Quectel LCC Series Manuale utente

Module Secondary SMT

User Guide

LCC/LGA Module Series

Rev. Module_Secondary_SMT_User_Guide_V2.5

Date: 2019-03-11

Status: Released

www.quectel.com

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Our aim is to provide customers with timely and comprehensive service. For any

assistance, please contact our company headquarters:

Quectel Wireless Solutions Co., Ltd.

7th Floor, Hongye Building, No.1801 Hongmei Road, Xuhui District, Shanghai 200233, China

Tel: +86 21 5108 6236

Email: [email protected]om

Or our local office. For more information, please visit:

http://www.quectel.com/support/sales.htm

For technical support, or to report documentation errors, please visit:

http://www.quectel.com/support/technical.htm

Or email to: support@quectel.com

GENERAL NOTES

QUECTEL OFFERS THE INFORMATION AS A SERVICE TO ITS CUSTOMERS. THE INFORMATION

PROVIDED IS BASED UPON CUSTOMERS’ REQUIREMENTS. QUECTEL MAKES EVERY EFFORT

TO ENSURE THE QUALITY OF THE INFORMATION IT MAKES AVAILABLE. QUECTEL DOES NOT

MAKE ANY WARRANTY AS TO THE INFORMATION CONTAINED HEREIN, AND DOES NOT ACCEPT

ANY LIABILITY FOR ANY INJURY, LOSS OR DAMAGE OF ANY KIND INCURRED BY USE OF OR

RELIANCE UPON THE INFORMATION. ALL INFORMATION SUPPLIED HEREIN IS SUBJECT TO

CHANGE WITHOUT PRIOR NOTICE.

THE INFORMATION CONTAINED HERE IS PROPRIETARY TECHNICAL INFORMATION OF

QUECTEL WIRELESS SOLUTIONS CO., LTD. TRANSMITTING, REPRODUCTION, DISSEMINATION

AND EDITING OF THIS DOCUMENT AS WELL AS UTILIZATION OF THE CONTENT ARE

FORBIDDEN WITHOUT PERMISSION. OFFENDERS WILL BE HELD LIABLE FOR PAYMENT OF

DAMAGES. ALL RIGHTS ARE RESERVED IN THE EVENT OF A PATENT GRANT OR

REGISTRATION OF A UTILITY MODEL OR DESIGN.

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About the Document

History

Revision

Date

Author

Description

1.0

2012-08-28

Gavin HOU

Initial

2.0

2013-08-26

Gavin HOU

Added the description of stencil-making in Chapter 4.2

2.1

2013-12-19

Gavin HOU

Modified Figure 3: Inward Shrinking and Outward Moving

2.2

2015-11-23

Meisy MEI

Added the description of stencil-making on UC/EC/GC

series in Chapter 4.2

2.3

2017-03-08

Alain HUANG

1. Added the description of stencil design requirements

for M66/M66-DS/MC60/L70-R/

L70-RL/L76-L/L76B/L80-R/L86/L96/EC20 R2.0/

EC21/EC25/EG91/EG95/BG96/FC10/FC20/SC10/

SC20/SG30/AG35 modules in Chapter 4.2.

2. Added desoldering and repair instructions in Chapter

5 and 6.

2.4

2018-06-02

Rowan WANG/

Alain HUANG

1. Updated the MSL rating of Quectel modules into 3.

2. Updated stencil design requirements in Chapter 4.2.

3. Optimized the recommended reflow soldering

requirements and thermal profile in Chapter 4.4.

2.5

2019-03-11

Alain HUANG

1. Deleted the tray packing in the packing methods

(Figure 2) in Chapter 2.2.

2. Updated the soldering requirements in Chapter 3.2.

3. Updated stencil design requirements in Chapter 4.2.

4. Updated the max temperature of reflow zone in

Chapter 4.4.

