NXP Semiconductors UM10569 Manuale utente

UM10569

Store and transport requirements

Rev. 3.00 — 9 March 2015 User manual

Document information

Info Content

Keywords Storage, transport, shelf life, dry-baking, drying, dry-packing

Abstract This document describes the store and transport requirements of final

commercial and semi-finished products of NXP Semiconductors

User manual Rev. 3.00 — 9 March 2015 2 of 15

Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: [email protected]

NXP Semiconductors UM10569

Store and transport requirements

Revision history

Rev Date Description

v.3 20150309 third, enhanced revision

v.2 20140124 second revision

v.1 20120625 new user manual, first revision

User manual Rev. 3.00 — 9 March 2015 3 of 15

NXP Semiconductors UM10569

Store and transport requirements

1. Introduction

This specification describes the technical conditions of shelf life and transport of final

commercial and semi-finished products of NXP Semiconductors. Other aspects like sales,

warranty, legal and commercial issues are regulated by NXP’s “Terms and Conditions of

commercial Sale“, see Ref. 7 on page 13.

2. Objectives

It is essential that the quality of products entering store areas is maintained and that the

products are easily identified. The quality of stored products must not deteriorate by

additional handling while in store.

Transport conditions must be such that the quality and reliability of the product and its

packing shall not be harmed in any way.

3. Definitions

Bake to seal time — The maximum time after bake that components may be exposed to

ambient conditions prior to being sealed in MBBs.

Desiccant — An absorbent material used to maintain a low relative humidity.

ESD — ElectroStatic Discharge

FFC — Film Frame Carrier

Floor life — The permissible time period between removing the MBB and soldering.

HIC — Humidity Indicator Card.

IC — Integrated Circuit

MBB — Moisture Barrier Bag.

MSL — Moisture Sensitivity Level

PQ-box — The box for containing and protecting the prescribed Packing Quantity of final

product (also called Inner Box).

RH — Relative Humidity

Shelf life — The possible storage life before the product is used.

SMD — Surface-Mount Device

Transport — In this standard, transport includes the whole path and temporary storage

from the sending warehouse to the receiving point, which can be a warehouse or the

customer.

4. General conditions

Products have to be packed in a way that ensures protection against mechanical,

environmental and electrical influences during transport and storage.

Store and transport conditions should be such that the integrity of the product and its

packing are not harmed in any way.

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Store and transport requirements

5. Receiving inspection

Dry-packed packages should be inspected for a bag seal date on the caution or bar code

label to determine remaining shelf life. The bags should be inspected to verify that there

are no holes, gouges, tears, punctures, or openings of any kind that would expose either

the contents or an inner layer of a multilayer bag. If openings are found and the humidity

indicator card (HIC) indicates that the maximum humidity has been exceeded, then the

parts should be baked using the bake times of Table 3 or Table 4. This resets the floor life

if the parts to be used and shelf life if the parts are to be dry-packed.

6. Store conditions

Secure and clean store areas shall be provided to isolate and protect the products.

Conditions in the store areas shall be such that the quality of the products does not

deteriorate due to, among others, harmful gasses or electrical fields.

The following conditions have to be taken into account:

•Temperature

–Min. +8 C

–Max. +45 C

•Humidity

–Min. 25 %

–Max 75 %

–No condensation under any condition is allowed.

•Light intensity

–No direct sun light

7. Transport conditions

In the case of transporting, the following conditions have to be observed.

7.1 General transport conditions

During transport the packing and the products should be protected against extreme

temperatures, humidity and mechanical forces.

The following conditions have to be taken into account:

•Temperature

–Min. +8 C

–Max. +60 C

(Higher temperature causes a serious risk of deformation of the packing material

and lower temperature the risk of condensation within the package).

–In tropical conditions, the packing shall not be placed in direct sunlight.

•Humidity

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Store and transport requirements

–Direct contact of packing boxes with water is prohibited.

•Mechanical forces

–Transport must be done in such a way that the PQ-boxes are not deformed and

forces are not directly passed on to PQ-boxes.

•Time

–The total transport time should be as short as possible. When transport time

exceeds 5 days the transport conditions shall be the same as store conditions, or

the products have to be sealed with inclusion of a dry-agent.

7.2 Conditioned air transport

Air transport is possible with conditioned cargo rooms. This conditional air transport is

advised for all products, but mandatory for air transport of products in sealed bags, like dry

pack.

•Temperature

–Min. +8 C

–Max. +45 C

•Humidity

–Avg. 16 %

•Air pressure

–Min. 700 mbar

–Max. 1060 mbar

8. Shelf life conditions

8.1 Packed end products

The shelf life for packed end products is 4 years after the date code. This includes

encapsulated products in standard packing, encapsulated products in dry pack.

