IDT 9FGV1005 Istruzioni operative

The register descriptions section describes the behavior and function of the customer-programmable non-volatile-memory registers in the

9FGV1005 clock generator.

For details of product operation, refer to the product datasheet.

9FGV1005 Clock Register Set

The device contains volatile (RAM) 8-bit registers and non-volatile 8-bit registers (Figure 1). The non-volatile registers are One-Time

Programmable (OTP) and will be pre-programmed at the factory with a custom dash-code configuration.

The device operates according to settings in the RAM registers. At power-up a pre-programmed configuration is transferred from OTP to

RAM registers. The device behavior can then be modified by reprogramming the RAM registers through I2C.

The device can start up in “I2C mode” or in “Hardware Select Mode”, depending upon the status of the REF0_SEL_I2C# pin at power up.

Also see the datasheet. I2C access is only possible when the device has started up in I2C mode. Startup in I2C mode is default when no

pull-up is added to the REF0_SEL_I2C# pin. Pre-programming settings determine which of the 4 OTP banks is loaded into RAM registers

at power up in I2C mode. Using I2C commands, the configuration can be changed and there are also commands to reload a configuration

from a different OTP bank.

Figure 1. Register Maps

User Configuration Table Selection

At power-up, the voltage at OUT0_SEL_I2CB pin 24 is latched by the part and used to select the state of SEL0/SCL and SEL1/SDA pins

(Table 1).

When a weak pull-up (10kΩ) is placed on REF0_SEL_I2C#, the SEL0/SCL and SEL1/SDA pins will be configured as hardware select

inputs, SEL0 and SEL1. Connecting SEL0 and SEL1 to VDDD and/or GND selects one of 4 configuration register sets, CFG0 through

CFG3, which is then loaded into the non-volatile configuration registers to configure the clock synthesizer. The CFG0 through CFG3

configurations are preprogrammed at the factory according to customer specifications and assigned a specific (dash) part number.

When a weak pull-down is placed on REF0_SEL_I2C# (or when it is left floating to use internal pull-down), the pins SEL0 and SEL1 will

be configured as an I2C interface's SDA and SCL slave bus. Configuration register set CFG0 is commonly loaded into the non-volatile

configuration registers to configure the clock synthesizer but the device can be configured to load any of the other configurations. The

host system can use the I2C bus to update the volatile RAM registers to change the configuration, and to read status registers.

9FGV1005 Register Descriptions and

Programming Guide

9FGV1005 Register Descriptions and Programming Guide

I2C Interface and Register Access

When powered up in I2C mode, the device allows access to internal RAM registers. The default device address is 0xD0 for 8 bits or 0x68

for 7 bits. The device can be preprogrammed for addresses in the range 0xD0-D2-D4-D6 for 8 bits or 0x68-69-6A-6B for 7 bits. The

device acts as a slave device on the I2C bus using one of the four I2C addresses to allow multiple devices to be used in the system. The

interface accepts byte-oriented block write and block read operations. Two address bytes specify the register address of the byte position

of the first register to write or read. Data bytes (registers) are accessed in sequential order from the lowest to the highest byte (most

significant bit first). Read and write block transfers can be stopped after any complete byte transfer. During a write operation, data will not

be moved into the registers until the STOP signal is received, at which point, all data received in the block write will be written

simultaneously in the registers.

For full electrical I2C compliance, it is recommended to use external pull-up resistors for SDATA and SCLK. The internal pull-up resistors

have a size of 100kΩtypical.

Figure 2. I2C R/W Sequence

Table 1. Power-Up Setting of Hardware Select Pin vs I2C Mode, and Default OTP Configuration Register

OUT0_SEL_I2CB Strap at

Power-Up SEL1/SDA pin SEL0/SCL pin Function

10kΩpull-up

0 0 OTP bank CFG0 used to initialize RAM configuration registers.

0 1 OTP bank CFG1 used to initialize RAM configuration registers.

1 0 OTP bank CFG2 used to initialize RAM configuration registers.

1 1 OTP bank CFG3 used to initialize RAM configuration registers.

10kΩpull-down or floating SDA SCL I2Cbus enabled to access registers.

