Panasonic KX-TS600MXB Manuale utente

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KX-TS600MXB

KX-TS600MXW

Integrated Telephone System

White Version

(for Asia, Middle Near East and other areas)

Telephone Equipment

ORDER NO. KM40509874CE

1 ABOUT LEAD FREE SOLDER (PbF: Pb free) 3

1.1. Suggested PbF Solder 3

1.2. How to recognize that Pb Free solder is used 4

2 FOR SERVICE TECHNICIANS 4

3 CAUTION 4

4 OPERATING INSTRUCTIONS 5

4.1. Battery 5

4.2. Location of Controls 7

4.3. Display 8

4.4. Connection 9

4.5. Dial Lock 11

4.6. Troubleshooting 12

5 DISASSEMBLY INSTRUCTIONS 14

6 TROUBLESHOOTING GUIDE 15

6.1. Service Hints 15

6.2. Pulse Dialing Problems 15

6.3. Tone Dialing Problems (Handset) 16

6.4. No Ringing Sound When Ring Signal is Input 16

7 BLOCK DIAGRAM 17

8 CIRCUIT OPERATION 18

8.1. Bell Detector Circuit 18

8.2. Line Interface 18

8.3. MODULE BLOCK DIAGRAM 18

8.4. Caller ID Detect Circuit 21

9 BLOCK DIAGRAM 22

9.1. IC903 22

9.2. CPU DATA (IC903) 23

9.3. RINGER IC (IC1) 25

9.4. EEPROM (IC802) 26

9.5. Speakerphone IC Data (IC601) 27

10 MODULE BLOCK DIAGRAM 28

10.1. LCD MODULE BLOCK 28

10.2. CONNECTOR PIN ASSIGNMENT 28

11 HOW TO REPLACE THE FLAT PACKAGE IC 29

11.1. PREPARATION 29

11.2. FLAT PACKAGE IC REMOVAL PROCEDURE 29

11.3. FLAT PACKAGE IC INSTALLATION PROCEDURE 30

11.4. BRIDGE MODIFICATION PROCEDURE 30

12 CABINET AND ELECTRICAL PARTS 31

13 ACCESSORIES AND PACKING MATERIALS 32

14 TERMINAL GUIDE OF THE ICs, TRANSISTORS AND DIODES

15 REPLACEMENT PARTS LIST 34

15.1. Base Unit 34

16 FOR SCHEMATIC DIAGRAM 39

17 SCHEMATIC DIAGRAM (MAIN) 40

18 SCHEMATIC DIAGRAM (OPERATION) 42

19 CIRCUIT BOARD (MAIN) 43

19.1. Component View 43

19.2. Flow Solder Side View 44

20 CIRCUIT BOARD (OPERATION) 45

20.1. Component View 45

20.2. Flow Solder Side View 46

Note:

Because CONTENTS 4 is the extract from the Operating Instructions of this model, it is subject to change without notice. You can

download and refer to the original Operating Instructions on TSN Server for further information.

CONTENTS

Page Page

KX-TS600MXB / KX-TS600MXW

1 ABOUT LEAD FREE SOLDER (PbF: Pb free)

Note:

In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that

contains lead.

We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),

Silver (Ag), and Copper (Cu).

This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair

work we suggest using the same type of solder although, with some precautions, standard Pb solder can also be used.

Caution

• PbF solder has a melting point that is 50°F ~70°F (30°C ~ 40°C) higher than Pb solder. Please use a soldering iron with

temperature control and adjust it to 700°F ± 20°F (370°C ± 10°C). In case of using high temperature soldering iron, please

be careful not to heat too long.

• PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100°F (600°C).

• If you must use Pb solder on a PCB manufactured using PbF solder, remove as much of the original PbF solder as possible

and be sure that any remaining is melted prior to applying the Pb solder.

• When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the

opposite side (See the figure below).

1.1. Suggested PbF Solder

There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper

(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu) or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the manufac

turer’s specific instructions for the melting points of their products and any precautions for using their product with other

materials. The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3 mm, 0.6 mm and

1.0 mm.

KX-TS600MXB / KX-TS600MXW

1.2. How to recognize that Pb Free solder is used

(Example: Operation P.C.B.)

CN801

MIC

PQUP11371Z

PbF

Marked

(Component View)

Note:

The location of the “PbF” mark is subject to change without notice.

2 FOR SERVICE TECHNICIANS

ICs and LSIs are vulnerable to static electricity.

When repairing, the following precautions will help prevent recurring malfunctions.

1.Cover the plastic parts boxes with aluminum foil.

2.Ground the soldering irons.

3.Use a conductive mat on the worktable.

4.Do not touch IC or LSI pins with bare fingers.

3 CAUTION

1.Danger of explosion if battery is incorrectly replaced.

2.Replace only with the same or equivalent type recommended by the manufacturer.

3.Dispose of used batteries according to the manufacture’s Instructions.

KX-TS600MXB / KX-TS600MXW

4 OPERATING INSTRUCTIONS

4.1. Battery

4.1.1. Installing the Batteries

KX-TS600MXB / KX-TS600MXW

4.1.2. Battery Replacement

KX-TS600MXB / KX-TS600MXW

4.2. Location of Controls

KX-TS600MXB / KX-TS600MXW

4.3. Display

KX-TS600MXB / KX-TS600MXW

4.4. Connection

4.4.1. Connecting the Handset/Telephone Line Cord

KX-TS600MXB / KX-TS600MXW

4.4.2. Connecting a Communication Device

KX-TS600MXB / KX-TS600MXW

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