Meiko Computing Surface CS-2 Manuale utente
Computing
Surface
The CS-2 Processor Module
S1002–10M128.02
The information supplied in this document is believed to be true but no liability is assumed for its use or for the
infringements of the rights of others resulting from its use. No licence or other rights are granted in respect of any
rights owned by any of the organisations mentioned herein.
This document may not be copied, in whole or in part, without the prior written consent of Meiko World Incor-
porated.
© copyright 1995 Meiko World Incorporated.
The specifications listed in this document are subject to change without notice.
Meiko, CS-2, Computing Surface, and CSTools are trademarks of Meiko Limited. Sun, Sun and a numeric suffix,
Solaris, SunOS, AnswerBook, NFS, XView, and OpenWindows are trademarks of Sun Microsystems, Inc. All
SPARC trademarks are trademarks or registered trademarks of SPARC International, Inc. Unix, Unix System V,
and OpenLook are registered trademarks of Unix System Laboratories, Inc. The X Windows System is a trade-
mark of the Massachusetts Institute of Technology. AVS is a trademark of Advanced Visual Systems Inc. Verilog
is a registered trademark of Cadence Design Systems, Inc. All other trademarks are acknowledged.
Circulation Control:
Meiko’s address in the US is:
Meiko
130 Baker Avenue
Concord MA01742
508 371 0088
Fax: 508 371 7516
Meiko’s address in the UK is:
Meiko Limited
650 Aztec West
Bristol
BS12 4SD
01454 616171
Fax: 01454 618188
Issue Status: Draft
Preliminary
Release X
Obsolete
i. Safety Precautions . . . . . . . . . . . . . . . . . . . . . . . . . . i
Federal Communications Commission (FCC) Notice. . . . i
General Precautions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ii
Lifting. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ii
1. Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2. Module Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Packing Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Unpacking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3. Installing the Processor Module . . . . . . . . . . . . . . . 7
Location . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Using the Meiko Beta Phase Controller . . 8
Power Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Power Connections. . . . . . . . . . . . . . . . . . . . . . . . 9
Fuses. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Removable Panels. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
External Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
At the Rear of the Power Supply Unit . . . 11
At the Rear of the Module . . . . . . . . . . . . 12
At the Front of the Module . . . . . . . . . . . . 12
External Indicators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Module Identification Number . . . . . . . . . . . . . . . . . . . . . 13
Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
4. Installing Processor Boards. . . . . . . . . . . . . . . . . . . 17
Installation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
MK401 Single-SPARC Board. . . . . . . . . . . . . . . . . . . . . . 18
Field Upgradeable Components . . . . . . . . . . . . . . 18
MBus Processor Modules. . . . . . . . . . . . . 19
SBus Modules. . . . . . . . . . . . . . . . . . . . . . 20
Memory. . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Boot ROM. . . . . . . . . . . . . . . . . . . . . . . . . 21
H8 ROM . . . . . . . . . . . . . . . . . . . . . . . . . . 21
NVRAM . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Fuses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
External Connections . . . . . . . . . . . . . . . . . . . . . . 21
Front Panel Connections. . . . . . . . . . . . . . 22
RS232 Connections. . . . . . . . . . . . . . . . . . 22
Adding SCSI Peripherals . . . . . . . . . . . . . . . . . . . 23
SCSI Termination . . . . . . . . . . . . . . . . . . . 23
External Indicators . . . . . . . . . . . . . . . . . . . . . . . . 24
MK405 Quad-SPARC Board. . . . . . . . . . . . . . . . . . . . . . . 24
Field Upgradeable Components . . . . . . . . . . . . . . 24
MBus Processor Modules. . . . . . . . . . . . . 25
Memory. . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Boot ROM. . . . . . . . . . . . . . . . . . . . . . . . . 27
H8 ROM . . . . . . . . . . . . . . . . . . . . . . . . . . 27
NVRAM . . . . . . . . . . . . . . . . . . . . . . . . . . 27
External Indicators . . . . . . . . . . . . . . . . . . . . . . . . 27
MK403 Vector Processor Board . . . . . . . . . . . . . . . . . . . . 28
Field Upgradeable Components . . . . . . . . . . . . . . 28
MBus/VPU Processor Modules . . . . . . . . 29
SBus Modules. . . . . . . . . . . . . . . . . . . . . . 29
Boot ROM. . . . . . . . . . . . . . . . . . . . . . . . . 29
H8 ROM . . . . . . . . . . . . . . . . . . . . . . . . . . 29
NVRAM . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Fuses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
External Connections . . . . . . . . . . . . . . . . . . . . . . 30
Front Panel Connections. . . . . . . . . . . . . . 30