OTP bank CFG0 used to initialize RAM configuration registers.

9FGV1005 Register Descriptions and Programming Guide

Table 2. RAM Overview

0x00 Device / I2C settings.

0x01 REF output settings.

0x02

Reserved.0x03

0x04

0x05

OUT1 output settings.0x06

0x07

0x08

Reserved.0x09

0x0A

0x0B

OUT0 output settings.0x0C

0x0D

0x0E Crystal oscillator settings.

0x0F

0x10

Reserved.

0x11

0x12

0x13

0x14

0x15

0x16

0x17

0x18

0x19

0x1A PLL miscellaneous.

0x1B

0x1C

PLL loop filter settings.0x1D

0x1E

0x1F PLL feedback divider value.

9FGV1005 Register Descriptions and Programming Guide

See Table 3 for details at the bit level.

0x20

Integer output divider values.0x21

0x22

0x23 Reserved.

0x24 Reserved.

0x25 Miscellaneous device settings.

Table 3. RAM Register Map

Decimal Hex

00 0x00

7 0 Device preprogrammed? 0 = No, 1 = Yes.

[6..5] 00 I2C device address. 00 = 0xD0 / 0x68, 01 = 0xD2 / 0x69, 10 = 0xD4 / 0x6A,

11= 0xD6 / 0x6B 1.

[4..2] 00 Reserved.

[1..0] 00 Load configuration number at power-up 2.

01 0x01

[7..6] 01 Enable REF outputs: 0x = REF0 disabled (unused), 10 = REF0 enabled.

50Reserved.

4 0 Behavior when REF is unused: 0 = Logic “0”, 1 = High impedance (tri-state).

[3..2] 11 REF outputs power supply voltage: 00 = 01 = 1.8V, 10 = 2.5V, 11 = 3.3V.

[1..0] 11 Reserved.

02 0x02 [7..0] 03-hex Reserved.

03 0x03 [7..0] 34-hex Reserved.

04 0x04 [7..0] 54-hex Reserved.

05 0x05

7 1 Enable OUT1: 0 = Disabled (unused), 1 = Enabled.

[6..4] 000

OUT1 configuration:

000 = LP-HCSL, Low-power HCSL.

001 = CMOS1, Single-ended CMOS on true output pin.

011 = LVDS.

100 = CMOS2, Single-ended CMOS on complementary output pin.

101 = CMOSD, Differential CMOS.

111 = CMOSP, Two single-ended CMOS outputs, in-phase.

010 and 110 are not used.

[3..2] 00 OUT1 power supply voltage: 00 = 01 = 1.8V, 10 = 2.5V, 11 = 3.3V.

[1..0] 11 Reserved.

Table 2. RAM Overview

9FGV1005 Register Descriptions and Programming Guide

06 0x06

70Reserved.

6 0 Behavior when OUT1 is unused: 0 = Logic “0”, 1 = High impedance (tri-state).

5 1 OUT1 LP-HCSL slew rate control: 0 = Slow, 1 = Fast.

4 1 OUT1 LP-HCSL impedance control: 0 = 85Ωdifferential, 1 = 100Ωdifferential.

[3..0] 0100 OUT1 LP-HCSL amplitude control: 650mVpp at 0000 – 950mVpp at 1111.

07 0x07

70Reserved.

[6..4] 101 OUT1 LVDS common mode control: 8μA at 000 – 11.5μA at 111.

30Reserved.

[2..0] 100 OUT1 LVDS amplitude control: 30μA at 000 – 65μA at 111.

08 0x08 [7..0] 03-hex Reserved.

09 0x09 [7..0] 34-hex Reserved.

10 0x0A [7..0] 54-hex Reserved.

11 0x0B

7 1 Enable OUT0: 0 = Disabled (unused), 1 = Enabled.

[6..4] 000

OUT0 configuration:

000 = LP-HCSL, Low-power HCSL.

001 = CMOS1, Single-ended CMOS on true output pin.

011 = LVDS.

100 = CMOS2, Single-ended CMOS on complementary output pin.

101 = CMOSD, Differential CMOS.

111 = CMOSP, Two single-ended CMOS outputs, in-phase.

010 and 110 are not used.