For products in dry pack, the dry conditions are guaranteed for one year (this is not shelf

life, see above). When the HIC shows a relative humidity of higher than 10 %, the

products have to be baked before use (see Section 10).

8.2 Wafers and bare die

Wafers and bare die have to be packed in dry pack, or stored under the following

conditions:

•Inert gas

•Dry air or dry nitrogen

•No sources of corrosive material such as halogenic contamination

•Temperature 18 C to 24 C

The shelf life for wafers or bare die is 3 years (excluding wafers with Au/Ge backside and

assuming condition of <60 % relative humidity) after diffusion process end (Fab. date

code).

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NXP Semiconductors UM10569

Store and transport requirements

The shelf life for products on FFC (Film Frame Carrier) is 6 months due to the FFC

material.

8.2.1 Maximum shelf life versus humidity

Parts of bare wafers and bare die products that are sensitive for aging are aluminum and

backside metal surfaces (e.g. Ti, Ni, Ag or AuGe). Shelf life of wafers and bare die with a

combination of given bond and back side material at different humidity levels are given in

Table 1.

[1] RH % should be monitored or evidence (humidity indicator card) should be available that RH % requirement was really met during the

storage period.

[2] The life time at such low humidity is limited only by the amount of desiccant added and the integrity of the MBB over time.

The shelf life time of bare wafer and bare die products is determined by the halogen (F, Cl,

Br) contamination level in the product environment and the humidity which affect the

degradation of aluminum bond pads. At low humidity, the halogen contamination has no

aging effect, but at higher humidity, the halogens become volatile.

Humidity is the most important aging factor in the aging of wafers with backside metal.

Additionally, gold contamination on Ti/Ni/Ag backside metal surface accelerates the aging

process.

Silver surfaces are very sensitive for sulphur contamination. MBB will be a barrier for

airborne sulphur contamination and therefore wafers packed in a sealed MBB are safe.

Table 1. Shelf life of wafers and bare die

The indicated humidity levels in the table should not be exceeded.

Relative humidity[1] Bond pad material Back side Technical shelf life

< 10 % all types all types > 15 years[2]

< 30 % all types all types 6 years

< 50 % Al all types (not AuGe) 4 years

< 50 % all types AuGe 1 year

< 60 % Al all types (not AuGe) 3 years

< 60 % Ag Ag 4 years

< 60 % Au AuAs > 15 years[2]

< 80 % Al all types 0.1 years

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NXP Semiconductors UM10569

Store and transport requirements

9. Floor life and bake to seal time

The floor life starts with opening the MBB. The floor life and the bake to seal time of IC

products are dependent on the MSL (see Table 2). If the bake to seal time is exceeded,

the products must be baked again.

[1] Products with MSL1 are not dry packed.

[2] Wafers and bare die are rated as MSL 1. They do not require baking but require dry packing to avoid

oxidation.

[3] Products that are moisture sensitive (MSL 2 through MSL 6) shall be baked prior dry-packed.

[4] Products of MSL 6 must be baked before use within 6 hours at the customer.

If partial lots are used, the remaining products must be resealed or placed in safe storage

within 1 hour of bag opening. If the bag opening time or the floor life has expired or an

excess moisture exposure happened, the products have to be backed prior dry-packing.

For information about storing in a dry atmosphere cabinet or a dry cabinet, see Ref. 4

“IPC/JEDEC J-STD-033C”.

10. Dry-baking and drying

Before sealing product devices in MBBs, the products must be dry. This can be done by

dry-baking or drying.

10.1 Dry-baking

Dry-bake conditions are:

•Bake temperature: +125 C + 0 C/5 C

•Bake time, see Table 3

–Packages, not mentioned in this table, are baked 5 times the package thickness

(in mm), see Table 4 and Ref. 4 “IPC/JEDEC J-STD-033C”

–The x’s in a package name in Table 3 cover all versions except specifically

mentioned versions

Table 2. Moisture Classification Level, floor life, and bake to seal time

Moisture Sensitivity

Level (MSL)

Ambient conditions Floor life (out of

bag time)

Bake to seal time

Temperature RH

1[1][2] 30 C90 % no limit no limit

2[3] 60 % 1 year 7 days

2a [3] 4 weeks

3[3] 168 hours 24 hours

4[3] 72 hours

5[3] 48 hours

5a [3] 24 hours

6[4] 6 hours no limit

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NXP Semiconductors UM10569

Store and transport requirements

Remark: Baking deteriorates the solderability; do not bake for longer and not more often

than required.

Table 3. Dry-bake time per package type

Bake temperature +125 C + 0 C/5 C.

