4
4.8 Event/TimeSync inputs ......................................................................................... 23
4.9 PPS output.............................................................................................................. 24
4.10 General Purpose Output (GPx) ............................................................................ 24
4.11 LEDs......................................................................................................................... 25
4.12 Standby................................................................................................................... 25
4.13 RTC........................................................................................................................... 27
5MOSAIC INTEGRATION.............................................................................................. 28
5.1 Minimal Design ...................................................................................................... 28
5.1.1 Single-Antenna Modules ...................................................................................... 29
5.1.2 Dual-Antenna Modules ........................................................................................ 30
5.2 Electrical Recommendations ............................................................................... 30
5.3 Decoupling.............................................................................................................. 31
5.4 Power States .......................................................................................................... 31
5.5 Layout Recommendations ................................................................................... 32
5.5.1 Coplanarity............................................................................................................ 32
5.5.2 Power..................................................................................................................... 32
5.5.3 Antenna Inputs ..................................................................................................... 32
5.5.4 Avoiding Self-Interference.................................................................................... 33
6PRODUCT HANDLING................................................................................................ 34
6.1 ESD Precautions..................................................................................................... 34
6.2 ROHS/WEEE NOTICE............................................................................................... 34
6.3 Packaging ............................................................................................................... 35
6.3.1 Packing List Label.................................................................................................. 36
6.3.2 MSL Level Label..................................................................................................... 36
6.4 Storage.................................................................................................................... 37
6.4.1 Note for Small Quantities .................................................................................... 37
6.5 Sticker and Identification..................................................................................... 37
6.6 Soldering................................................................................................................. 38
6.6.1 Solder Mask........................................................................................................... 38
6.6.2 Reflow Profile ........................................................................................................ 38
7DEVELOPMENT KIT .................................................................................................... 40