 LCC/LGA Module Series 
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Content 
About the Document...................................................................................................................................2 
Content.........................................................................................................................................................3 
Table Index...................................................................................................................................................4 
Figure Index.................................................................................................................................................5 
1Introduction..........................................................................................................................................6 
2Information about Modules.................................................................................................................7 
2.1. Surface-Mount Packaging Type...................................................................................................7 
2.2. Packing Methods..........................................................................................................................7 
3Requirements on Chip Mounter.........................................................................................................8 
3.1. Chip Mounter................................................................................................................................8 
3.2. Soldering Requirements ..............................................................................................................8 
4Attentions for Manufacturing .............................................................................................................9 
4.1. MSL and Moisture-proof Requirement.........................................................................................9 
4.2. Stencil Design Requirements.....................................................................................................10 
4.3. Mounting Process ......................................................................................................................18 
4.3.1. Load Materials..................................................................................................................18 
4.3.2. Automatic Placement.......................................................................................................19 
4.4. Reflow Soldering........................................................................................................................20 
5Desoldering ........................................................................................................................................22 
6Repair Instructions............................................................................................................................24 
7Appendix Reference..........................................................................................................................25 
 
 

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Table Index

TABLE 1: STENCIL DESIGN REQUIREMENTS .............................................................................................. 10

TABLE 2: RECOMMENDED THERMAL PROFILE PARAMETERS ................................................................. 20

TABLE 3: HEAT GUN DESOLDERING REQUIREMENTS............................................................................... 22

TABLE 4: TERMS AND ABBREVIATIONS........................................................................................................ 25

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Figure Index

FIGURE 1: TAPE & REEL PACKING .................................................................................................................. 7

FIGURE 2: HUMIDITY INDICATOR CARD......................................................................................................... 9

FIGURE 3: STEP-UP STENCILAREA.............................................................................................................. 18

FIGURE 4: AUTOMATIC PLACEMENT ............................................................................................................ 19

FIGURE 5: FIRST PIN AND MOUNTED PICTURE.......................................................................................... 19

FIGURE 6: RAMP-SOAK-SPIKE REFLOW PROFILE...................................................................................... 20

FIGURE 7: REMOVE MODULE........................................................................................................................ 23

FIGURE 8: MODULE SOLDERING QUALITY INSPECTION........................................................................... 23

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1Introduction

This document describes the process of Quectel modules’ secondary SMT and desoldering. It is

applicable to all Quectel modules in LCC or LGA form factor.

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2Information about Modules

2.1. Surface-Mount Packaging Type

Quectel modules adopt LCC or LGA package.

2.2. Packing Methods

Quectel provides tape and reel pack as shown in the following figure.

Figure 1: Tape & Reel Packing

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3Requirements on Chip Mounter

3.1. Chip Mounter

⚫Feeder: Support auto tray feeder and auto reel feeder.

⚫Image processing: Optical plummet centering.

⚫Diameter of nozzle: Select the suitable nozzle according to the module size.

The recommended diameter of nozzle should be not less than 40% of the module’s shorter side. For

example, if the module size is 25mm×20mm, the nozzle diameter should be 8mm at least.

3.2. Soldering Requirements

1. It is recommended to use reflow soldering equipment with eight zones at least. For Quectel LTE,

LPWA, Automotive and Smart series modules, reflow soldering equipment with at least ten zones is

recommended.

2. In a lead-free reflow oven, the peak temperature of the actual solder joints on the component side of

an LGAmodule should be greater than 238°C , and the temperature of fixtures is recommended to be

240-245°C to avoid cold solder joints on LGAmodules.

NOTE

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4Attentions for Manufacturing

4.1. MSL and Moisture-proof Requirement

Quectel SMD module is sensitive to moisture absorption. According to IPC-JEDEC standard, the moisture

sensitive level (MSL) of Quectel SMD modules is defined as “3”. Please make sure the package is intact

before using. After opening the package, please confirm the status of humidity indicator card in the

vacuum-sealed package. To prevent the module from permanent damage, baking before reflow soldering

is required if any circumstance below occurs:

⚫Humidity indicator card: At least one circular indicator is no longer blue.

⚫The seal is open and the module is exposed to air for more than 168 hours.

Normal Not blue

Figure 2: Humidity Indicator Card

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