Package family Dry-bake time in hours

SO 8

SSOP, HSOP, VSO 10

TSSOP, HTSSOP 5

HBCC 5

xxQFP packages 12

LQFP, HLQFP, TQFP, HTQFP 8

PLCC, HSSON 12

xxBGA packages, <40 40 mm210

xxBGA packages, 40 40 mm215

TFBGA, LBGA, LFBGA 5

HVQFN, HVSON 5

SOJ 24

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NXP Semiconductors UM10569

Store and transport requirements

10.2 Drying

Products, packed in tubes or tapes cannot be baked at 125 C and therefore must be

dried at lower temperatures, see Ref. 4 “IPC/JEDEC J-STD-033C”.

Table 4. Reference conditions for drying mounted or unmounted SMD packages according to Ref. 4 “IPC/JEDEC

J-STD-033C”

Package body MSL Bake at

+125 C + 10 C/0 C +90 C + 8 C/0 C

5 % RH

+40 C + 5 C/0 C

5 % RH

Exceeding floor life by

>72 hours 72 hours >72 hours 72 hours >72 hours 72 hours

Thickness 1.4 mm 2 5 hours 3 hours 17 hours 11 hours 8 days 5 days

2a 7 hours 5 hours 23 hours 13 hours 9 days 7 days

3 9 hours 7 hours 33 hours 23 hours 13 days 9 days

4 11 hours 7 hours 37 hours 23 hours 15 days 9 days

5 12 hours 7 hours 41 hours 24 hours 17 days 10 days

5a 16 hours 10 hours 54 hours 24 hours 22 days 10 days

Thickness >1.4 mm

2.0 mm

2 18 hours 15 hours 63 hours 2 days 25 days 20 days

2a 21 hours 16 hours 3 days 2 days 29 days 22 days

3 27 hours 17 hours 4 days 2 days 37 days 23 days

4 34 hours 20 hours 5 days 3 days 47 days 28 days

5 40 hours 25 hours 6 days 4 days 57 days 35 days

5a 2 days 40 hours 8 days 6 days 79 days 56 days

Thickness >2.0 mm

4.5 mm

2 2 days 2 days 10 days 7 days 79 days 67 days

2a 2 days 2 days 10 days 7 days 79 days 67 days

3 2 days 2 days 10 days 8 days 79 days 67 days

4 2 days 2 days 10 days 10 days 79 days 67 days

5 2 days 2 days 10 days 10 days 79 days 67 days

5a 2 days 2 days 10 days 10 days 79 days 67 days

BGA package

>17 mm 17 mm

or any stacked die

package

2 to 5a 96 hours as above per

package

thickness and

moisture level

not applicable as above per

package

thickness and

moisture level

not applicable as above per

package

thickness and

moisture level

User manual Rev. 3.00 — 9 March 2015 10 of 15

NXP Semiconductors UM10569

Store and transport requirements

11. Dry-packing

11.1 Material requirements

Moisture absorbing packing materials that are used in the MBB (e.g. the cardboard guard

band for reels and the Humidity Indicator or HIC), shall be dry, before packing in the

moisture barrier bag. Moisture absorbing packing material should therefore be kept dry in

a drying box or an oven, with sufficient capacity to store (and dry) the required packing

material for at least 24 hours, before use.

Remark: Exposure of the desiccant, HIC and paper guard band to the environment shall

be for no more than 5 minutes, before packing and sealing the MBB.

11.1.1 Desiccant requirements

•The desiccant must meet Ref. 5 “MIL-D-3464E”, Type II. The desiccant shall be

dustless, noncorrosive, and absorbent to the amounts specified in the standard.

•The desiccant capacity at 10 % RH and 25 C per unit shall be ≥2.5 grams. The

desiccant capacity at 10 % RH and 25 C per unit shall be provided by desiccant

supplier.

•If desiccant capacity is <2.5 grams, then desiccant amounts shown in Table 5 and

Table 6 must be recalculated, see Ref. 4 “IPC/JEDEC J-STD-033C”.

•The desiccant type shall be bentonite clay.

•The desiccant bag shall be moisture permeable Tyvek.

•Desiccant is typically supplied in packs containing two units but this is not a

requirement and different size desiccant packs can be used.

The desiccant shall be stored in closed containers as received. After taking out the

required quantity of desiccant, the container shall be closed immediately. A humidity

indicator with a 5 % RH measuring spot shall be used in the desiccant container to check

the humidity. Once this spot is showing another color than is specified for “dry”, the

desiccant shall be reactivated (baked) first, in an oven according to suppliers

recommendation before using. Desiccants made of so-called Molecular Sieve, cannot be

reactivated.

Table 5. Desiccant requirement for wafer pack

MBB size (cm) Typical wafer size (mm) Total units of desiccant required

30 37 10 5

36 38 125 5

40 48.3 125; 150 7

50.5 77.5 200 12

76 82 300 19

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