Com Port

1322x-USB Reference Manual, Rev. 1.5

Freescale Semiconductor 1-1

Chapter 1

Safety Information

1.1 FCC Guidelines

This equipment is for use by developers for evaluation purposes only and must not be incorporated into

any other device or system. This device may not be sold to the general public. Integrators will be

responsible for reevaluating the end product (including the transmitter) and obtaining a separate FCC

authorization.

FCC approval of this device only covers the original configuration of this device as supplied. Any

modifications to this product, including changes shown in this manual, may violate the rules of the Federal

Communications Commission and Industry Canada and make operation of the product unlawful.

1.2 FCC Labeling

FCC labels are physically located on the plastic housing.

1.2.1 47 C.F.R. Sec. 15.21

This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant

to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful

interference in a residential installation. This equipment generates, uses and can radiate radio frequency

energy and, if not installed and used in accordance with the instructions, may cause harmful interference

to radio communications. However, there is no guarantee that interference will not occur in a particular

installation. If this equipment does cause harmful interference to radio or television reception, which can

be determined by turning the equipment off and on, the user is encouraged to try to correct the interference

by one or more of the following measures:

• Reorient or relocate the receiving antenna.

• Increase the separation between the equipment and receiver.

• Connect the equipment into an outlet on a circuit different from that to which the receiver is

connected.

• Consult the dealer or an experienced radio/TV technician for help.

Safety Information

1322x-USB Reference Manual, Rev. 1.5

1-2 Freescale Semiconductor

1.2.2 47 C.F.R. Sec.15.105(b)

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment.

The antenna(s) used for this equipment must be installed to provide a separation distance of at least 8

inches (20cm) from all persons.

This device complies with Part 15 of the FCC Rules. Operation is subject to the following three

conditions:

1. This device may not cause harmful interference.

2. This device must accept any interference received, including interference that may cause undesired

operation.

3. This device is susceptible to electrostatic discharge (ESD) and surge phenomenon.

1.2.3 47 C.F.R. Sec.15.203

An intentional radiator shall be designed to ensure that no antenna other than that furnished by the

responsible party shall be used with the device. The use of a permanently attached antenna or of an

antenna that uses a unique coupling to the intentional radiator shall be considered sufficient to comply with

the provisions of this Section. The manufacturer may design the unit so that a broken antenna can be

replaced by the user, but the use of a standard antenna jack or electrical connector is prohibited. This

requirement does not apply to carrier current devices or to devices operated under the provisions of

Sections 15.211, 15.213, 15.217, 15.219, or 15.221. Further, this requirement does not apply to intentional

radiators that must be professionally installed, such as perimeter protection systems and some field

disturbance sensors, or to other intentional radiators which, in accordance with Section 15.31(d), must be

measured at the installation site. However, the installer shall be responsible for ensuring that the proper

antenna is employed so that the limits in this Part are not exceeded.

1.3 Regulatory Approval For Canada

This Class B digital apparatus complies with Canadian ICES-003 and RSS 210, Issue 7.

Cet appareil numérique de la classe B est conforme à la norme NMB-003 du Canada.

1.4 Disposal Instructions

This product may be subject to special disposal requirements. For product disposal instructions, refer to

www.freescale.com/productdisposal.

1322x-USB Reference Manual, Rev. 1.5

Freescale Semiconductor 2-1

Chapter 2

1322x USB Dongle Overview

2.1 Introduction

The 1322x USB Dongle is an IEEE 802.15.4 compliant wireless node based on the Freescale MC1322x

device. The heart of the 1322x USB module is Freescale’s MC1322x 99-pin LGA Platform-in-Package

(PiP) solution that can be used for wireless applications ranging from simple proprietary point-to-point

connectivity to complete ZigBee mesh networking. The MC1322x is designed to provide a highly

integrated, total solution, with premier processing capabilities and very low power consumption.

The 1322x USB Dongle provides a platform to evaluate the MC1322x device, develop software and

applications, and demonstrate IEEE 802.15.4 and ZigBee networking capabilities. The dongle connects

the core device to a personal computer (PC) through a USB port, UART port interface device. The small

form factor illustrates an extremely small footprint, 4-layer printed circuit board (PCB) layout with a chip

antenna. The MC1322x node typically interfaces to the PC through a virtual COM port (VCM).

As initially provided from Freescale, the dongle is loaded with a software application that implements a

wireless “sniffer” to monitor over-the-air IEEE 802.15.4 traffic.

Figure 2-1. 1322x USB Dongle Top View

2.36 inches (60 mm)

0.47 inches (12 mm)

0.94 inches

(24 mm)

1322x USB Dongle Overview

1322x-USB Reference Manual, Rev. 1.5

2-2 Freescale Semiconductor

2.2 Available Devices

The MC1322x family is available as two part numbers. These device types differ only in their ROM

contents, all other device hardware, performance, and specifications are identical:

• MC13224V - this is the original version and is the generic part type. It is intended for most IEEE

802.15.4 applications including MAC-based, ZigBee-2007 Profile 1, and ZigBee RF4CE targets.

• MC13226V - this is a more recent version and is intended specifically for ZigBee-2007 Profile 2

(Pro) applications. Only the onboard ROM image has been changed to optimize ROM usage for

the ZigBee Pro profile and maximize the amount of available RAM for application use -

— The IEEE MAC/PHY functionality has been streamlined to include only that functionality

required by the ZigBee specification. The MAC functionality is 802.15.4 compatible.

— Certain drivers present in the MC13224 ROM have been removed including the ADC,

LCD_font, and SSI drivers. These drivers are still available as library functions, but now

compile into the RAM space.

— The Low Level Component (LLC) functionality has also been streamlined for the ZigBee

specification

NOTE

The MC13226 USB dongles will be marked as MC13226 USB.

2.3 Features

The 1322x USB Dongle provides the following features:

• Full IEEE 802.15.4 compliant wireless node; ZigBee capable with Freescale’s BeeStack software

stack

• Based on Freescale’s third-generation MC1322x ZigBee platform which incorporates a complete,

low power, 2.4 GHz radio frequency transceiver, 32-bit ARM7 core based MCU, hardware

acceleration for both the IEEE 802.15.4 MAC and AES security, and a full set of MCU peripherals

into a 99-pin LGA Platform-in-Package (PiP)

• MC1322x provides a highly integrated, low cost RF node

— On-board balun and antenna switch in package

— Typical -95 dBm sensitivity

— Typical 0 dBm output power, with max approximately +4 dBm

— Chip antenna

• Powered from USB interface with power-on green LED

• USB interface is full-speed compatible to the USB 2.0 and 1.1 specifications

• 20-pin site for standard JTAG debug/development interface connector

• Programmable user red LED for application purposes

• Reset switch

• Default 24 MHz crystal reference oscillator

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