GEM3 Module Hardware Integration Guide Version 0.1
North Pole Engineering
221 N 1st St, Minneapolis, MN 55401
www.npe-inc.com
612.305.0440
CONTENTS
1OVERVIEW AND KEY FEATURES .....................................................................................................4
1.1 FEATURES..............................................................................................................................................4
2SPECIFICATION ....................................................................................................................................5
2.1 SPECIFICATION SUMMARY .................................................................................................................... 5
3HARDWARE SPECIFICATIONS..........................................................................................................7
3.1 BLOCK DIAGRAMS AND PINOUT ...........................................................................................................7
3.2 PIN DEFINITIONS .................................................................................................................................. 8
3.3 ELECTRICAL SPECIFICATIONS .............................................................................................................10
3.3.1 ABSOLUTE MAXIMUM RATINGS................................................................................................................................. 10
3.3.2 RECOMMENDED OPERATING PARAMETERS .......................................................................................................... 10
4DESIGN CONSIDERATIONS..............................................................................................................10
4.1 HARDWARE.........................................................................................................................................10
4.1.1 VDD_NRF....................................................................................................................................................................... 10
4.1.2 UPDATING MODULE FIRMWARE............................................................................................................................... 10
4.1.3 UART HOST................................................................................................................................................................... 11
4.1.4 USB.................................................................................................................................................................................. 11
4.1.5 NFC.................................................................................................................................................................................. 12
4.1.6 RESET............................................................................................................................................................................... 12
5MODULE LAYOUT CONSIDERATIONS...........................................................................................13
6MECHANICAL INFORMATION.........................................................................................................15
7SOLDERING GUIDELINES.................................................................................................................15
8REGULATORY & STANDARDS INFORMATION ...........................................................................15
8.1 FCC &INDUSTRY CANADA..................................................................................................................15
8.1.1 FEDERAL COMMUNICATION COMMISSION (FCC) RADIATION EXPOSURE STATEMENT:........................ 15
8.1.2 FCC/IC LABELING REQUIREMENTS........................................................................................................................ 15
8.1.3 FCC WARNING:............................................................................................................................................................. 16
8.1.4 INDUSTRY CANADA (IC) WARNING: ....................................................................................................................... 16
8.2 CE........................................................................................................................................................17
8.3 BLUETOOTH QUALIFICATION .............................................................................................................19
9ORDERING DETAILS .........................................................................................................................19
10 FURTHER ASSISTANCE ..................................................................................................................19