[3..2] 00 OUT0 power supply voltage: 00 = 01 = 1.8V, 10 = 2.5V, 11 = 3.3V.

[1..0] 11 Reserved.

12 0x0C

70Reserved.

6 0 Behavior when OUT0 is unused: 0 = Logic “0”, 1 = High impedance (tri-state).

5 1 OUT0 LP-HCSL slew rate control: 0 = Slow, 1 = Fast.

4 1 OUT0 LP-HCSL impedance control: 0 = 85Ωdifferential, 1 = 100Ωdifferential.

[3..0] 0100 OUT0 LP-HCSL amplitude control: 650mVpp at 0000 – 950mVpp at 1111.

13 0x0D

70Reserved.

[6..4] 101 OUT0 LVDS common mode control: 8μA at 000 – 11.5μA at 111.

30Reserved.

[2..0] 100 OUT0 LVDS amplitude control: 30μA at 000 – 65μA at 111.

Table 3. RAM Register Map (Cont.)

Decimal Hex

9FGV1005 Register Descriptions and Programming Guide

14 0x0E

7 1 Crystal oscillator LDO: 0 = Disabled, 1 = Enabled.

60Reserved.

[5..0] 000000

Crystal oscillator X1 pin capacitance: Cap (pF) = 7.98 + 0.442 × Bits[5..0].

See section Crystal Load Capacitance Registers for crystal oscillator load

capacitance configuration.

15 0x0F

7 1 Crystal oscillator circuit: 0 = Disabled, 1 = Enabled.

60Reserved.

[5..0] 000000 Crystal oscillator X2 pin capacitance: Cap (pF) = 7.98 + 0.442 × Bits[5..0].

16 0x10 [7..0] 83-hex Reserved.

17 0x11 [7..0] 1A-hex Reserved.

18 0x12 [7..0] 0C-hex Reserved.

19 0x13 [7..0] 80-hex Reserved.

20 0x14 [7..0] 00-hex Reserved.

21 0x15 [7..0] 02-hex Reserved.

22 0x16 [7..0] 96-hex Reserved.

23 0x17 [7..0] 00-hex Reserved.

24 0x18 [7..0] 00-hex Reserved.

25 0x19 [7..0] 00-hex Reserved.

26 0x1A

PLL, VCO band calibration start. Toggle to 0 and back to 1 to trigger a

calibration.

The calibration engages at the moment the bit moves from 0 to 1. The

calibration finds the optimum VCO band for the current VCO frequency.

Override VCO band: 0 = use calibrated VCO band, 1 = use VCO band value

in bits [5..0].

[5..0] 100000 VCO band value. See bit 6.

27 0x1B

7 1 Enable VCO: 0 = VCO disabled, 1 = VCO enabled.

6 1 Enable charge pump: 0 = CP disabled, 1 = CP enabled.

5 1 Enable PLL bias: 0 = PLL bias disabled, 1 = PLL bias enabled.

41Bypass3

rd pole in loop filter: 0 = Use 3rd pole, 1 = 3rd pole bypassed.

[3..0] 1100 Reserved.

28 0x1C [7..4] 1010 Loop filter R-zero value.

[3..0] 1111 Reserved.

29 0x1D [7..0] 00-hex Reserved.

Table 3. RAM Register Map (Cont.)

Decimal Hex

9FGV1005 Register Descriptions and Programming Guide

1To be able to read this info, you already need to know the device address.

2These two bits show the configuration number 0–3 that will be loaded from OTP into registers at power up. When changing these bits

through I2C you instruct the chip to load another configuration from OTP. This is useful for switching between OTP configurations when in

I2C mode. This method is also used to step through each configuration for reading back OTP contents.

Block Diagram

Figure 3. 9FGV1005 Block Diagram

Equations:

FVCO = FCRYSTAL × Feedback Divider (see register 0x1F).

FOUT0 = FOUT1 = FVCO / Integer Divider (see registers 0x21 and 0x22).

Limits:

FCRYSTAL: 10MHz–40MHz

FVCO: 2300MHz–2600MHz

Integer Output Divider: 8–4095

Feedback Divider: 12–255

30 0x1E [7..4] 0000 Reserved.

