Panasonic KX-T7603X Manuale utente

ORDERNO. KMS0303669C8

Add on KeyModule

KX-T7603X

(for Asia, MiddleNearEast, Africa, Oceania, LatinAmerica, Russia,

Europe)

Unauthorizedcopying and distribution isaviolation oflaw.

IMPORTANT INFORMATIONABOUT LEAD FREE, (PbF),

SOLDERING

Ifleadfree solderwas usedinthe manufacture of this productthe printedcircuitboards will be

markedPbF.

Standardleaded, (Pb), soldercanbe usedas usual on boards without the PbF mark.

Whenthis mark does appearplease readand followthe special instructions describedinthis

manual on the use of PbF and howitmight be permissible to use Pbsolderduring service and

repairwork.

1. ABOUTLEADFREE SOLDER(PbF:Pbfree)

Note:

Inthe information below, Pb, the symbol forleadinthe periodic table of elements, will referto

standardsolderorsolderthatcontains lead.

We will use PbF whendiscussing the leadfree solderusedinourmanufacturing process which

is made from Tin, (Sn), Silver, (Ag), and Copper, (Cu).

This model, and others like it, manufacturedusing leadfree solderwill have PbF stampedon

the PCB. Forservice and repairwork we suggestusing the same type of solderalthough, with

some precautions, standardPbsoldercanalsobe used.

Caution

-PbF solderhas amelting pointthat is50° ~70° F, (30° ~40°C)

higherthanPbsolder. Please use asoldering iron with

temperaturecontrol and adjust itto700° ±20° F, (370° ±10°C). In

case ofusing high temperaturesoldering iron, please becareful

nottoheat too long.

-PbF solderwill tend tosplashifitisheatedmuchhigherthanits

melting point, approximately1100°F, (600°C).

-Ifyou must use Pbsolderon aPCB manufacturedusing PbF

solder, removeas muchoftheoriginal PbF solderas possibleand

besurethat anyremaining ismeltedprior toapplying thePb

solder.

-Whenapplying PbF soldertodoublelayeredboards, please check

thecomponentsidefor excess whichmayflowontotheopposite

side(See figure, below).

1.1. SUGGESTEDPbF SOLDER

There are several types of PbF solderavailable commercially. While this productis

manufacturedusing Tin, Silver, and Copper,

(Sn+Ag+Cu), you canalsouse Tinand Copper, (Sn+Cu), orTin, Zinc, and Bismuth, (Sn+Zn+Bi).

Please check the manufac

turer’s specific instructions forthe melting points of theirproducts and anyprecautions for

using theirproductwith other

materials.

The following leadfree (PbF) solderwire sizes are recommendedforservice of this product:

0.3mm, 0.6mm and 1.0mm.

1.2. HOWTO RECOGNIZE THATPbFREE SOLDERIS USED

PbF is stampedto showthatPbfree solderis used. (See the figure below.)

2. FORSERVICE TECHNICIANS

ICs and LSIs are vulnerable to static electricity.

Whenrepairing, the following precautions will helpprevent recurring malfunctions.

1. Covertheplasticparts boxes withaluminum foil.

2. Ground thesoldering irons.

3. Use aconductivemat on theworktable.

4. DonottouchICor LSI pinswithbarefingers.

3. SPECIFICATIONS

Jacks: TELJack

Dimensions: Low

Angle:

High

Angle:

255 (D)mm [Operate]×47 (W)mm ×94 (H)mm

206 (D)mm [Operate]×47 (W)mm ×178 (H)mm

213 (D)mm [Base]

Weight: 210g

Design and specifications are subjectto change without notice.

4. INSTALLING

ForKX-T7633 / KX-T7636

The Add-on KeyModule has 12 CObuttons. These buttons are usedto seize anoutside line,

make a call using One-touchDialing, oraccess certainfeatures.

1Openthe cover.

2Attachthe KX-T7603 to your

telephone with screws.

3 Insertthe flatcable into the

connector.

4 Close the cover.

5. DISASSEMBLY INSTRUCTIONS

1. Remove TwoScrews (A).

2. Remove the ConnectPlate.

3. Remove Screw(A).

4. Remove the Bottom Cabinetand Top Cabinet

(Base).

5. Remove TwoScrews (A).

6. Remove the Bottom Cabinet(Oper).

7. Remove the MainBoardfrom the Top Cabinet.

6. HOWTO REPLACE AFLATPACKAGE IC

6.1. PREPARATION

-PbF (:Pbfree) Solder

-Soldering Iron

TipTemperatureof700°F±20°F(370°C±10°C)

Note:Werecommend a30 to40 Watt soldering iron. Anexpert

maybeabletouse a60 to80 Watt iron wheresomeonewithless

experience couldoverheat and damagethePCB foil.

-Flux

RecommendedFlux:SpecificGravity0.82.

TypeRMA(lowerresidue, non-cleaning type)

Note:See ABOUT LEAD FREE SOLDER (PbF: Pb free) ().

6.2. PROCEDURE

1. Tack theflat pack ICtothePCB bytemporarilysoldering two

diagonallyopposite pinsinthecorrect positionson thePCB.

Be certaineachpinis locatedoverthe correctpadon the PCB.

2. Applyfluxtoall ofthepinson theIC.

3. Being careful tonotunsolderthetack points, slidethesoldering

iron along thetipsofthepinswhilefeeding enough soldertothe

tipsothat itflowsunderthepinsas theyareheated.

6.3. REMOVING SOLDERFROMBETWEENPINS

1. Add asmall amountofsoldertothebridgedpins.

2. Withahotiron, use asweeping motion along theflat partofthe

pintodrawthesolderfrom betweentheadjacentpads.

7. TROUBLESHOOTINGGUIDE

CROSS REFERENCE:

WAVEFORM ()

8. BLOCK DIAGRAM

9. CIRCUITOPERATIONS

9.1. LEDCIRCUITAND KEY INPUTCIRCUIT

CircuitOperation:

Adrive pulse wave, as inFig.1, is output byIC1. Thatsignal goes through the drive digital

transistorand connects the keybutton and LED cathode. Bypressing the key, the drive pulse

wave is input to Pin9~Pin11. Inorderto light the appropriate LED, the LED control portis turned

ON. ThatresultLED is litbythe pulse Driver.

10. ICDATA

Indice

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