Grantech SYS86355VGGA-6 Manuale utente

SYS86355VGGA-6

C User Manual

Revision: 1.0

Release date: April 27, 2020

Trademark:

* Specifications and Information contained in this documentation are furnished for information use only, and are

subject to change at any time without notice, and should not be construed as a commitment by

Environmental Protection Announcement

Do not dispose this electronic device into the trash while discarding. To minimize

pollution and ensure environment protection of mother earth, please recycle.

ENVIRONMENTAL SAFETY INSTRUCTION...........................................................................iii

USER’S NOTICE .......................................................................................................................iv

MANUAL REVISION INFORMATION.......................................................................................iv

ITEM CHECKLIST.....................................................................................................................iv

CHAPTER 1 INTRODUCTION OF THE MOTHERBOARD

1-1 PRODUCT FEATURES ..............................................................................................1

1-2 SPECIFICATION.........................................................................................................2

1-3 MAIN BOARD DIAGRAM ...........................................................................................3

CHAPTER 2 HARDWARE INSTALLATION

2-1 LOCATION OF INTERNAL JUMPER AND CONNECTOR........................................5

2-2 INTERNAL JUMPER AND CONNECTOR SETTING.................................................6

2-2-1 CONNECTORS .............................................................................................9

2-2-2 HEADERS .....................................................................................................13

TABLE OF CONTENT

iii

Environmental Safety Instruction

Avoid the dusty, humidity and temperature extremes. Do not place the product in

any area where it may become wet.

0 to 60 centigrade is the suitable temperature. (The figure comes from the request

of the main chipset)

Generally speaking, dramatic changes in temperature may lead to contact

malfunction and crackles due to constant thermal expansion and contraction from

the welding spots’ that connect components and PCB. Computer should go

through an adaptive phase before it boots when it is moved from a cold

environment to a warmer one to avoid condensation phenomenon. These water

drops attached on PCB or the surface of the components can bring about

phenomena as minor as computer instability resulted from corrosion and oxidation

from components and PCB or as major as short circuit that can burn the

components. Suggest starting the computer until the temperature goes up.

The increasing temperature of the capacitor may decrease the life of computer.

Using the close case may decrease the life of other device because the higher

temperature in the inner of the case.

Attention to the heat sink when you over-clocking. The higher temperature may

decrease the life of the device and burned the capacitor.

USER’S NOTICE

INCLUDING THE PRODUCTS AND SOFTWARE DESCRIBED IN IT MAY BE REPRODUCED, TRANSMITTED

OR TRANSLATED INTO ANY LANGUAGE IN ANY FORM OR BY ANY MEANS WITHOUT WRITTEN

PERMISSION OF THE MANUFACTURER.

THIS MANUAL CONTAINS ALL INFORMATION REQUIRED TO USE THIS MOTHER-BOARD SERIES AND WE

DO ASSURE THIS MANUAL MEETS USER’S REQUIREMENT BUT WILL CHANGE, CORRECT ANY TIME

WITHOUT NOTICE. MANUFACTURER PROVIDES THIS MANUAL “AS IS” WITHOUT WARRANTY OF ANY

KIND, AND WILL NOT BE LIABLE FOR ANY INDIRECT, SPECIAL, INCIDENTAL OR CONSEQUENTIAL

DAMAGES (INCLUDING DAMAGES FOR LOSS OF PROFIT, LOSS OF BUSINESS, LOSS OF USE OF DATA,

INTERRUPTION OF BUSINESS AND THE LIKE).

PRODUCTS AND CORPORATE NAMES APPEARING IN THIS MANUAL MAY OR MAY NOT BE

REGISTERED TRADEMARKS OR COPYRIGHTS OF THEIR RESPECTIVE COMPANIES, AND THEY ARE

USED ONLY FOR IDENTIFICATION OR EXPLANATION AND TO THE OWNER’S BENEFIT, WITHOUT

INTENT TO INFRINGE.

