Version 1.0 - /2011
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1 ESD Protection
SEMITRANS®IGBT modules are electrostatic sensitive devices. All modules SEMITRANS®2,3 and 4 are
supplied with ESD protection via a conductive connection between the gate and emitter terminals. This
connection should be kept intact until the driver has been connected.
Module assembly must be carried out by qualified staff wearing conductive grounded bracelets at ESD
protected, grounded workstations.
2 Heat sink specifications
Preparation, surface specifications
In order to ensure good thermal contact and to obtain the thermal contact resistance values specified in
the datasheets, the contact surface of the heat sink must be clean and free from dust particles, as well as
fulfilling the following mechanical specifications:
♦The heat sink must be free from grease and particles
♦Unevenness of heat sink mounting area must be ≤50 µm per 100 mm (DIN EN ISO 1101)
♦Roughness “Rz” ≤10 µm (DIN EN ISO 4287)
♦No steps > 10 µm (DIN EN ISO 4287)
Fig. 1 Heat sink surface specifications
3 Thermal compound
Before assembly onto the heat sink, the module baseplate or the contact surface of the heat sink is to be
evenly coated with a thin layer (50µm – 100µm) of a thermal compound such as P12 from WACKER
CHEMIE or silicone-free paste HTC from ELECTROLUBE.
SEMIKRON recommends using screen printing to apply thermal paste. In certain cases a hard rubber
roller might be suitable for the application of thermal paste.
Rz
10 µm
> 10 µm
Heat sink
50 µm per 100 mm
Беларусь г.Минск тел./факс 8(017)200-56-46
Предлагаем продукцию SEMIKRON идругие ЭЛЕКТРОННЫЕ КОМПОНЕНТЫ (радиодетали) СО СКЛАДА ИПОД ЗАКАЗ
www.fotorele.net
Беларусь г.Минск тел./факс 8(017)200-56-46