[3..0] 1010 Charge pump current, 0 to 750μA with step of 50μA.

31 0x1F [7..0] 24-hex PLL feedback divider value.

32 0x20 [7..0] 12-hex Reserved.

33 0x21 [7..0] 18-hex Integer output divider value, bits [7..0].

34 0x22 [7..4] 0000 Integer output divider value, bits [11..8].

[3..0] 0000 Reserved.

35 0x23 [7..0] 00-hex Reserved.

36 0x24 [7..0] 21-hex Reserved.

37 0x25

70Reserved.

6 1 Enable Integer output divide: 0 = disabled, 1 = enabled.

5 1 Enable crystal frequency doubler: 0 = disabled, 1 = enabled.

[4..3] 00 Reserved.

2 1 Integer output divide enable: 0 = disabled, 1 = enabled.

[1..0] 01 Reserved.

Table 3. RAM Register Map (Cont.)

Decimal Hex

9FGV1005 Register Descriptions and Programming Guide

Crystal Load Capacitance Registers

Registers 0x0E and 0x0F contain Crystal X1 and X2 Load capacitor settings that are used to add load capacitance to X1 and X2 (also

known as XIN and XOUT) respectively.

Figure 4. Crystal Oscillator Circuit

Ci1 and Ci2 are on-chip capacitors that are programmable.

Cs is stray capacitance in the PCB and Ce is external capacitors for frequency fine tuning or for achieving load capacitance values

beyond the range of the on-chip programmability. Consult the factory when adding Ce capacitors. The oscillator gain reduces with added

capacitance and there may be crystal oscillator startup issues when adding too much capacitance.

All these capacitors combined make the load capacitance for the crystal.

Capacitance on pin XIN or X1: Cx1 = Ci1 + Cs1 + Ce1.

Capacitance on pin XOUT or X2: Cx2 = Ci2 + Cs2 + Ce2.

Total Crystal Load Capacitance CL= Cx1 × Cx2 / (Cx1+Cx2).

For optimum balance and oscillator gain it is recommended to design Cx1 = Cx2. In that case CL= Cx1 / 2 = Cx2 / 2.

The capacitance per pin X1 or X2 is: Cap (pF) = 7.98 + 0.442 × Bits[5..0].

This includes an estimated Cs1 = Cs2 = 1.0pF.

When designing Cx1 = Cx2, the formula for CL is: CL(pF) = 3.99 + 0.221 × Bits[5..0].

The minimum CLvalue at Cx1 = Cx2 = '00 0000'-binary = 3.99pF.

The maximum CLvalue at Cx1 = Cx2 = '10 1111'-binary = 3.99 + 0.221 × 47 = 14.38pF

Example: For a crystal CLof 8pF, the registers can be programmed as follows:

CL(pF) = 3.99 + 0.221 × 18 = 7.97pF (nearest to 8.0pF).

So for CL= 8pF, the recommended settings are Cx1[5..0] = Cx2[5..0] = 18 or '01 0010'-binary.

Registers 0x0E = 0x0F = 92-hex (= '1001 0010' binary).

Xtal Oscillator

Cs1

C i1

C i

DISCLAIMER Integrated Device Technology, Inc. (IDT) and its affiliated companies (herein referred to as “IDT”) reserve the right to modify the products and/or specifications described herein at any time,

without notice, at IDT’s sole discretion. Performance specifications and operating parameters of the described products are determined in an independent state and are not guaranteed to perform the same

way when installed in customer products. The information contained herein is provided without representation or warranty of any kind, whether express or implied, including, but not limited to, the suitability

of IDT's products for any particular purpose, an implied warranty of merchantability, or non-infringement of the intellectual property rights of others. This document is presented only as a guide and does not

convey any license under intellectual property rights of IDT or any third parties.

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9FGV1005 Register Descriptions and Programming Guide

Revision History

Revision Date Description of Change

March 7, 2018 ▪Updated RAM Overview table.

▪Updated RAM Register Map table (addresses 14, 15, 30, and 34).

▪Updated Crystal Load Capacitance formulas.

October 11, 2017 Initial release.

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(Rev.1.0 Mar 2020)

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