Manual Revision Information

Reversion Revision History Date

4.0 Fourth Edition April 27, 2020

Item Checklist

Motherboard

Cable(s)

I/O Back panel shield

Chapter 1

Introduction of the Motherboard

1-1 Product Features

Intel®LGA 1150 Socket Core i7/i5/i3/Pentium Processor

Support 2 x DDR3 /DDR3L 1600/1333Mhz SO-DIMM up to 16GB

2 x Intel®i211AT Gigabit Ethernet

4 x USB3.0 (PCI-E to USB3.0), 8 x USB2.0

2 x SATA Ports, 1 x PCI-Ex16 Slot

1 x M-SATA (Co-lay Mini PCIe, Full size), 2 x Mini PCIe connector(Full size)

6 x RS232 serial port (COM1/COM2 support RS232/422/485)

2 x CRT Ports (CRT2 support Dummy load function)

Support SIM Card Socket, TPM Header

4 Phase CPU Power Support 84W CPU

Integrated HD Audio CODEC with 6.0 CH

1-2 Specification

Spec Description

CPU Intel®LGA 1150 Socket Core i7/i5/i3/Pentium Processor

Memory 2* DDR3/DDR3L 1600/1333MHz SO-DIMM slot up to 16GB

Expansion Slot

2* Full-size Mini PCIe slot (MINI_CARD Co-lay MSATA)

1 * PCIex16 Slot

1* SIM Card socket

Storage 2* SATA III 6G/s Connector

1* Full-size mSATA (MINI_CARD Co-lay mini-PCIE)

LAN Chip

2* Intel®i211AT GbE

Support Fast Ethernet LAN function of providing 10/100/1000Mbps

Ethernet data transfer rate

Audio Chip Realtek ALC662 HD Audio Codec integrated

Audio driver and utility included

BIOS AMI 32MB Flash ROM

Rear I/O

1 * HDMI

2 * VGA

2* RS 232/422/485 serial ports (COM1/2)

2* RJ45, 10/100/1000 Mbps

4* USB3.0 & 2* USB2.0 ports

1* MIC, Line-in, Line-out port

Internal I/O

1* Front panel header

1* PS/2 header

6* USB 2.0 header

4* RS 232 Serial port header

1* TPM header

1* 8-bit GPIO (4* In and 4* Out)

1* SPEAK_CON amplifier header

1* LAN LED header

1* AT_ATX Mode header

1* CPU / Chassis Fan connectors

1-3 Main Board Diagram: Front

Intel CPU

Socket

Top/Middle:

USB2.0

Bottom:

HDMI

Top:

RJ-45

LAN Port1

Middle/Bottom:

USB3.0 Ports

Top:

Line-In

Middle:

Line-Out

Bottom:

MIC CPUFAN Header

Top:

COM1

Bottom:

VGA1

SYSFAN1 Header

JW_FP

Header

SPEAK_CON

Header

SIM Card

Socket

Top:

COM2

Bottom:

VGA2

Top:

RJ-45

LAN Port2

Middle/Bottom:

USB3.0 Ports

PCIe x16 Slot

SODIMM1

ATXPWR

Connector

ATX12V

Connector

Mini-PCIe Slot

Mini-PCIE/

mSATA Slot

SATAIII Ports

(SATA1/2)

LAN_LED

Header

Main Board Diagram: Back

SODIMM2

Chapter 2

Hardware Installation

2-1 Location of Internal Jumper and Connector

Intel CPU

Top/Middle:

USB2.0

Bottom:

HDMI

Top:

RJ-45

LAN Port2

Middle/Bottom:

USB3.0 Ports

Top:

Line-In

Middle:

Line-Out

Bottom:

MIC CPUFAN Header

Top:

COM1

Bottom:

VGA1

SYSFAN1 Header

JW_FP

Header

SPEAK_CON

Header

SIM Card

Socket

Top:

COM2

Bottom:

VGA2

Top:

RJ-45

LAN Port1

Middle/Bottom:

USB3.0 Ports

PCIe x16

Connector

SODIMM1

ATXPWR

Connector

ATX12V

Connector

Mini PCIe

Connector

JPCOM1

JPCOM2

LAN_LED

Header

COM5-COM6

COM3

JPCOM3

JPCOM4

COM4

COM3_SEL

F_USB3 F_USB2

JP3

COM4_SEL

TPM1

F_USB1

BATCON

PS2_VCC

PS2_CON1

JBAT

GPIO_CON

CASE_OPEN

AT_ATX_MODE

SATAIII Ports

(SATA1/2)

JP4

Mini-PCIE/

mSATA Slot

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