HP 5500-24G-SFP EI TAA Istruzioni per il montaggio

Product End-of-Life Disassembly Instructions

Product Category: Networking Equipment

Marketing Name / Model

[List multiple models if applicable.]

HP 5500-24G-SFP HI Switch w/2 Intf Slt(JG543A)

HP 5500-24G-SFP HI TAA Swch w/2Slt(JG681A)

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU

directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA)

With a surface greater than 10 sq cm

Batteries

All types including standard alkaline and lithium coin

or button style batteries

Mercury-containing components

For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface greater

than 100 sq cm

Includes background illuminated displays with gas

discharge lamps

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height

External electrical cables and cords

Gas Discharge Lamps

Plastics containing Brominated Flame Retardants

weighing > 25 grams (not including PCBs or PCAs

already listed as a separate item above)

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent

chambers, and service stations.

Components and waste containing asbestos

Components, parts and materials containing

refractory ceramic fibers

Components, parts and materials containing

radioactive substances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

EL-MF877-00 Page 1

Template Revision B

Tool Description

Tool Size (if

applicable)

Screw driver

Tweezers

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Unscrew the screws for mounting angle 1, and then remove the mounting angle 1 from the rack.

2. Remove all of the labels.

3. Unscrew the screws on filler panel 2 and 3, and then remove them.

4. Unscrew the screws on top cover 4, and then remove it.

5. Unscrew the screws on PCB-assembly 5, and then remove the assembly.

6. Remove the light pipes 6,7,8,9 on the PCB-assembly 5.

7. Unscrew the screws on fans 10 and 11, remove them from chassis assembly 13.

8. Remove the front panel assembly 12 from chassis assembly 13.

9. Remove shielding fingers 3.1 from filler panel 3.

10. Unscrew the screws on part 5.1, remove it from PCB-assembly 5.

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations).

Figure 1Remove mounting angle Figure 2 Rear of HP 5500-24G-SFP HI Switch

EL-MF877-00 Page 2

Template Revision B

3.3 Material of the facility built

Facility

Components

Material

Weight(g)

Weight

percentage

Selective treatment for materials

and components

Details

1.6%

recycling

1.1%

recycling

3.2

1.7%

recycling

1460

30.7%

recycling

5.1

100

2.1%

recycling

Figure 3Treatments to the product Figure 4Treatments to the filler panel 3

Figure 5Treatments to PCB-assembly

EL-MF877-00 Page 3

Template Revision B

5.2

Complex

PCB

1010

21.3%

The surface of PCB is greater

than 10 square centimeters;

0.7%

Pla

recycling

0.4%

1.9%

PC+ABS

1.1%

Pla

recycling

1860

39.2%

recycling

4. Revised record

Date

Version

Author

Modify content

2012.11.20

Wang Zitao

Initial version

2013.04.10

Liu Baoquan

Add the module JG681A

EL-MF877-00 Page 4

Template Revision B

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