RS232 Connections. . . . . . . . . . . . . . . . . . 31
External Indicators . . . . . . . . . . . . . . . . . . . . . . . . 31
5. Installing Backplane Boards. . . . . . . . . . . . . . . . . . 33
Installation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
MK511/2 Module Switch Cards . . . . . . . . . . . . . . . . . . . . 34
MK515 Module Control Card. . . . . . . . . . . . . . . . . . . . . . 34
Field Upgradeable Components . . . . . . . . . . . . . . 34
External Indicators . . . . . . . . . . . . . . . . . . . . . . . . 35
Reset Switch. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
External Connections . . . . . . . . . . . . . . . . . . . . . . 36
MK516 SCSI Cards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Field Upgradeable Components . . . . . . . . . . . . . . 36
6. Installing SCSI Devices . . . . . . . . . . . . . . . . . . . . . . 39
Module Disk Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Installing the Disk Devices. . . . . . . . . . . . . . . . . . 40
Fixing the Disk Device into the Carrier . . 40
Fixing the Carrier into the Processor Module 40
External Indicators . . . . . . . . . . . . . . . . . . 41
External SCSI Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
i
Safety Precautions i
Federal Communications Commission (FCC) Notice
Warning: Changes or modifications to this unit not expressly approved by
the party responsible for compliance could void the user’s authority to op-
erate the equipment.
NOTE: This equipment has been tested and found to comply with the limits
for a Class A digital device, pursuant to Part 15 of the FCC Rules. These lim-
its are designed to provide reasonable protection against harmful interfer-
ence when the equipment is operated in a commercial environment. The
equipment generates, uses, and can radiate radio frequency energy and, if
not installed and used in accordance with the instruction manual, may cause
harmful interference to radio communications. Operation of this equipment
in a residential area is likely to cause harmful interference in which case the
user will be required to correct the interference at his own expense.
Shielded cables must be used with this unit to ensure compliance with the
FCC Class A limits.
ii S1002–10M128.02
General Precautions
•Adhere strictly to the instructions and warnings provided in this
documentation.
•Do not push objects into the interior of the equipment through any openings.
Hazardous voltages and moving parts are present. Conductive objects could
cause electric shock, fire, or damage to the equipment.
•It is not permitted to make mechanical or electrical modifications to the
equipment. The manufacturer is not responsible for regulatory compliance of
equipment that has been modified. You may also invalidate your warranties if
you make unauthorised changes to your equipment.
•When connecting a visual display unit to your module your attention is drawn
to the instructions that are issued by the device manufacturer.
•Your module may contain disk devices. Your attention is drawn to the
instructions that are issued by the device manufacturers.
•A lithium battery is installed on many of the boards in the module — it is an
integral component of the non-volatile RAM (or NVRAM). Lithium batteries
are not customer replaceable. If they are mishandled there is a danger that they
may explode. Always consult Meiko if you suspect that the battery needs
replacing. Never dispose of lithium batteries in a fire or attempt to dismantle.
•Many of the electronic components fitted in the module are fragile or static
sensitive. They should only be handled by trained engineers. You must
observe anti-static precautions when handling boards or electronic devices.
•Operation of this equipment in a residential area may cause unacceptable
interference to radio and TV reception, requiring the operator to take whatever
steps are necessary to correct the interference.
Lifting
The module is heavy and must be lifted by two people or by using the Genie lift-
ing equipment that is supplied by Meiko (large multi-module systems only).
iii
When using the Genie fork lift you must first attach the two lift-clamp assemblies
to either side of the module. Unscrew the securing screw that holds the telescopic
section of the lift-clamp closed. Insert the rear locating pins into the holes at the
rear edge of the module (the open end of the box section should face the front of
the module). Align the front locating pins with the holes at the front of the mod-
ule and tighten the holding screw.
Locate the forks of the Genie lift into the two box sections in the lift clamps.
Raise the module by turning clockwise the handle on the Genie lift. Lower the
module by turning the handle anti-clockwise.
Warning – Your attention is drawn to the operating instructions for the Ge-
nie lift that are supplied by the lift’ s manufacturers.
•Genie fork lift, part number 73-FORK-GENIE.
•Module lifting gear, part number 65-MODULELIFT
iv S1002–10M128.02
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