Hakko Electronics FR-811 Manuale utente

Tool Information

The Hakko Rework Tool is used for quick placement and/or removal of components

from PCB boards through heating and vacuuming. Some key features include the ability to

make full-scale thermal profiles, measure and record the temperature of components, and easy

data transfer.

Company: Hakko

Model: Hakko FR-811

Link to the Hakko station:

https://www.hakko.com/english/products/hakko_fr811_set.html

Part Names

In this user guide, we will refer to different parts of the tool with the same names found in the

manual from Hakko.

Placement of the PCB Board

1. Getting You Oriented

We will refer to the XYZ axis assuming that you are seeing the tool in the

following orientation, so that you are facing the front of the bottom heater.

The goal is to orient the PCB board and handpiece so that the pad is directly on

area of which you wish to remove/add a component.

2. Course adjustment

X-axis adjustment: The PCB board will be placed between the rails (located

above the bottom heater). To move these rails, first loosen their lock knobs.

Then, press down on the underlying small, square black platforms and slide the

rails in the desired direction. If you hear a grinding noise, you’re doing it wrong

(you’re welcome).

Z-axis adjustment: Adjust the height of the entire L-shaped structure using the

lock lever located near the upper left of the structure.

Rotation: You can rotate the arm of the L-shaped structure by loosening the

knob located to the left of the handpiece.

3. Fine adjustment

X-axis adjustment: The rearward knob in the back righthand corner will move the

rails that hold the PCB board along the x-axis (left or right).

Y-axis adjustment: The knob closest to you in the bottom leftmost corner will

move the entire L-shaped structure along the y-axis (towards or away from you).

oCounterclockwise will move it further from you.

oClockwise will move it towards you.

4. Double check

The pad should be directly above the area where you wish to add/remove a

component.

How to Remove Components

1. Placement of PCB board

The nozzle and pad should be directly above, but barely above, the part to be

removed (a separation of 2 millimeters give or take). More detailed instructions

can be found above.

2. Heating

Turn on the Hakko station (the blue box) by pressing the power button on the

left. Make sure it is plugged in.

Press the “S” button in the lower right hand corner to begin heating.

oNote: the nozzle and pad should already be centered on the piece you

want to remove!

Press the “S” button to turn heating off when the solder in that area appears

melted.

3. Part removal

Rotate the yellow knob on the handpiece so that the pad is just barely poking

out of the nozzle.

Turn on the vacuum by pressing the “V” button on the Hakko station (it is next to

the “S” button). You can check that it is on by placing your finger under the pad.

You should feel suction.

oNote that there are different nozzle sizes and pad sizes. The larger the

piece you want to remove, the larger the nozzle and pad you use.

The vacuum should suction up the part. If it is not working, check to see that

enough heat has been applied so that the surrounding solder has melted.

4. Releasing the removed part

Position the vacuum with the part so that it is just above the tray with the heat

resistant pad (the black rectangular piece).

Press “V” to turn off the vacuum. The part should drop down onto the pad.

5. Cooling

Wait for the part to cool down before touching!

How to Add Components

1. Solder paste

Apply an appropriate amount of solder paste to the PCB board where you wish

to install the component.

2. Suction

Turn on the Hakko station (the blue box) by pressing the power button on the

left. Make sure it is plugged in.

Rotate the yellow knob on the handpiece so that the pad is just barely poking

out of the nozzle.

Turn on the vacuum by pressing the “V” button on the Hakko station. You can

check that it is on by placing your finger under the pad. You should feel suction.

Have the part sucked up by the pads.

3. Placement of PCB board

oLower the part so that it is where you want it on the PCB board (contact

should be made).

oTurn off the vacuum by pressing “V”.

4. Heating

Press the “S” button in the lower right hand corner to begin heating.

Press the “S” button to turn heating off when the solder in that area appears

melted. You should see the component merge with the PCB board.

5. Cooling

Wait for the solder to harden!

6. Lift the handpiece

When the solder has hardened, lift the handpiece.

Using the Station

There are 2 modes. Manual and Automatic. To remove/add a component, you generally do not

have to concern yourself with worrying about which mode to use. For your reference,

instructions for how to use the control knob to navigate the screen is written below.

Control Knob

There are 4 main types of control knob operations

oTurning the control knob left or right changes values or changes the selected

item.

oTilting the control knob left or right shifts the selected position or changes the

selected item. (Example: When the hundreds digit in the temperature setting

screen is blinking, tilting it once to the right will shift the selected position to the

tens digit.)

oTilting the control knob up or down changes the selected item.

oPressing the center of the control knob confirms input of data values and ends

the input mode for that data

Notes

Note that the bottom heater is not used in this manual.

oIf the bottom heater is on, “BTM” will appear in the top right hand corner of the

station screen. If the bottom heater is being used, you will see a black square

displayed to the right of “BTM”

The thermocouple is also not used. You can use it by plugging it into the station and

placing the other end of the wire on whatever object you wish to measure the

temperature of.

We also do not explore creating thermoprofiles or transferring data. Note that this tool

can be plugged into a computer.

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