HPE Altoline 9960 LC1 Istruzioni per il montaggio

MF877-00 Page 1

Template Revision A

HPE instructions for this template are available at MF877-01

Product End-of-Life Disassembly Instructions

Product Category: Networking Equipment

Marketing Name / Model

[List multiple models if applicable.]

HPE Altoline 9960 LC1 32x100G Line Card (JC912A)

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU

directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description Notes

Quantity of

items

included in

product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA)

With a surface greater than 10 sq cm

Batteries

All types including standard alkaline and lithium

coin or button style batteries

Mercury-containing components

For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface

greater than 100 sq cm

Includes background illuminated displays with gas

discharge lamps

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

AL-POLY capacitor

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height

External electrical cables and cords

Gas Discharge Lamps

Plastics containing Brominated Flame Retardants

weighing > 25 grams (not including PCBs or PCAs

already listed as a separate item above)

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent

chambers, and service stations.

Components and waste containing asbestos

Components, parts and materials containing

refractory ceramic fibers

Components, parts and materials containing

radioactive substances

MF877-00 Page 2

Template Revision A

HPE instructions for this template are available at MF877-01

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

Tool Description

Tool Size (if

applicable)

Phillips screwdriver

Nut spinner screwdriver

5mm

Nut spinner screwdriver

5.5mm

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Remove the CPU board

1. Using a 5.5mm Nut spinner screwdriver, remove the 5pcs nuts attaching the CPU board.

2. Remove the CPU board off the chassis.

3. Repeat for the other CPU board.

2. Remove the spacers

1. Using a 5mm Nut spinner screwdriver, remove the 5pcs spacers under the CPU board.

2. Repeat for the other 5pcs spacers.

3. Remove the mainboard

1. Using a Phillips screwdriver, remove the 12pcs screws attaching the mainboard.

2. Remove the mainboard.

4. Remove the heatsink and bracket on the mainboard

1. Using a Phillips screwdriver, loose the 4pcs screws attaching the heatsink.

2. Remove the heatsink and bracket.

3. Repeat for the other heatsink.

5. Remove the luggage tab.

MF877-00 Page 3

Template Revision A

HPE instructions for this template are available at MF877-01

EL-MF877-00 Page 4

Template Revision B

EL-MF877-00 Page 5

Template Revision B

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